Prime CZ-Si Wafer, Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2-Side Polished, Thickness: 380 ± 25 μm

Price range: $39.00 through $700.00
Select options This product has multiple variants. The options may be chosen on the product page
Prime CZ-Si Wafer Size: 3”, Orientation: (100), Boron Doped, 2-Side Polished Technical Properties: Quality Prime Materials CZ-Si Size (inch) 3”

(-COOH) Functionalized Industrial Multi Walled Carbon Nanotubes, Purity: > 92%, Outside Diameter: 10-30 nm

Price range: $39.00 through $700.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

Multi Walled Carbon Nanotubes have a wide range of possible uses in several industries. These applications span a variety of fields, including energy, chemistry, mechanics, and electric-electronics. It can be used for a number of things, including medication administration, biosensors, CNT composites, catalysis, nanoprobes, and hydrogen storage. 7, lithium-ion batteries, gas discharge tubes, eight nine flat-panel screens, ten supercapacitors, and eleven transistors 12 solar cells, 13 photoluminescence, and 14 templates.

Silver (Ag) Nanopowder/Nanoparticles Water Dispersion, Size: 2 nm, Colorless & Transparent, 2.200 ppm

Price range: $47.00 through $700.00
Select options This product has multiple variants. The options may be chosen on the product page
25 grams/43 € 50 grams/69 € 100 grams/108 € 500 grams/340 € 1000 grams/635 €           
Please contact us for quotes on larger quantities !!!

Silver (Ag) Nanopowder/Nanoparticles Water Dispersion

Size: 2 nm, Colorless & Transparent, 2.200 ppm

The silver water dispersion is a colorless & transparent or light yellow liquid, composed of nano silver that particle size is less than 2 nm. Silver (Ag) water dispersion is widely applicable for various fabrics including cotton, blending fabric, chemical fiber, non-woven fabric, leather, etc. We are glad to provide Ag in water with low prices.

Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125”

$699.00

Product 

Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 3'', Thickness: 0.125''

CAS No.

12190‑79‑3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

97.87 g/mol

Melting Point

 ~1,100–1,130 °C (decomposes rather than boils)

Boiling Point

N/A

Density

~4.80–4.95 g/cm³

Product Codes

NCZ-2051K

Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250”

$699.00

Product 

Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 2'', Thickness: 0.250''

CAS No.

1314‑13‑2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

ZnO (black granules) (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

81.38 g/mol

Melting Point

~1975 °C

Boiling Point

~2360 °C

Density

 ~5.61 g/cm³

Product Codes

NCZ-1451K

Lithium Phosphate (Li3PO4) Sputtering Targets, elastomer, Purity: 99.95%, Size: 2”, Thickness: 0.125”

$699.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Copper Oxide (CuO) Nanopowder/Nanoparticles Water Dispersion, Size: 20-50 nm, 22 wt%

Price range: $90.00 through $699.00
Select options This product has multiple variants. The options may be chosen on the product page
Copper Oxide (CuO) Nanopowder/Nanoparticles Water Dispersion Size: 20-50 nm, 22 wt%

Prime CZ-Si Wafer, Size: 2”, Orientation: (111), Boron Doped, Resistivity: 1-20 (ohm.cm), 2-Side Polished, Thickness: 500 ± 25 μm

Price range: $42.00 through $699.00
Select options This product has multiple variants. The options may be chosen on the product page
1 piece/38 € 5 pieces/145 € 25 pieces/625 € Please contact us for quotes on larger quantities !!!

