Sort by
Filter by price
Filter
Show 9 12 18 24
Placeholder
Placeholder
Add to compare
Quick view
Add to wishlist

Titanium Carbide (TiC) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 790 nm, Cubic

, ,
Price range: $41.00 through $459.00
Select options This product has multiple variants. The options may be chosen on the product page
25 grams/37 € 100 grams/85 € 500 grams/243 € 1000 grams/405 €
Please contact us for quotes on larger quantities !!!

Titanium Carbide (TiC) Nanopowder/Nanoparticles

Purity: 99.99%, Size: 790 nm, Cubic

Applications:

Titanum carbide powder is used is used as additive and coating. It enhance conductive materials, plastics, and wear resistant when added. Its coating improve cutting tools wear resistance, nozzles, and abrasive steel bearings.
Add to compare
Quick view
Add to wishlist

Aluminum Nitride (AlN) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 790 nm, Hexagonal

Price range: $121.00 through $459.00
Select options This product has multiple variants. The options may be chosen on the product page
100 grams/107 €
500 grams/299 €  1000 grams/405 € 
                      
Please contact us for quotes on larger quantities !!!

Aluminum Nitride (AlN) Nanopowder/Nanoparticles

Purity: 99.95%, Size: 790 nm, Hexagonal

Applications:

Aluminum nitride powder has applications in elecronic devices, optical devices, and in composites. It is used in manufacturing of integrated circuit boards. It has high thermal conductivity. It used in the fabrication of metal matrix and polymer matrix composites that is used in heat seal adhesives and electronic packaging materials. It is also used in making high thermally conductive ceramics, high temperature crucibles, heat sinks, and thermally conductive filler for polymers.
High Purity Bismuth (III) Fluoride (BiF3), 99.99% 4N
Add to compare
Quick view
Add to wishlist

High Purity Bismuth (III) Fluoride (BiF3), 99.99% 4N

Price range: $172.00 through $458.00
Select options This product has multiple variants. The options may be chosen on the product page
Product High Purity Bismuth (III) Fluoride (BiF3), 99.99% 4N
CAS No. 7787-61-3
Appearance White to off-white crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient BiF3
Molecular Weight 265.97 g/mol
Melting Point N/A
Boiling Point N/A
Density 8.2 g/cm³
Product Codes NCZ-406I
 
Europium Nitrate Pentahydrate (Eu(NO3)3 · 5H2O) 99.99% 4N
Add to compare
Quick view
Add to wishlist

Europium Nitrate Pentahydrate (Eu(NO3)3 · 5H2O) 99.99% 4N

$458.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Europium Nitrate Pentahydrate (Eu(NO3)3 · 5H2O) 99.99% 4N
CAS No. 63026-01-7
Appearance White to off-white crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 40–100µm (Size Can be customized),  Ask for other available size range.
Ingredient Eu(NO3)3·5H2O
Molecular Weight 428.06 g/mol
Melting Point N/A
Boiling Point N/A
Density N/A
Product Codes NCZ-345I
 
Cerium Nitrate Hexahydrate (Ce(NO3)3 · 6H2O) 99.95% 3N5
Add to compare
Quick view
Add to wishlist

Cerium Nitrate Hexahydrate (Ce(NO3)3 · 6H2O) 99.95% 3N5

$458.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Cerium Nitrate Hexahydrate (Ce(NO3)3 · 6H2O) 99.95% 3N5
CAS No. 10294-41-4
Appearance White crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient Ce(NO3)3·6H2O
Molecular Weight 434.22 g/mol
Melting Point N/A
Boiling Point N/A
Density 2.6 g/cm³
Product Codes NCZ-315I
Hot
Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 3'', Thickness: 0.125''
Add to compare
Quick view
Add to wishlist

Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125”

$458.00
Add to cart

Product 

 Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 3'', Thickness: 0.125''

CAS No.

