Aluminum Oxide (Al2O3) Sputtering Targets
Purity: 99.999%, Size: 1”, Thickness: 0.125”
1 unit (436 euros).
For estimates on greater quantities, do get in touch with us!
Aluminum Oxide Sputtering Targets (Al2O3)
Size: 1”, Thickness: 0.125”, Purity: 99.999%
Sputtering is a well-established technique that can deposit thin films made of a wide range of materials on a variety of shaped and sized substrates.
Sputter targets allow for reproducible processes that can be expanded from small-scale R&D initiatives. Sputter target processes can be modified to suit medium- to large-sized substrate surfaces in manufacturing batches. Depending on the process settings, the chemical reaction may take place on the substrate, in flight, or on the target surface. Sputter deposition is a complicated process due to its numerous characteristics, yet professionals have a great deal of control over the region’s growth and microstructure.