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Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.125''
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Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$447.00
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 Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.125''

CAS No.

1314‑13‑2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

ZnO (black granules) (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 81.38 g/mol

Melting Point

~1975 °C

Boiling Point

~2360 °C

Density

  ~5.61 g/cm³

Product Codes

NCZ-1456K
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Ytterbium Oxide (Yb2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125”

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$447.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250”

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$447.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer.

Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 3'', Thickness: 0.250''
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Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 3”, Thickness: 0.250”

$446.00
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 Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 3'', Thickness: 0.250''

CAS No.

7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 28.0855 g/mol

Melting Point

1,414 °C

Boiling Point

 3,265 °C

Density

  2.33 g/cm³

Product Codes

NCZ-1732K
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Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in 2-Propanol, Size: 12 nm, Anatase, 22 wt%

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Price range: $83.00 through $446.00
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30 ml/76 € 60 ml/134 € 120 ml/245 € 500 ml/405 € Please contact us for quotes on larger quantities !!!

Titanium Dioxide (TiO2) Nanopowder/Nanoparticles Dispersion in 2-Propanol

Size: 12 nm, Anatase, 22 wt%

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Tin Oxide (SnO2) Nanopowder/Nanoparticles, High Purity: 99.87%, Size: 30-60 nm

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Price range: $27.00 through $446.00
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5 grams/24 € 25 grams/42 € 100 grams/71 € 500 grams/231 € 1000 grams/394 €
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Tin Oxide (SnO2) Nanopowder/Nanoparticles

High Purity: 99.87%, Size: 30-60 nm

Technical Properties:

Purity (%) 99.87
Morphology spherical
Average Particle Size (nm) 30-60
Specific Surface Area (m2/g) 20
Bulk Density (g/cm3) <0.5
True Density (g/cm3) 7,2
Elemental Analysis (%) Al Fe Ca Mg Na
0.0001 0.001 0.02 0.01 0.002

Applications:

Tin oxide nanoparticles have application in electronic devices. It is used in liquid crystal displays, optoelectronic devices, solar cells, gas sensors, and resistors. It is also used in anti-static coatings, and energy conserving coatings. It has applications in catalysis. It is used in transparent heating elements.
Mesophase pitch(Petroleum, Carbon foam grade) (277575)
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Mesophase pitch(Petroleum, Carbon foam grade) (277575)

$445.00
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Mesophase pitch(Petroleum, Carbon foam grade) (277575)
 
Softening point Content of mesophase Coking value Ash
310-375°C >95% >88% 0.01%
    Product Codes- NCZ-2673K
Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 8'', Thickness: 0.125''
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Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125”

$445.00
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 Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 8'', Thickness: 0.125''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

  8.90 g/cm³

Product Codes

NCZ-1866K
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Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”

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$445.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 8”, Thickness: 0.125”

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$445.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Molybdenum (Mo) Micron Powder, Purity: 99.99 %, Size: 1 µm

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Price range: $54.00 through $445.00
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25 grams/48 € 100 grams/98 € 500 grams/295 € 1000 grams/395 €  
Please contact us for quotes on larger quantities !!!

Molybdenum (Mo) Micron Powder

Purity: 99.99 %, Size: 1 µm

Technical Properties:

PURITY

99.99 %
PARTICLE SIZE

1 µm
CAS

7439-98-7
MELTING POINT

2610 °C
BOILING POINT

5560 °C
CRYSTAL STRUCTURE

Cubic, Body Centered
DENSITY                                         8.2 g/cm³
COEFF. OF EXPANSION @ 20ºC

5.1 x 10⁻⁶
ELECTRIC RESISTIVITY

5.17 microhm-cm
FORM  

Powder
APPLICATIONS

Aerospace Alloys Electronics Metal Injection Molding
                               
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Sulphur (S) Micron Powder Purity: 99.9%, Size: 325 mesh