Prime CZ-Si Wafer

Size: 2”, Orientation: (111), Boron Doped, 2-Side Polished

Technical Properties:

Quality Prime
Materials CZ-Si
Size (inch) 2”
Orientation (111)
Coating
Thickness (μm) 500 ± 25
Doping Boron
Resistivity (ohm.cm) 1-10
Polished Double Side
Silicon is one of the most common elements on earths crust. Main usage of Silicon wafers is electronics and technology. Silicon wafers have very flat and mirror like surfaces. It is produced by Czochralski method to obtain the highest purity. Depending on the usage area, silicon wafers can be doped with different materials to tailor its purity accordingly. The amount and type of dopants highly affect the electronic properties. Galium, indium, boron and nitrogen are some of the dopants that can be used in production process. Silicon wafers are used in semiconductors, microchips, integrated circuits, smartphones, computers etc. Silicon is the key platform for semiconductor gadgets. A wafer is just but a thin slice of the semiconductor material that acts as a substratum for microelectronic devices fitted in and above the wafer.

Large Surface Area Single Walled Carbon Nanotubes, Purity: > 95%, SSA: 400 m2/g

Price range: $180.00 through $699.00
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Large Surface Area Single Walled Carbon Nanotubes

Purity: > 95%, SSA: 400 m2/g, Dia: 1.0 nm

Single walled carbon nanotubes (SWCNTs, SWNTs) comprise of one-atom-thick sheets of graphene that rolled up to form long hollow tubes. SWCNTs possess exceptional thermal, mechanical and electrical properties. These remarkable properties lead to advances in performance in a wide range of materials and devices. Single-walled carbon nanotubes are actively used in diverse area including energy storage, molecular electronics, nanomechanial devices, composites and bio-sensing. Our company sells Large Surface Area Single Wall Carbon Nanotubes with high purity and low prices. 

Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, indium, Purity: 99.995%, Size: 3”, Thickness: 0.125”

$698.00

Product 

Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, indium, Purity: 99.995%, Size: 3'', Thickness: 0.125''

CAS No.

60676-86-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

60.08 g/mol

Melting Point

~1715 °C

Boiling Point

~2230 °C

Density

~2.20 g/cm³

Product Codes

NCZ-1707K

Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250”

$697.00

Product 

Silicon Carbide (SiC) Sputtering Targets, Purity: 99.5%, Size: 2'', Thickness: 0.250''

CAS No.

 409-21-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 40.10 g/mol

Melting Point

~2,700 °C

Boiling Point

N/A

Density

~3.21 g/cm³

Product Codes

NCZ-1727K

Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250”

$697.00

Product 

Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 2'', Thickness: 0.250''

CAS No.

 12070-08-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

59.89 g/mol

Melting Point

 ~3160 °C

Boiling Point

N/A

Density

4.93 g/cm³

Product Codes

NCZ-1611K

Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125”

$697.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

alpha-Arbutin (438513)

$696.00
Select options This product has multiple variants. The options may be chosen on the product page
alpha-Arbutin (438513)
 
Chemical name: 4-Hydroxyphenyl-alpha-D-glucopyranoside CAS#: 84380-01-8 Melting point: 203-207±1°C Assay: ≥99%(HPLC)
Product Codes- NCZ-2706K

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.98%, Size:2”, Thickness: 0.125”

$696.00

Product 

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.98%, Size:2'', Thickness: 0.125''

CAS No.

1313-99-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 ~3–5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

74.69 g/mol

Melting Point

1,950 °C

Boiling Point

 2,730 °C

Density

 6.67 g/cm³

Product Codes

NCZ-1836K

Silicon (Si) Sputtering Targets, P-type, indium, Purity: 99.999%, Size: 4”, Thickness: 0.125”

$696.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125”

$695.00

Product 

Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 4'', Thickness: 0.125''

CAS No.

• Indium Oxide (In₂O₃): 1312-43-2 • Tin Oxide (SnO₂): 18282-10-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

< 5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 Approx. 292.6 g/mol (based on 90:10 wt% In₂O₃:SnO₂ blend)

Melting Point

 ~1,800 °C (sintered ceramic composite; no sharp melting point)

Boiling Point

N/A

Density

 ~7.15 g/cm³

Product Codes

NCZ-2206K

Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”

$695.00

Product 

Lanthanum Strontium Manganate (La0.7Sr0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.250''

CAS No.