ZnO: 1314-13-2 Al₂O₃: 1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

ZnO + Al₂O₃ (AZO)(black granules) (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ZnO: 81.38 g/mol Al₂O₃: 101.96 g/mol

Melting Point

~1975 °C

Boiling Point

N/A

Density

 ~5.6 g/cm³

Product Codes

NCZ-1488K
Hot
Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.250''
Add to compare
Quick view
Add to wishlist

Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”

$458.00
Add to cart

Product 

 Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.250''

CAS No.

1314‑13‑2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

ZnO (black granules) (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 81.38 g/mol

Melting Point

~1975 °C

Boiling Point

~2360 °C

Density

  ~5.61 g/cm³

Product Codes

NCZ-1455K
Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 2'', Thickness: 0.125''
Add to compare
Quick view
Add to wishlist

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125”

$457.00
Add to cart

Product 

 Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 2'', Thickness: 0.125''

CAS No.
 10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

 ~2973 °C

Boiling Point

N/A

Density

 ~2.1 g/cm³

Product Codes

NCZ-2373K
Multi-walled Carbon Nanotube Paper, 50-60um Thickness
Add to compare
Quick view
Add to wishlist

Multi-walled Carbon Nanotube Paper, 50-60um Thickness

$457.00
Add to cart
Product Multi-walled Carbon Nanotube Paper, 50-60um Thickness
CAS No. 308068-56-6
Appearance Black to dark gray
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 50-60um ( (Size Can be customized),  Ask for other available size range.
Ingredient C
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 0.4 – 1.5 g/cm³
Product Codes NCZ-460I
Add to compare
Quick view
Add to wishlist

Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 8”, Thickness: 0.250”

, , ,
$456.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

Add to compare
Quick view
Add to wishlist

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 6”, Thickness: 0.250”

,
$456.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Add to compare
Quick view
Add to wishlist

Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125”

, , ,
$456.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

An alloy consisting of cobalt, iron, and boron can be utilized as a sputtering target. Let's examine the possible uses for cobalt, iron, and boron alloys.

Zirconium (Zr) Sputtering Target
Add to compare
Quick view
Add to wishlist

Zirconium (Zr) Sputtering Target

,
Price range: $75.00 through $455.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

 Zirconium (Zr) Sputtering Target

CAS No.

7440-67-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 91.224 g/mol

Melting Point

1,855 °C

Boiling Point

4,409 °C

Density

 6.52 g/cm³

Product Codes

NCZ-1311K
Add to compare
Quick view
Add to wishlist

Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125”

, ,
$455.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Add to compare
Quick view
Add to wishlist

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250”

,
$455.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Add to compare
Quick view
Add to wishlist

Chromium (Cr) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.125”

$455.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Silvery, shiny, hard, and brittle, chromium is a metal that resists corrosion and has a high mirror polish. The automotive industry finds extensive use for chromium sputtering targets. Chromium sputtering targets work well as a shiny coating for bumpers and wheels. Chromium sputtering targets can be employed in a variety of vacuum applications, such as automotive glass coatings.

Add to compare
Quick view
Add to wishlist

Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125”

, , ,
$455.00
Add to cart

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.
Add to compare
Quick view
Add to wishlist

Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125”

, ,
$455.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.
Copper Nanoparticles/ Nanopowder (Cu, 500nm, 99.8%)
Add to compare
Quick view
Add to wishlist

Copper Nanoparticles/ Nanopowder (Cu, 500nm, 99.8%)

,
Price range: $50.00 through $454.00
Select options This product has multiple variants. The options may be chosen on the product page
$50/25g $87/100g
$286/500g
$454/1kg

Product 

Copper Nanoparticles/ Nanopowder (Cu, 500nm, 99.8%)

CAS No.
7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

500nm (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

63.55 g/mol

Melting Point

1084.62 °C

Boiling Point

2562 °C

Density

8.96 g/cm³

Product Codes

NCZ-1036K
Add to compare
Quick view
Add to wishlist

Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125”

,
$454.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Add to compare
Quick view
Add to wishlist

Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125”