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Price range: $31.00 through $445.00
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5 grams/12 € 25 grams/28 €                         
100 grams/79 €                     
500 grams/232 €                    
1000 grams/395 €

Purity: 99.9%, Size: 325 mesh

Sodium Hyaluronate(powder, Injection grade , ≥95%) (338644)
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Sodium Hyaluronate(powder, Injection grade , ≥95%) (338644)

$443.00
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Sodium Hyaluronate(powder, Injection grade , ≥95%) (338644)

  Specifications
Test Items Standard
Appearance White powder
Hyaluronic Acid 95.0%--105.0%
Molecular weight (0.5-1.0)x106
pH 5.0-7.5
Chlorides ≤0.5
600nm.The optical absorption 1-300 ＜0.01
260 nm optical absorption 1-300 ＜0.5
Loss on drying ≤10%
Protein ≤0.05%
Iron ≤10ppm
Bacterial counts ≤10cfu/g
Heavy metals ＜3ppm
cadmium ＜1ppm
mercury ＜0.1 ppm.
Endotoxin ≤0.05eu/mg
Sterile Test Complies
    Product Codes- NCZ-2705K
Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.250''
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Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250”

$443.00
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 Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.250''

CAS No.
 1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 101.96 g/mol

Melting Point

 ~2,072 °C

Boiling Point

~2,977 °C

Density

 ~3.97–3.98 g/cm³

Product Codes

NCZ-2543K
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Boron (B) Nanopowder/Nanoparticles , APS:100 nm, Purity:99.55+%

Price range: $38.00 through $443.00
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Boron (B) Nanopowder/Nanoparticles , APS:100 nm, Purity:99.55+% PRODUCT PROPERTIES
Boron Nanopowder Value Units
Particle Size 100 nm
Appearance Brown-Black Powder
Density 3.58 g/cm³
Melting Point 2400 °C
Boiling Point 2700 °C
Molecular Weight 10.81
Bulk Density 1.73 g/cm3
True Density 2.46 g/cm3
Crystal Structure Hexagonal
  CERTIFICATE OF ANALYSIS (%)
Al Fe Ca Mg Cu Mn Na Co Ni Si
0.01 0.01 0.01 0.04 0.01 0.01 0.01 0.01 0.01 0.01
Pb K N C S O B
0.01 0.01 0.01 0.04 0.06 0.2 99.55+%
 
Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 3'', Thickness: 0.250''
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Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250”

$442.00
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 Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 3'', Thickness: 0.250''

CAS No.
12058-85-6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 157.87 g/mol

Melting Point

  Approx. 1400 °C (decomposes)

Boiling Point

N/A

Density

  ~4.7 g/cm³

Product Codes

NCZ-2358K
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Silver Nanoparticles/Nanopowder (Ag, 99.9% 200-400 nm)

Price range: $58.00 through $442.00
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$58/5g $100/10g $165/25g $442/100g

Product 

Silver Nanoparticles/Nanopowder (Ag, 99.9% 200-400 nm)

CAS No.

24304-00-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

200-400 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

40.982 g/mol

Melting Point

2200 °C

Boiling Point

2517 °C

Density

3.3 g/cm³

Product Codes

NCZ-1006K
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Silver Nanoparticles/Nanopowder ( Ag, 99.9% 50-60 nm)

Price range: $60.00 through $442.00
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$60/5g
$100/10g $165/25g $442/100g
 

Product 

Silver Nanoparticles/Nanopowder ( Ag, 99.9% 50-60 nm)

CAS No.