 ~68189‑52‑4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

<5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

~234–237 g/mol

Melting Point

Decomposes before melting or boiling (≈ >1300 °C)

Boiling Point

N/A

Density

~6.3–6.5 g/cm³

Product Codes

NCZ-2108K

Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250”

$695.00

Product 

Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 6'', Thickness: 0.250''

CAS No.

7440-10-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 140.91 g/mol

Melting Point

931 °C

Boiling Point

 3520 °C

Density

 6.77 g/cm³

Product Codes

NCZ-1786K

Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250”

$695.00

Product 

Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 4'', Thickness: 0.250''

CAS No.

18282-10-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

150.71 g/mol

Melting Point

~1630 °C

Boiling Point

~1800–1900 °C

Density

~6.95 g/cm³

Product Codes

NCZ-1625K

Molybdenum Pentachloride Powder ( MoCl5, 99%)

Price range: $345.00 through $695.00
Select options This product has multiple variants. The options may be chosen on the product page
$345/500g
$695/1kg

Product 

Molybdenum Pentachloride Powder ( MoCl5, 99%)

CAS No.

10241-05-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

1–10 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

273.2 g/mol

Melting Point

~190 °C

Boiling Point

~268–270 °C

Density

~2.70 g/cm³

Product Codes

NCZ-1156K

Praseodymium (Pr) Sputtering Target

Price range: $252.00 through $694.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Praseodymium (Pr) Sputtering Target

CAS No.

7440-10-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

140.91 g/mol

Melting Point

 931 °C

Boiling Point

3,129 °C

Density

6.77 g/cm³

Product Codes

NCZ-1358K

Neodymium (Nd) Sputtering Target

Price range: $252.00 through $694.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Neodymium (Nd) Sputtering Target

CAS No.

7440-00-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

144.24 g/mol

Melting Point

1,024 °C

Boiling Point

3,074 °C

Density

7.01 g/cm³

Product Codes

NCZ-1356K

Carbon (C) Sputtering Targets, indium, Purity: 99.999%, Size: 3”, Thickness: 0.125”

$693.00

Product 

Carbon (C) Sputtering Targets, indium, Purity: 99.999%, Size: 3'', Thickness: 0.125''

CAS No.

 7782‑42‑5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

12.01 g/mol

Melting Point

Sublimates at ~3,652 °C

Boiling Point

Sublimates at ~4,200 °C

Density

 ~2.25 g/cm³

Product Codes

NCZ-2346K

Cobalt (Co) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.250”

$693.00

Product 

Cobalt (Co) Sputtering Targets, indium, Purity: 99.95%, Size: 2'', Thickness: 0.250''

CAS No.

7440‑48‑4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

58.93 g/mol (cobalt atomic weight)

Melting Point

~1,495 °C

Boiling Point

~2,870 °C

Density

~8.9 g/cm³

Product Codes

NCZ-2283K

Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250”

$693.00

Product 

Nickel Chromium (Ni-Cr) Sputtering Targets, Purity: 99.95%, Size: 6'', Thickness: 0.250''

CAS No.

 11106-97-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~110.69 g/mol

Melting Point

 ~1,400 °C

Boiling Point

 ~2,730–2,750 °C

Density

 ~8.4 – 8.5 g/cm³

Product Codes

NCZ-1850K

Vanadium Oxide (V2O5) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125”

$693.00

Product 

Vanadium Oxide (V2O5) Sputtering Targets, indium, Purity: 99.9%, Size: 2'', Thickness: 0.125''

CAS No.

1314‑62‑1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

181.88 g/mol

Melting Point

690 °C

Boiling Point

~1750 °C

Density

~3.35 g/cm³

Product Codes

NCZ-1530K

Niobium Sputtering Target Nb

Price range: $169.00 through $693.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Niobium Sputtering Target Nb
CAS No. 685830-44-8
Appearance Gray, Metallic
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1–5μm (Size Can be customized),  Ask for other available size range.
Ingredient Nb
Molecular Weight 92.90638 g/mol
Melting Point 2,468 °C
Boiling Point N/A
Density 8.57 g/cm³
Product Codes NCZ-134H

Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.125”

$693.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250”

$693.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

With the chemical formula Al2O3, aluminum oxide is a compound made of aluminum and oxygen.