, ,
$454.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Add to compare
Quick view
Add to wishlist

Aluminum (Al) Nanopowder/Nanoparticles, Purity: 99.995%, Size: 38 nm, Metal Basis

$454.00
Select options This product has multiple variants. The options may be chosen on the product page

Aluminum (Al) Nanopowder/Nanoparticles

Purity: 99.995%, Size: 38 nm, Metal Basis

Technical Properties:

Bulk Density (g/cm3) 0,22
True Density (g/cm3) 2,7
Color black
Shape spherical
Crystal Structure cubic
Average Particle Size (nm) 38
Specific Surface Area (m2/g) 30-45
Elemental Analysis Al Si Fe Cu Mg, Mn, Pb, Ni, Zn
≥99.995 ≤0.01 0.01 0.03 ≤0.01

Applications:

Aluminum nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.Aluminum nanopowder can be used in catalysis applications as well as biomedical research. It can be added to heat transfer fluids, composite materials, package materials, transparent conductive fluids and wear resistant parts in order to strengthen their properties.  
Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.250''
Add to compare
Quick view
Add to wishlist

Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”

$453.00
Add to cart

Product 

 Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.250''

CAS No.

 ~68189‑52‑4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

<5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  ~237.54 g/mol

Melting Point

 ~1300–1400 °C

Boiling Point

N/A

Density

  ~6.4–6.5 g/cm³

Product Codes

NCZ-2099K
Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.5%, Size:4'', Thickness: 0.125''
Add to compare
Quick view
Add to wishlist

Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.5%, Size:4”, Thickness: 0.125”

$453.00
Add to cart

Product 

 Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.5%, Size:4'', Thickness: 0.125''

CAS No.

Nickel: [7440-02-0], Iron: [7439-89-6]

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  ~57.5 g/mol

Melting Point

 ~1450 °C

Boiling Point

 ~2800 °C

Density

 ~8.7 g/cm³ (Ni₈₀Fe₂₀) or ~8.1 g/cm³ (Ni₅₀Fe₅₀)

Product Codes

NCZ-1842K
Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 8'', Thickness: 0.250''
Add to compare
Quick view
Add to wishlist

Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 8”, Thickness: 0.250”

$453.00
Add to cart

Product 

 Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 8'', Thickness: 0.250''

CAS No.

7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 28.0855 g/mol

Melting Point

 1,414 °C

Boiling Point

3,265 °C

Density

  2.33 g/cm³

Product Codes

NCZ-1742K
Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 3'', Thickness: 0.125''
Add to compare
Quick view
Add to wishlist

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$453.00
Add to cart

Product 

 Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 3'', Thickness: 0.125''

CAS No.

 7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  180.95 g/mol

Melting Point

3017 °C

Boiling Point

 5458 °C

Density

 16.65 g/cm³

Product Codes

NCZ-1663K
Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 1'', Thickness: 0.250''
Add to compare
Quick view
Add to wishlist

Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250”

$453.00
Add to cart

Product 

 Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 1'', Thickness: 0.250''

CAS No.

25583-20-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 61.88 g/mol

Melting Point

 ~2950 °C

Boiling Point

~4300 °C

Density

 5.22 g/cm³

Product Codes

NCZ-1605K
Antimony Sputtering Target (Sb)
Add to compare
Quick view
Add to wishlist

Antimony Sputtering Target (Sb)

Price range: $213.00 through $453.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Antimony Sputtering Target (Sb)
CAS No. 7440-36-0
Appearance Silvery, Lustrous Gray, Semi-metallic
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient Sb
Molecular Weight 121.76 g/mol
Melting Point 630 °C
Boiling Point 17500 °C
Density N/A
Product Codes NCZ-103H
 
Placeholder
Placeholder
Add to compare
Quick view
Add to wishlist

Cobalt Oxide (Co3O4) Nanopowder/Nanoparticles, Purity: 99.5%, Size: 8-28 nm

Price range: $35.00 through $453.00
Select options This product has multiple variants. The options may be chosen on the product page
5 grams/31 € 25 grams/51 € 100 grams/98 € 500 grams/264 € 1000 grams/399 €
Please contact us for quotes on larger quantities !!!