24304-00-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

50~60nm (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

40.982 g/mol

Melting Point

2200 °C

Boiling Point

2517 °C

Density

3.3 g/cm³

Product Codes

NCZ-1004K
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Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125”

, , , ,
$442.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250”

, ,
$442.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Fullerene-C60, Purity: 99.9%

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Price range: $98.00 through $442.00
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1 gram/88 € 5 grams/395 €                           
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Fullerene-C60

Purity: 99.9% 

Technical Properties:

Fullerene Compound Formula C60
Fullerene  Molecular Weight 720.64
Fullerene  Size Diameter: 0.8 nm, Length: 1.2 nm
Fullerene  Purity 99.9%
Fullerene  Melting Point >280 °C
Fullerene  True Density 1.71 g/cm3
Fullerene  Electrical Resistivity 1034 ohms m-1
Fullerene  Appearance Shinning Black
Fullerene  CAS 99685-96-8 

Applications:

1. Pharmaceutical: Diagnostic reagents, super drugs, cosmetics, nuclear magnetic resonance (NMR) with the developer. DNA affinity 2. Energy: Solar battery, fuel cell, secondary battery. 3. Industry: Wear resistant material, flame retardant materials, lubricants, polymer additives, high-performance membrane, catalyst, artificial diamond, hard alloy, electric viscous fluid, ink filters, high-performance coatings, fire retardant coatings, manufacturing bioactive materials , memory materials, embedded molecular and other characteristics, composite materials etc. 4. Information industry: Semiconductor record medium, magnetic materials, printing ink, toner, ink, paper special purposes. 5. Electronic parts: Superconducting semiconductor, diodes, transistors, inductor.  , 6. Optical materials, electronic camera, fluorescence display tube, nonlinear optical materials. 7. Environment: Gas adsorption, gas storage.  
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Cadmium Selenide (CdSe) Nanopowder/Nanoparticles, Purity: 99.95 %, Size: <100 nm

Price range: $43.00 through $442.00
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1 gram/38 € 5 grams/124 € 25 grams/390 €                       
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Cadmium Selenide Nanopowder/Nanoparticles

Purity: 99.95 %, Size: <100 nm

Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 8'', Thickness: 0.125''
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Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 8”, Thickness: 0.125”

$441.00
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Product 

 Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 8'', Thickness: 0.125''

CAS No.

7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 28.0855 g/mol

Melting Point

 1,414 °C

Boiling Point

3,265 °C

Density

  2.33 g/cm³

Product Codes

NCZ-1743K
Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 6'', Thickness: 0.125''
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Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125”

$441.00
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Product 

 Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 6'', Thickness: 0.125''

CAS No.

58397-70-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~231.71 g/mol

Melting Point

~2,700–3,200 °C

Boiling Point

~4,500–5,000 °C

Density

 ~14.5–17.0 g/cm³

Product Codes

NCZ-1554K
Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.125''
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Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”

$441.00
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Product 

 Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.125''

CAS No.

1314‑62‑1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 181.88 g/mol

Melting Point

690 °C

Boiling Point

~1750 °C

Density

 ~3.35 g/cm³

Product Codes

NCZ-1542K
Tin (Sn) Sputtering Target
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Tin (Sn) Sputtering Target

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Price range: $63.00 through $441.00
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Product 

 Tin (Sn) Sputtering Target

CAS No.

7440-31-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  118.71 g/mol

Melting Point

231.93 °C

Boiling Point

2,602 °C

Density

 7.31 g/cm³

Product Codes

NCZ-1306K
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Multi Walled Carbon Nanotubes N-Methyl-2-Pyrrolidinone Dispersion, 4 wt%, Purity: > 96 %, OD: 18-28 nm, Length 8-18 µm

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Price range: $91.00 through $441.00
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Applications:

MWCNTs have a variety of potential applications in different fields. These applications include midicine, mechanical, electric, chemical, energy and others. It can be applied in, 1-drug dilevery, 2-biosensors, 3-CNT composites, 4-catalysis, 5-nanoprobes, 6-hydrogen storage, 7-lithium battaries, 8-gas-discharge tubes, 9-flat panel display, 10-supercapacitor, 11-transistors, 12-solar cells, 13-photoluminescence, 14-tamplate
Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.250''
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Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”

$440.00
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Product 

 Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.250''

CAS No.