10mL Silver (Ag) Nanoparticle Water Dispersion, 0.1mg/mL

Price range: $308.00 through $692.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 10mL Silver (Ag) Nanoparticle Water Dispersion, 0.1mg/mL
CAS No. 7440-22-4
Appearance Bright yellow dispersion
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 150 nm (Size Can be customized),  Ask for other available size range.
Ingredient Ag
Molecular Weight 107.87 g/mol
Melting Point N/A
Boiling Point N/A
Density 10.49 g/cm³
Product Codes NCZ-130I
 

Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 18-28 nm

Price range: $60.00 through $692.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

Multi Walled Carbon Nanotubes have a variety of potential applications in different fields. These applications include medicine, mechanics, electric-electronics, chemicals, energy and others. It can be applied in, 1-drug delivery, 2-biosensors, 3-CNT composites, 4-catalysis, 5-nanoprobes, 6-hydrogen storage, 7-lithium batteries, 8-gas-discharge tubes, 9-flat panel displays, 10-supercapacitors, 11-transistors, 12-solar cells, 13-photoluminescence, 14-templates

Graphitized Multi Walled Carbon Nanotubes, Purity: > 99.99%, Outside Diameter: 48-78 nm

Price range: $60.00 through $692.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

Multi Walled Carbon Nanotubes have a variety of potential applications in different fields. These applications include medicine, mechanics, electric-electronics, chemicals, energy and others. It can be applied in, 1-drug delivery, 2-biosensors, 3-CNT composites, 4-catalysis, 5-nanoprobes, 6-hydrogen storage, 7-lithium batteries, 8-gas-discharge tubes, 9-flat panel displays, 10-supercapacitors, 11-transistors, 12-solar cells, 13-photoluminescence, 14-templates

Lithium Titanate (Li2TiO3) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250”

$690.00

Product 

Lithium Titanate (Li2TiO3) Sputtering Targets, Purity: 99.95%, Size: 3'', Thickness: 0.250''

CAS No.

12031-82-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

109.75 g/mol

Melting Point

Decomposes before melting (~1,200 °C)

Boiling Point

N/A

Density

~3.41 g/cm³

Product Codes

NCZ-2011K

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250”

$690.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250”

$690.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125”

$690.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance, the

It is possible to identify the target material and even detect incredibly tiny impurity amounts.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

The chemical compound barium zirconate has the formula BaZrO3. An electroceramic, or family of ceramic materials principally employed for their electrical capabilities, is what barium zirconate is. In semiconductor, chemical vapor deposition (CVD), physical vapor deposition (PVD), and optical applications, barium zirconate sputtering targets can be employed. Barium zirconate sputtering targets can also be employed for ferroelectric applications.

Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”

$690.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance, the

It is possible to identify the target material and even detect incredibly tiny impurity amounts.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

The chemical compound barium zirconate has the formula BaZrO3. An electroceramic, or family of ceramic materials principally employed for their electrical qualities, is barium zirconate. Chemical vapor deposition (CVD), physical vapor deposition (PVD), semiconductor, and optical applications can all benefit from the usage of barium zirconate sputtering targets. Barium zirconate sputtering targets can also be employed for ferroelectric applications.

Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250”

$690.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance, the

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Formulated as BaTiO3, barium titanate is an inorganic substance. When formed as big crystals, barium titanate is clear and has a white powdery appearance. It is a ferroelectric ceramic material with piezoelectric and photorefractive characteristics. The applications for barium titanate sputtering agents are numerous. For instance, barium titanate films, which are produced by sputtering targets, can be employed in particular electronic ceramics. Barium titanate can be utilized in the building of electrical devices such as sensors, capacitors, and detectors.