Cobalt Oxide (Co3O4) Nanopowder/Nanoparticles

Purity: 99.5%, Size: 8-28 nm

Chemical Properties:

Cobalt Oxide nanoparticle is a mixed valence compound of Co (II) and Co (III). It is soluble in nitric acid, and it easily absorbs moister but does not generate water compounds. It is broken into sub-cobalt oxides when heated above 1200 °C.

Applications:

Cobalt Oxide nanoparticles have applications in electronics, ceramics, and catalysis. It is used in lithium ion battery as electrode material, and in other electrochemical cells as electrode active material. It is used in semiconductors, temperature and gas sensors and in electronic ceramics. Cobalt Oxide nanoparticles applied in solar energy as solar energy absorber. It is added to glass and porcelain as colorant and pigments. In catalysis, it is used as oxidant and catalyst for organic synthesis and catalyst carrier in chemical industry.
Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.125''
Add to compare
Quick view
Add to wishlist

Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125”

$452.00
Add to cart

Product 

 Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.125''

CAS No.

1314-61-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  441.89 g/mol

Melting Point

 ~1872 °C

Boiling Point

N/A

Density

 ~8.2 g/cm³

Product Codes

NCZ-1654K
Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 2'', Thickness: 0.250'', Grey to Black
Add to compare
Quick view
Add to wishlist

Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”, Grey to Black

$452.00
Add to cart

Product 

 Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 2'', Thickness: 0.250'', Grey to Black

CAS No.

13463‑67‑7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

TiO₂ (black granules) (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 79.94 g/mol

Melting Point

~1,843 °C

Boiling Point

~2,972 °C

Density

 ~4.23 g/cm³

Product Codes

NCZ-1439K
Add to compare
Quick view
Add to wishlist

Graphene NMP Dispersion, Purity: 99.5%, Graphene: 0.5 wt%

Price range: $44.00 through $452.00
Select options This product has multiple variants. The options may be chosen on the product page
Graphene NMP Dispersion, Purity: 99.5%, Graphene: 0.5 wt%
Graphene Purity (%) 99,5
Graphene Thickness (nm) 0,6-1,2
Diameter (µm) 2,0-12,0
Appearance Black Liquid
Concentration (wt%) 0.5 (mg/ml)
Specific Surface Area (m2/g) 600-1200
Elemental Analysis (%) C            O 99,6    <0,4
Surfactant                                                                                                           YES
Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 4'', Thickness: 0.250''
Add to compare
Quick view
Add to wishlist

Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 4”, Thickness: 0.250”

$451.00
Add to cart

Product 

 Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 4'', Thickness: 0.250''

CAS No.

7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 28.0855 g/mol

Melting Point

 1,414 °C

Boiling Point

3,265 °C

Density

  2.33 g/cm³

Product Codes

NCZ-1760K
Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 5'', Thickness: 0.125''
Add to compare
Quick view
Add to wishlist

Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 5”, Thickness: 0.125”

$451.00
Add to cart

Product 

 Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 5'', Thickness: 0.125''

CAS No.

7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 28.0855 g/mol

Melting Point

 1,414 °C

Boiling Point

3,265 °C

Density

  2.33 g/cm³

Product Codes

NCZ-1759K
3N5 (99.95%) Niobium (Nb) Pellets (2mm Dia. x 5-8mm L) Evaporation Materials
Add to compare
Quick view
Add to wishlist

3N5 (99.95%) Niobium (Nb) Pellets (2mm Dia. x 5-8mm L) Evaporation Materials

Price range: $253.00 through $451.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 3N5 (99.95%) Niobium (Nb) Pellets (2mm Dia. x 5-8mm L) Evaporation Materials
CAS No. 7440-03-1
Appearance Gray, Metallic 
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 2mm (Size Can be customized),  Ask for other available size range.
Ingredient Nb
Molecular Weight 40.30 g/mol
Melting Point 2,468 °C
Boiling Point N/A
Density 8.57 g/cm³
Product Codes NCZ-131E
 
Add to compare
Quick view
Add to wishlist

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125”

, , ,
$451.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

With the chemical formula Al2O3, aluminum oxide is a compound made of aluminum and oxygen.