7783-40-6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  62.30 g/mol

Melting Point

~1263 °C

Boiling Point

~2260 °C

Density

  3.18 g/cm³

Product Codes

NCZ-1985K
Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 3'', Thickness: 0.125''
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Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 3”, Thickness: 0.125”

$440.00
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Product 

 Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 3'', Thickness: 0.125''

CAS No.

7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 28.0855 g/mol

Melting Point

 1,414 °C

Boiling Point

3,265 °C

Density

  2.33 g/cm³

Product Codes

NCZ-1763K
Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 4'', Thickness: 0.250''
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Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250”

$439.00
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Product 

 Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 4'', Thickness: 0.250''

CAS No.

11137-91-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~57.9 g/mol

Melting Point

~1,350–1,450 °C

Boiling Point

N/A

Density

  ~8.5 g/cm³

Product Codes

NCZ-1823K
Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 3'', Thickness: 0.250''
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Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250”

$439.00
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Product 

 Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 3'', Thickness: 0.250''

CAS No.

1313-96-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  265.81 g/mol

Melting Point

~1512 °C

Boiling Point

N/A

Density

  4.6 – 4.9 g/cm³

Product Codes

NCZ-1807K
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Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125”

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$439.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125”

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$439.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Graphene NMP Dispersion, Purity: 99.5%, Graphene: 0.5 wt%

Price range: $43.00 through $439.00
Select options This product has multiple variants. The options may be chosen on the product page

Application Fields

1) XPS patterns of Single Layer Graphene 2) Catalyst 3) Supercapacitors 4) Solar energy 5) Graphene semiconductor chips 6) Conductive graphene film 7) Graphene computer memory 8) Biomaterials 9) Transparent conductive coatings
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Manganese (Mn) Micron Powder, Purity: 99.99 %, Size: 325 mesh

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Price range: $50.00 through $439.00
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25 grams/45 € 100 grams/94 € 500 grams/245 € 1000 grams/390 €
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Manganese (Mn) Micron Powder

Purity: 99.99 %, Size: 325 mesh

Technical Properties:

PURITY

99.99 %
PARTICLE SIZE

325 mesh
CAS

7439-96-5
MELTING POINT

1245 °C
BOILING POINT

2150 °C
CRYSTAL STRUCTURE

Cubic
DENSITY

7.43 g/cm³
COEFF. OF EXPANSION @ 20ºC

22 x 10⁻⁶
MOHS HARDNESS @ 20ºC

5
FORM  

Powder
APPLICATIONS

Alloys Ceramics Chemical reactions
                                                             
AZ91 Magnesium Alloy Powder
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AZ91 Magnesium Alloy Powder, Purity: 99.95%, Size: 325 mesh

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Price range: $10.00 through $439.00
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5 grams/9 € 25 grams/29 €                        
100 grams/68 €                     
500 grams/235 €                    
1000 grams/390 € Please contact us for quotes on larger quantities !!!

AZ91 Magnesium Alloy Powder

Purity: 99.95%, Size: 325 mesh

 Magnesium Micro Powder can be used for preparation of pressed and bonded sputtering targets and in Chemical Vapor Deposition  Magnesium Micro Powder 325 mesh can be used for Physical Vapor Deposition  Magnesium Micro Powder 99.95%can be used for processes including Thermal and Electron Beam Evaporation  Magnesium Micro Powder 325 mesh 99.95% can be used for Low Temperature Organic Evaporation,  Magnesium Micro Particles can be used for Atomic Layer Deposition  Magnesium Micro Particles 325 mesh can be used for Metallic-Organic and Chemical Vapor Deposition  Magnesium Micro Particles 325 mesh 99.95% are also useful in any application where high surface areas are desired such as water treatment and in fuel cell and solar applications  Magnesium micro particles/micron powder also produce very high surface areas.  
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Copper (Cu) Micron Powder, Purity: 99.99 %, Size: 100 mesh, Spherical

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Price range: $38.00 through $439.00
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25 grams/34 €  100 grams/95 €  500 grams/265 €  1000 grams/390 €  Please contact us for quotes on larger quantities !!!