Hafnium Carbide (HfC) Nanopowder/Nanoparticles, Purity: 99.99%, Size: 790 nm, Cubic

Price range: $99.00 through $690.00
Select options This product has multiple variants. The options may be chosen on the product page
1 gram/88 € 5 grams/248 € 
25 grams/609 €                       
Please contact us for quotes on larger quantities !!! 

Hafnium Carbide (HfC) Nanopowder/Nanoparticles

Purity: 99.99%, Size: 790 nm, Cubic

Applications:

Hafnium carbide powder is very hard material. It is used in hard coatings. It is also used as rocket nozzle throat material and in metal ceramic materials.

Water-Soluble Red Fluorescence Carbon Quantum Dot Powder/Dispersion

Price range: $209.00 through $689.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Water-Soluble Red Fluorescence Carbon Quantum Dot Powder/Dispersion
CAS No. 7440-44-0
Appearance Brownish
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 5–6 nm (Size Can be customized),  Ask for other available size range.
Ingredient V2C
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density N/A
Product Codes NCZ-595I

Titanium Dioxide (TiO2) Sputtering Targets, elastomer, Purity: 99.9%, Size: 2”, Thickness: 0.125”, Grey to Black

$689.00

Product 

Titanium Dioxide (TiO2) Sputtering Targets, elastomer, Purity: 99.9%, Size: 2'', Thickness: 0.125'', Grey to Black

CAS No.

13463‑67‑7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

TiO₂ (black granules) (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

79.94 g/mol

Melting Point

~1,843 °C

Boiling Point

~2,972 °C

Density

~4.23 g/cm³

Product Codes

NCZ-1424K

Molybdenum Oxide (MoO3) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125”

$688.00

Product 

Molybdenum Oxide (MoO3) Sputtering Targets, indium, Purity: 99.9%, Size: 2'', Thickness: 0.125''

CAS No.

1313-27-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 143.94 g/mol

Melting Point

 ~795°C

Boiling Point

 ~1155°C

Density

 ~4.7 g/cm³

Product Codes

NCZ-1897K

Titanium Boride (TiB2) Sputtering Targets, indium, Purity: 99.5%, Size: 2”, Thickness: 0.125”

$688.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Lanthanum Aluminate (LaAlO3) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125”

$688.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Hydrothermal Synthesis Autoclave Reactor with PPL Lined Vessel 100 ml

Price range: $172.00 through $688.00
Select options This product has multiple variants. The options may be chosen on the product page
APPLICATIONs
  • Chemical synthesis
  • Synthesizing of nanoparticles
  • For cultured crystal growth
  • Polymerization reaction
  • Hydrothermal decomposition
  • Catalyst synthesis
  • Hydrothermal oxidation
  • Hydrothermal precipitation
  • Material Digester / digestion
  • Crystallization process
  • Dissolve of heavy metals, refractory material, organic chemicals etc.
   

Lanthanum Aluminate (LaAlO3) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125”

$688.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.

Dummy CZ-Si Wafer, Size: 4”, Orientation: (111), Phosphor Doped, Resistivity: 1-50 (ohm.cm), 2-Side Polished, Thickness: 525 ± 25 μm

Price range: $57.00 through $688.00
Select options This product has multiple variants. The options may be chosen on the product page
1 piece/51 € 5 pieces/155 € 25 pieces/615 €   Please ask for amount of stock before placing an order on Wafer Products Please contact us for quotes on larger quantities !!! 

Dummy CZ-Si Wafer

Size: 4”, Orientation: (111), Phosphor Doped, 2-Side Polished

Technical Properties:

Quality Dummy
Materials CZ-Si
Size (inch) 4”
Orientation (111)
Coating  
Thickness (μm) 525 ± 25
Doping Phosphor
Resistivity (ohm.cm) 1-50
Polished Double Side
Dummy is a grade of wafers, which is also referred as “test wafer” a grade lower than prime. Dummy CZ Si wafers are often doped with arsenic. Test grade wafers are high quality but have less stringent properties than prime grade wafers, usually failing for one or more of the Semiconductor Equipment and Materials International (SEMI) standards. Test grade wafers are often used in applications that require a large quantity of wafers for equipment and fabrication testing. Even if you are doing very high end R&D work it is much more cost effective to develop a process using test wafers and then do the final checks using Prime or Epi-Prime wafers.