Add to compare
Quick view
Add to wishlist

Gold (Au) Nanopowder/Nanoparticles Dispersion, Purity: 99.99%, Size: 20-30 nm, 172 ppm

,
Price range: $54.00 through $451.00
Select options This product has multiple variants. The options may be chosen on the product page
Gold (Au) Nanopowder/Nanoparticles Dispersion Purity: 99.99%, Size: 20-30 nm, 172 ppm Technical Properties: Au Nanoparticle Purity (%) 99,99 Au Concentration
Add to compare
Quick view
Add to wishlist

Tungsten (W) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 780 nm, metal basis

, ,
Price range: $31.00 through $450.61
Select options This product has multiple variants. The options may be chosen on the product page
Tungsten (W) Nanopowder/Nanoparticles Purity: 99.95%, Size: 780 nm, Metal Basis Technical Properties: True Density (g/cm3) 19,3 Color black Tmelting (oC) 3422
Calcium copper titanate(CCTO, CaCu3Ti4O12, Dielectric constant=180,000) (536616)
Add to compare
Quick view
Add to wishlist

Calcium copper titanate(CCTO, CaCu3Ti4O12, Dielectric constant=180,000) (536616)

$450.00
Select options This product has multiple variants. The options may be chosen on the product page
Calcium copper titanate(CCTO, CaCu3Ti4O12, Dielectric constant=180,000) (536616)
  Product Codes- NCZ-2685K
Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 8'', Thickness: 0.250''
Add to compare
Quick view
Add to wishlist

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250”

$450.00
Add to cart

Product 

 Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 8'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

  8.90 g/cm³

Product Codes

NCZ-1864K
Tantalum (Ta) Sputtering Targets, elastomer, Purity: 99.95%, Size: 2'', Thickness: 0.125''
Add to compare
Quick view
Add to wishlist

Tantalum (Ta) Sputtering Targets, elastomer, Purity: 99.95%, Size: 2”, Thickness: 0.125”

$450.00
Add to cart

Product 

 Tantalum (Ta) Sputtering Targets, elastomer, Purity: 99.95%, Size: 2'', Thickness: 0.125''

CAS No.

 7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  180.95 g/mol

Melting Point

3017 °C

Boiling Point

 5458 °C

Density

 16.65 g/cm³

Product Codes

NCZ-1656K
Add to compare
Quick view
Add to wishlist

Fullerene-C60, Purity: 99.5%

Price range: $99.00 through $450.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

1. Pharmaceutical: Diagnostic reagents, super drugs, cosmetics, nuclear magnetic resonance (NMR) with the developer. DNA affinity 2. Energy: Solar battery, fuel cell, secondary battery. 3. Industry: Wear resistant material, flame retardant materials, lubricants, polymer additives, high-performance membrane, catalyst, artificial diamond, hard alloy, electric viscous fluid, ink filters, high-performance coatings, fire retardant coatings, manufacturing bioactive materials , memory materials, embedded molecular and other characteristics, composite materials etc. 4. Information industry: Semiconductor record medium, magnetic materials, printing ink, toner, ink, paper special purposes. 5. Electronic parts: Superconducting semiconductor, diodes, transistors, inductor.  , 6. Optical materials, electronic camera, fluorescence display tube, nonlinear optical materials. 7. Environment: Gas adsorption, gas storage.
Add to compare
Quick view
Add to wishlist

Carbon Black & Carbon Nanotube Mixed, Purity: >97.5%

Price range: $53.00 through $450.00
Select options This product has multiple variants. The options may be chosen on the product page

Carbon Black & Carbon Nanotube Mixed

Purity: >97.5%

Technical Properties:

Color black
pH 8,5-9,5
Ash/Moisture Content (%) <0,4
CNT Purity (%) >97,5
CNT Dimensions O.D.: 40-90 nm/Length: 6,28 µm
Average Particle Size - CB (nm) 10-100
Specific Surface Area - CB/CNT (m2/g) 95
Resistivity  (Ω.cm) 3-6x10-4
Elemental Analysis C Ni Mg Fe
98 0,7 <0,01 <0,01

Applications:

This new powder product has high conductivity and gives good mechanical strength to the doped structure. In the dispersed form, CB prevents agglomeration of CNTs.
Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 3'', Thickness: 0.125''
Add to compare
Quick view
Add to wishlist

Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125”

$449.00
Add to cart

Product 

 Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 3'', Thickness: 0.125''

CAS No.

 12138-09-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 247.97 g/mol

Melting Point

~1,250 °C

Boiling Point

N/A

Density

 ~7.5 g/cm³

Product Codes

NCZ-1582K
Placeholder
Placeholder
Add to compare
Quick view
Add to wishlist

Nickel Oxide (NiO) Nanopowder/Nanoparticles, High Purity: 99.55+%, Size: 10-40 nm

, ,
Price range: $29.00 through $449.00
Select options This product has multiple variants. The options may be chosen on the product page
5 grams/26 € 25 grams/46 € 100 grams/88 € 500 grams/223 € 1000 grams/398 €                
Please contact us for quotes on larger quantities !!!

Nickel Oxide (NiO) Nanopowder/Nanoparticles

High Purity: 99.55+%, Size: 10-40 nm

Technical Properties:

Purity (%) 99.55+
Color gray-black
Morphology nearly spherical
Average Particle Size (nm) 10-40
Specific Surface Area (m2/g)    >95
Bulk Density (g/cm3) 0,8
True Density (g/cm3) 6,8
Elemental Analysis (%) Al Ba Ca Mg Fe Zn
0.0017 0.0023 0.0092 0.0065 0.002 0.005
Applications: Nickel oxide nanoparticle is widely used in different materials. It is used in preparation of nickel cermet for the anode layer of solid oxide fuel cells. It is used in nanowires, nanofibers, and specific alloys. It is used in ceramic structures, electrochromic coatings, plastics, and textiles. Nickel oxide nanoparticles  is used in active optical filters, and automotive rear view mirrors with adjustable reflectance. It is also used to make energy efficient smart windows with adjustable absorption and reflectance.
Placeholder
Add to compare
Quick view
Add to wishlist

Conductive Carbon Black Nanopowder/Nanoparticles, Size: 30 nm

Price range: $61.00 through $449.00
Select options This product has multiple variants. The options may be chosen on the product page
Application Areas The recommended application areas of carbon black are as architectural Paints, primers, screen ink, synthetic fiber wires & cable and lastly as synthetic leather. Additionally, this product is also can be used in industrial paints, powder coating, gravure ink, flexographic ink, relief ink and as master batch.  
Add to compare
Quick view
Add to wishlist

Conductive Carbon Black Nanopowder/Nanoparticles, Size: 30 nm

Price range: $61.00 through $449.00
Select options This product has multiple variants. The options may be chosen on the product page
Please contact us for quotes on larger quantities ! Carbon Black Powder Size: 30 nm Application Areas The recommended application areas of carbon black are as architectural Paints, primers, screen ink, synthetic fiber wires & cable and lastly as synthetic leather. Additionally, this product is also can be used in industrial paints, powder coating, gravure ink, flexographic ink, relief ink and as master batch.   Technical Properties:  
PARTICLE SIZE

30 nm
CAS

1333-86-4
Iodin Absorption

124 ± 20 m2/g
DBP Oil Absorption

86 ± 5 cc/100g
pH Value

5
Tint Strength VS SRB3#

≥120 %
Zirconium diboride(ZrB2) (055857)
Add to compare
Quick view
Add to wishlist