Copper (Cu) Micron Powder

Purity: 99.99 %, Size: 100 mesh, Spherica

Boron (B) Nanopowder
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Boron (B) Nanopowder/Nanoparticles , APS:100 nm, Purity:99.55+%

Price range: $43.00 through $439.00
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APPLICATION
  • A black - brown color powder used primarily for its thermal properties.
  • Corrosion inhibition: Boron compounds produced with boron nanopowders make it useful in anti-freeze, brake fluids, hydrolic systems, and other applications where ferrous materials need protection against corrosion.
  • Abrasive: boron can serve as a rugged, highly abrasive surface for any number of purposes. Combined with its thermal properties, this makes it highly effective for high speed cutting and similar tasks.
  • Photoelectric applications: Boron powder offers unique applications in photography, tanning, electrolytic condensation, fuel cells, and a host of other photoelectric fields.
  • Biocide: Borates in general work to kill a variety of insects and similar pests through simple physical destruction, making them one of the most universally effective pest control options.
  • Ignition: The thermal properties of boron powder make it an excellent ignition aid for any number of applications. This sees it used in charcoal briquettes, fuels, torches, and countless other applications.
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(-OH) Functionalized Industrial Short Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 8-28 nm

Price range: $43.00 through $439.00
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Applications:

Multi Walled Carbon Nanotubes have a variety of potential applications in different fields. These applications include medicine, mechanics, electric-electronics, chemicals, energy and others. It can be applied in, 1-drug delivery, 2-biosensors, 3-CNT composites, 4-catalysis, 5-nanoprobes, 6-hydrogen storage, 7-lithium batteries, 8-gas-discharge tubes, 9-flat panel displays, 10-supercapacitors, 11-transistors, 12-solar cells, 13-photoluminescence, 14-templates
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Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250”

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$438.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Carbon Nanotubes Doped with 52 wt% Graphene Nanopowder/Nanoparticles

Price range: $62.00 through $438.00
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Applications:

Carbon NanoTubes doped with Graphene nanoplatelets exhibit significant improvements in electrical and mechanical properties. Hardness, tensile strength, specific strength, and elastic modulus are examples of such enhancements. Because of these advancements, these materials are now widely used in a variety of applications. Among these applications are drug delivery, biosensors, 3-CNT composites, 4-catalysis, 5-nanoprobes, and 6-hydrogen storage. 7-lithium-ion batteries, 8- gas discharge tubes, 9- flat panel displays, 10- supercapacitors, 11- transistors, 12- solar cells, 13-photoluminescence, 14-templates

     
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Tungsten Oxide (WO3) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 55 nm, Tetragonal

Price range: $27.00 through $438.00
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5 grams/24 € 
25 grams/37 € 100 grams/86 €
500 grams/222 €  1000 grams/387 € 
                      
Please contact us for quotes on larger quantities !!! 

Tungsten Oxide (WO3) Nanopowder/Nanoparticles

Purity: 99.99%, Size: 55 nm, Tetragonal

Technical Properties:

Purity (%) 99.99
Morphology nearly spherical
Average Particle Size (nm) 55.0
Melting Point (°C) 1470.0
Bulk Density (g/cm3) 1,5
True Density (g/cm3) 7,1
Elemental Analysis (%) Ni Fe Cu Cr Cu
0.008 0.009 0.012 0.062 0.012

Applications:

Tungsten oxide nanoparticle is used in gas sensors, humidity sensors, temperature sensors, large area displays, X-ray screens, high density memory devices, infrared switching devices, and optical devices. It is also used as ceramic pigments, and colorant of chinaware. Tungsten oxide nanoparticle is used in fire proofing fabrics and textiles. It is used as catalyst and in wastewater treatment.
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Magnesium Oxide (MgO) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 45 nm