Prime CZ-Si Wafer, Size: 2”, Orientation: (100), Phosphor Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 279 ± 20 μm

Price range: $58.00 through $688.00
Select options This product has multiple variants. The options may be chosen on the product page
1 piece/51 € 5 pieces/155 € 25 pieces/615 € Please contact us for quotes on larger quantities !!!

Prime CZ-Si Wafer

Size: 2”, Orientation: (100), Phosphor Doped, 1-Side Polished

Technical Properties:

Quality Prime
Materials CZ-Si
Size (inch) 2”
Orientation (100)
Coating
Thickness (μm) 279 ± 20
Doping Phosphor
Resistivity (ohm.cm) 1-10
Polished One Side
Silicon is one of the most common elements on earths crust. Main usage of Silicon wafers is electronics and technology. Silicon wafers have very flat and mirror like surfaces. It is produced by Czochralski method to obtain the highest purity. Depending on the usage area, silicon wafers can be doped with different materials to tailor its purity accordingly. The amount and type of dopants highly affect the electronic properties. Galium, indium, boron and nitrogen are some of the dopants that can be used in production process. Silicon wafers are used in semiconductors, microchips, integrated circuits, smartphones, computers etc. Silicon is the key platform for semiconductor gadgets. A wafer is just but a thin slice of the semiconductor material that acts as a substratum for microelectronic devices fitted in and above the wafer.

Prime CZ-Si Wafer, Size: 2”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 280 ± 25 μm

Price range: $57.00 through $688.00
Select options This product has multiple variants. The options may be chosen on the product page
1 piece/51 € 5 pieces/155 € 25 pieces/615 € Please contact us for quotes on larger quantities !!!

Prime CZ-Si Wafer

Size: 2”, Orientation: (100), Boron Doped, 1-Side Polished

Technical Properties:

Quality Prime
Materials CZ-Si
Size (inch) 2”
Orientation (100)
Coating
Thickness (μm) 280 ± 25
Doping Boron
Resistivity (ohm.cm) 1-10
Polished One Side
Silicon is one of the most common elements on earths crust. Main usage of Silicon wafers is electronics and technology. Silicon wafers have very flat and mirror like surfaces. It is produced by Czochralski method to obtain the highest purity. Depending on the usage area, silicon wafers can be doped with different materials to tailor its purity accordingly. The amount and type of dopants highly affect the electronic properties. Galium, indium, boron and nitrogen are some of the dopants that can be used in production process. Silicon wafers are used in semiconductors, microchips, integrated circuits, smartphones, computers etc. Silicon is the key platform for semiconductor gadgets. A wafer is just but a thin slice of the semiconductor material that acts as a substratum for microelectronic devices fitted in and above the wafer.

Prime CZ-Si Wafer, Size: 2”, Orientation: (111), Arsenic Doped, Resistivity: 0,001-,0.005 (ohm.cm), 1-Side Polished, Thickness: 400 ± 25 μm

Price range: $57.00 through $688.00
Select options This product has multiple variants. The options may be chosen on the product page
1 piece/51 € 5 pieces/155 € 25 pieces/615 € Please contact us for quotes on larger quantities !!!

Prime CZ-Si Wafer

Size: 2”, Orientation: (111), Arsenic Doped, 1-Side Polished

Technical Properties:

Quality Prime
Materials CZ-Si
Size (inch) 2”
Orientation (111)
Coating
Thickness (μm) 400 ± 25
Doping Arsenic
Resistivity (ohm.cm) 0,001-,0.005
Polished One Side
Silicon is one of the most common elements on earths crust. Main usage of Silicon wafers is electronics and technology. Silicon wafers have very flat and mirror like surfaces. It is produced by Czochralski method to obtain the highest purity. Depending on the usage area, silicon wafers can be doped with different materials to tailor its purity accordingly. The amount and type of dopants highly affect the electronic properties. Galium, indium, boron and nitrogen are some of the dopants that can be used in production process. Silicon wafers are used in semiconductors, microchips, integrated circuits, smartphones, computers etc. Silicon is the key platform for semiconductor gadgets. A wafer is just but a thin slice of the semiconductor material that acts as a substratum for microelectronic devices fitted in and above the wafer.