Zirconium diboride(ZrB2) (055857)

Price range: $383.00 through $448.00
Select options This product has multiple variants. The options may be chosen on the product page
Zirconium diboride(ZrB2) (055857)
Grade Purity Moisture D50 Price($/kg)
ZrB2-90% 90% min 1.0% max ̴5 µm 383
ZrB2-99% 99% min 0.5% max ̴15 µm 448
Product Codes- NCZ-2697K
Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.250''
Add to compare
Quick view
Add to wishlist

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250”

$448.00
Add to cart

Product 

 Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.250''

CAS No.
 1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 101.96 g/mol

Melting Point

 ~2,072 °C

Boiling Point

~2,977 °C

Density

 ~3.97–3.98 g/cm³

Product Codes

NCZ-2547K
Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 2'', Thickness: 0.125''
Add to compare
Quick view
Add to wishlist

Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125”

$448.00
Add to cart

Product 

 Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 2'', Thickness: 0.125''

CAS No.

1313-27-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  143.94 g/mol

Melting Point

 ~795°C

Boiling Point

 ~1155°C

Density

  ~4.7 g/cm³

Product Codes

NCZ-1903K
Add to compare
Quick view
Add to wishlist

Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250”

, , ,
$448.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Add to compare
Quick view
Add to wishlist

Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125”

,
$448.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Add to compare
Quick view
Add to wishlist

Lithium Titanate (Li2TiO3) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125”

,
$448.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Add to compare
Quick view
Add to wishlist

Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125”

, ,
$448.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Add to compare
Quick view
Add to wishlist

Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”

,
$448.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Add to compare
Quick view
Add to wishlist

Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”

,
$448.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Add to compare
Quick view
Add to wishlist

Graphitized Carbon Nanofiber, Purity: 99.95%, Size: 200-600 nm

Price range: $97.00 through $448.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

The chemical vapor deposition (CVD) process yields extremely pure carbon nanofibers (>99,9%). Following a 24-hour annealing process at approximately 3000 degrees Celsius (graphitization), this high level of purity, electrical and characteristics of thermal conductivity. Because of its conductivity, carbon nanofiber (CNF), a material similar to carbon nanotubes, is appealing as well as mechanical qualities. It is widely employed and researched in energy conversion, chemical catalysis, sensors, electrodes, lithography, EMI shielding, super capacitors, hydrogen storage, rechargeable batteries, and displays, biomedical research, composite and polymer reinforcement projects, etc.

Add to compare
Quick view
Add to wishlist

Graphene Water Dispersion, Purity: 99.5%, Black Liquid, Graphene: 0.5 wt%

Price range: $40.00 through $448.00
Select options This product has multiple variants. The options may be chosen on the product page
Graphene Water Dispersion, Purity: 99.5%, Black Liquid, Graphene: 0.5 wt%
Graphene Purity (%) 99,5
Graphene Thickness (nm) 0,6-1,2
Diameter (µm) 2,0-12,0
Appearance Black Liquid
Concentration (wt%) 0.5 (mg/ml)
Specific Surface Area (m2/g) 600-1200
Elemental Analysis (%) C            O 99,6    <0,4
Surfactant                                                                                                           YES
Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 3'', Thickness: 0.250''
Add to compare
Quick view
Add to wishlist

Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 3”, Thickness: 0.250”

$447.00
Add to cart

Product 

 Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 3'', Thickness: 0.250''

CAS No.

7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 28.0855 g/mol

Melting Point

 1,414 °C

Boiling Point

3,265 °C

Density

  2.33 g/cm³

Product Codes

NCZ-1762K
Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 4'', Thickness: 0.125''
Add to compare
Quick view
Add to wishlist

Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 4”, Thickness: 0.125”

$447.00
Add to cart

Product 

 Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 4'', Thickness: 0.125''

CAS No.

7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 28.0855 g/mol

Melting Point

 1,414 °C

Boiling Point

3,265 °C

Density

  2.33 g/cm³

Product Codes

NCZ-1761K