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Price range: $41.00 through $438.00
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25 grams/37 € 100 grams/58 € 500 grams/119 € 1000 grams/388 €
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Magnesium Oxide (MgO) Nanopowder/Nanoparticles

Purity: 99.95%, Size: 45 nm

Technical Properties:

Purity (%) 99.95
Color white
Average Particle Size (nm) 45
Specific Surface Area (m2/g)    >45
Morphology polyhedral
True Density (g/cm3) 3,6
Elemental Analysis (%) Na K Ca
0.023 0.0089 0.016

Applications:

Magnesium oxide nanoparticles have wide applications in catalysis, ceramics, electronics, coatings, and petrochemical products. It is used as fire retardant and is added to plastics and fibers. It is also used as dehydration agent for the production of high grade ceramic material, silicon steel sheet, and electronic industry material. Magnesium oxide nanoparticle is a good insulating material. It is used for making insulating conduits, smelters, crucibles, electrode bars and sheets. In electronics magnesium oxide nanoparticle is used in radio industry. It is used for making high frequency magnetic rod antenna, magnetic device filler, and insulating material filler. Magnesium oxide nanoparticles is used as fuel additive, antistatic agent, cleaner, and corrosion inhibitor. It has other wide applications in industry. It is used along with other materials to improve their properties such as, refractory fibers and refractory materials, refractory and insulating instruments, optical materials, materials for steel-smelting furnace and other high- temperature furnaces, heating materials, and ceramic base plates.
Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.250''
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Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250”

$437.00
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Product 

 Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.250''

CAS No.

 7440-22-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 107.87 g/mol

Melting Point

 961.78 °C

Boiling Point

 2162 °C

Density

  10.49 g/cm³

Product Codes

NCZ-1691K
Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 3'', Thickness: 0.125''
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Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125”

$437.00
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Product 

 Silver (Ag) Sputtering Targets, Purity: 99.99%, Size: 3'', Thickness: 0.125''

CAS No.

 7440-22-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 107.87 g/mol

Melting Point

 961.78 °C

Boiling Point

 2162 °C

Density

  10.49 g/cm³

Product Codes

NCZ-1690K
Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 2'', Thickness: 0.125''
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Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 2”, Thickness: 0.125”

$436.00
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Product 

 Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 2'', Thickness: 0.125''

CAS No.
1308-38-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  151.99 g/mol

Melting Point

 2,435 °C

Boiling Point

 ~3,000 °C (approximate; may decompose before boiling)

Density

 5.21 g/cm³

Product Codes

NCZ-2304K
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Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250”

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$436.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250”

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$436.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250”

, ,
$436.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Germanium (Ge) Sputtering Targets, indium, Purity: 99.999%, Size: 2”, Thickness: 0.125”

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$436.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125”

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$436.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

With the chemical formula Al2O3, aluminum oxide is a compound made of aluminum and oxygen. Because of its high melting point, Al2O3 is useful as a refractory material and as an abrasive due to its hardness, as well as for the production of aluminum metal.

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Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 1”, Thickness: 0.250”

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$436.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

The chemical compound aluminum nitride has the formula AlN.The exceptional combination of mechanical, chemical, and physical properties of aluminum nitride

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Aluminum Nitride (AlN) Sputtering Targets, elastomer, Purity: 99.8%, Size: 1”, Thickness: 0.125”

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$436.00
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 Applications of Sputtering Targets;

  The use of sputtering targets is for film deposition, among other applications. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.
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Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 1”, Thickness: 0.250”