Zinc Oxide (ZnO) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125”

$687.00

Product 

Zinc Oxide (ZnO) Sputtering Targets, indium, Purity: 99.9%, Size: 1'', Thickness: 0.125''

CAS No.

1314-13-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 (ZnO) (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

81.38 g/mol

Melting Point

1975 °C

Boiling Point

N/A

Density

5.61 g/cm³

Product Codes

NCZ-1499K

Boron Oxide Nanoparticles/ Nanopowder ( B2O3, 99.5%, 80nm)

Price range: $293.00 through $687.00
Select options This product has multiple variants. The options may be chosen on the product page
$293/25g
$687/100g

Product 

Boron Oxide Nanoparticles/ Nanopowder ( B2O3, 99.5%, 80nm)

CAS No.

1303-86-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

80nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

69.62 g/mol

Melting Point

~450 °C (softens and flows)

Boiling Point

~1,860 °C

Density

~2.46 g/cm³

Product Codes

NCZ-1101K

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250”

$686.00

Product 

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 3'', Thickness: 0.250''

CAS No.

 10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

24.82 g/mol

Melting Point

~2973 °C

Boiling Point

N/A

Density

~2.1 g/cm³

Product Codes

NCZ-2370K

Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125”

$686.00

Product 

Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 3'', Thickness: 0.125''

CAS No.

25583-20-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

61.88 g/mol

Melting Point

 ~2950 °C

Boiling Point

~4300 °C

Density

5.22 g/cm³

Product Codes

NCZ-1603K

Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125”

$686.00

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.

Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125”, White to Gray

$684.00

Product 

Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.9%, Size: 3'', Thickness: 0.125'', White to Gray

CAS No.

 12033-89-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 140.28 g/mol

Melting Point

 ~1900 °C

Boiling Point

N/A

Density

~3.2 g/cm³

Product Codes

NCZ-1696K

Silver (Ag) Sputtering Target

Price range: $189.00 through $684.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Silver (Ag) Sputtering Target

CAS No.

7440-22-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

107.8682 g/mol

Melting Point

 961.78 °C

Boiling Point

2,162 °C

Density

10.49 g/cm³

Product Codes

NCZ-1304K

Lithium Carbonate (Battery Grade, Li2CO3) Purity ≥99.5%

Price range: $43.00 through $684.00
Select options This product has multiple variants. The options may be chosen on the product page
APPLICATION AREAS Lithium carbonate is a lithium salt with the chemical formula Li2CO3. Battery-grade lithium carbonate is primarily used to produce Li-ion battery cathode materials, such as lithium cobalt oxide (LCO), lithium manganate oxide (LMO), lithium iron phosphate (LFP), NMC111, NMC442, NMC532, NMC622, as well as alkaline batteries. Battery-grade lithium carbonate is also a key material in LIB electrolytes. Lithium carbonate is widely used in Li-ion batteries, pharmaceuticals, aluminum production, and the processing of metal oxides. In the glass industry, lithium carbonate is used to reduce the melting point of silica used in ovenware glass. In the ceramics industry, lithium carbonate is used to render color and shine.

Borosilicate Wafer, Size: 3”, 1-Side polished, Thickness: 150 ± 25 μm

Price range: $67.00 through $684.00
Select options This product has multiple variants. The options may be chosen on the product page
Boroslicate Wafer Size: 3”, 1-Side polished, Thickness: 150 ± 25 μm Technical Properties: Materials Borosilicate Size(inch) 3” Orientation Coating Thickness (μm)