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$436.00
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 Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon. Aluminum nitride is a chemical compound with the formula of AlN.Aluminum nitride has excellent combination of physical, chemical, and mechanical properties. High-quality films of aluminum nitride have been used in various devices and sensors including the optical and optoelectronic devices. As far as the optical and optoelectronic applications are concerned, wide band gap (~6.2 eV) along with high-refractive index (~2.0) and low-absorption coefficient (<10−3) makes AlN a very attractive material for these applications. In addition to this, thermal and chemical stability of AlN films make it suitable for applications in difficult environment. Today, AlN films/coatings have been grown by several methods which include pulsed laser deposition, reactive molecular beam epitaxy, vacuum arc/cathodic arc deposition, DC/RF reactive sputtering, ion beam sputtering, metal-organic chemical vapor deposition (MOCVD), and miscellaneous other techniques. Due to simplicity, reproducibility, ease of scaling up, and lower cost, magnetron sputtering is one of the common methods for growing AlN films for various applications. Properties of AlN films depend upon the crystal structure, crystal orientation, microstructure, and chemical composition, which in turn depend upon the deposition conditions such as sputtering power, pulse frequency, duty cycle, growth temperature, nitrogen/argon flow ratio, and sputtering gas pressure. AlN sputtering targets give good result with the method of reactive DC magnetron sputtering system.
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Industrial Grade Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 8-28 nm

Price range: $43.00 through $436.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

Multi Walled Carbon Nanotubes have a variety of potential applications in different fields. These applications include medicine, mechanics, electric-electronics, chemicals, energy and others. It can be applied in, 1-drug delivery, 2-biosensors, 3-CNT composites, 4-catalysis, 5-nanoprobes, 6-hydrogen storage, 7-lithium batteries, 8-gas-discharge tubes, 9-flat panel displays, 10-supercapacitors, 11-transistors, 12-solar cells, 13-photoluminescence, 14-templates
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Carbon Nanotube (CNT) Nanoribbon Water Dispersion, 0.5 mg/mL

Price range: $43.00 through $436.00
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Manufacturing Method:Ribbon is produced by chemical oxidation and longitudinal opening using strong oxidizing agents.
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Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125”

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$435.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

A Block S, Group 2, Period 6 element with an atomic weight of 137.27, barium has the atomic symbol Ba and atomic number 56. Barium is a mineral that an alkaline-earth metal member. Electronics can be plated using barium sputtering targets. Barium is beneficial for sputtering applications because of its good electrical characteristics. Barium sputtering targets can be utilized for semiconductors. Barium sputtering targets will work well for flat panel displays. Barium can be combined with other metals, such as titanium and strontium, to create alloys with more specialized qualities.

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Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250”

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$435.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance, the

It is possible to identify the target material and even detect incredibly tiny impurity amounts.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

A Block S, Group 2, Period 6 element with an atomic weight of 137.27, barium has the atomic symbol Ba and atomic number 56. One of the alkaline-earth metals is barium. Electronics can be plated using barium sputtering targets. Barium has favorable electrical characteristics.

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Industrial Grade Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 8-28 nm

Price range: $43.00 through $435.00
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Applications:

Multi Walled Carbon Nanotubes have a variety of potential applications in different fields. These applications include medicine, mechanics, electric-electronics, chemicals, energy and others. It can be applied in, 1-drug delivery, 2-biosensors, 3-CNT composites, 4-catalysis, 5-nanoprobes, 6-hydrogen storage, 7-lithium batteries, 8-gas-discharge tubes, 9-flat panel displays, 10-supercapacitors, 11-transistors, 12-solar cells, 13-photoluminescence, 14-templates
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(-COOH) Functionalized Industrial Multi Walled Carbon Nanotubes, Purity: > 90%, Outside Diameter: 50-80 nm

Price range: $72.00 through $435.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

Multi Walled Carbon Nanotubes have a variety of potential applications in different fields. These applications include medicine, mechanics, electric-electronics, chemicals, energy and others. It can be applied in, 1-drug delivery, 2-biosensors, 3-CNT composites, 4-catalysis, 5-nanoprobes, 6-hydrogen storage, 7-lithium batteries, 8-gas-discharge tubes, 9-flat panel displays, 10-supercapacitors, 11-transistors, 12-solar cells, 13-photoluminescence, 14-templates