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Boron Nitride Nanoparticles/ Nanopowder (BN, Hexagonal, 99.5%, 500nm)
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Boron Nitride Nanoparticles/ Nanopowder (BN, Hexagonal, 99.5%, <100nm) (Copy)

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Price range: $87.00 through $340.00
Select options This product has multiple variants. The options may be chosen on the product page
$87/100g
$184/500g
$340/kg

Product 

 Boron Nitride Nanoparticles/ Nanopowder (BN, Hexagonal, 99.5%, 500nm)

CAS No.
10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

500nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

>2,973 °C (sublimes without melting)

Boiling Point

Sublimes at ~2,973 °C

Density

 ~2.1–2.3 g/cm³

Product Codes

NCZ-1104K
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Carbon (C) Sputtering Targets, indium, Purity: 99.999%, Size: 1”, Thickness: 0.125”

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$339.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 1'', Thickness: 0.125''
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Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125”

$338.00
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Product 

 Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.99%, Size: 1'', Thickness: 0.125''

CAS No.
 1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 101.96 g/mol

Melting Point

 ~2,072 °C

Boiling Point

~2,977 °C

Density

 ~3.97–3.98 g/cm³

Product Codes

NCZ-2550K
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Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 1'', Thickness: 0.250''
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Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250”

$338.00
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Product 

 Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 1'', Thickness: 0.250''

CAS No.

1314-98-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 (ZnS) (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 97.45 g/mol

Melting Point

~1700 °C

Boiling Point

N/A

Density

  4.09 g/cm³

Product Codes

NCZ-1508K
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Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125”

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$338.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”

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$338.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Iron (Fe) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125”

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$338.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Aluminum (Al) Micron Powder, Purity: 99.95 %, Size: 80 µm

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Price range: $19.00 through $338.00
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25 grams/18 € 100 grams/53 €    500 grams/157 €    1000 grams/299 € 
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Aluminum (Al) Micron Powder

Purity: 99.95 %, Size: 80 µm

Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 1'', Thickness: 0.125''
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Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 1”, Thickness: 0.125”

$337.00
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Product 

 Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 1'', Thickness: 0.125''

CAS No.
1308-38-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  151.99 g/mol

Melting Point

 2,435 °C

Boiling Point

 ~3,000 °C (approximate; may decompose before boiling)

Density

 5.21 g/cm³

Product Codes

NCZ-2306K
Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 6'', Thickness: 0.125''
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Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.125”

$337.00
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Product 

 Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 6'', Thickness: 0.125''

CAS No.

 7439-98-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 95.95 g/mol

Melting Point

 2623 °C

Boiling Point

 4639 °C

Density

 10.28 g/cm³

Product Codes

NCZ-1933K
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Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.125''
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Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125”

$337.00
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Product 

 Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.125''

CAS No.

ZnO: 1314-13-2 Al₂O₃: 1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

ZnO + Al₂O₃ (AZO)(black granules) (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ZnO: 81.38 g/mol Al₂O₃: 101.96 g/mol

Melting Point

~1975 °C

Boiling Point

N/A

Density

 ~5.6 g/cm³

Product Codes

NCZ-1491K
Cerium Oxide doped with Gadolinium Nanoparticles (10mol%Gd2O3+90mol%CeO2, 99.9%,
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Cerium Oxide doped with Gadolinium Nanoparticles (10mol%Gd2O3+90mol%CeO2, 99.9%, <100 nm)

Price range: $133.00 through $337.00
Select options This product has multiple variants. The options may be chosen on the product page
$133/25g $337/100g
Product Cerium Oxide doped with Gadolinium Nanoparticles (10mol%Gd2O3+90mol%CeO2, 99.9%, <100 nm)
CAS No. 1306-38-3
Appearance White or pale yellow powder
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 100 nm (Size Can be customized),  Ask for other available size range.
Ingredient CeO2
Molecular Weight 177.38 g/mol
Melting Point 2400°C
Boiling Point N/A
Density 7.2g/cm³
Product Codes NCZ-105R
Cerium Oxide Nanoparticles / Nanopowder doped with Gadolinium
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Cerium Oxide Nanoparticles / Nanopowder doped with Gadolinium

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Price range: $133.00 through $337.00
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$133/25g
$337/100g

Product 

 Cerium Oxide Nanoparticles / Nanopowder doped with Gadolinium

CAS No.
N/A

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

<100 nm(Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 172.11 g/mol

Melting Point

 ~2,400 °C

Boiling Point

~3,500 °C

Density

 ~7.13 g/cm³

Product Codes

NCZ-1121K
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Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125”

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$337.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum (Al) Micron Powder
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Aluminum (Al) Micron Powder, Purity: 99.9 %, Size: 3 µm

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Price range: $16.00 through $337.00
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25 grams/15 € 100 grams/49 € 500 grams/149 € 1000 grams/298 €
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Aluminum (Al) Micron Powder

Purity: 99.9 %, Size: 3 µm

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Zirconium Oxide (ZrO2) Nanopowder/Nanoparticles Water Dispersion, Size: 40-50 nm, 22 wt%

Price range: $27.00 through $337.00
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25 ml/24 € 50 ml/38 € 100 ml/65 € 500 ml/195 € 1000 ml/298 €
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Zirconium Oxide (ZrO2) Nanopowder/Nanoparticles Water Dispersion

Size: 40-50 nm, 22 wt%

Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 4'', Thickness: 0.125''
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Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125”

$336.00
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Product 

 Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 4'', Thickness: 0.250''

CAS No.

7782-49-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  78.96 g/mol

Melting Point

 221 °C

Boiling Point

 685 °C

Density

  4.81 g/cm³

Product Codes

NCZ-1768K
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Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Gamma, Purity: 99.55%, Size: 78 nm, Hydrophilic

Price range: $6.00 through $336.00
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1 gram/6 € 5 grams/10 € 25 grams/39 € 100 grams/89 € 500 grams/219 € 1000 grams/296 €       
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Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles

Gamma, Purity: 99.55%, Size: 78 nm, Hydrophilic

Applications:

Aluminum oxide nanoparticles show high hardness and high dimensional stability. It is used to improve toughness, wear resistance, thermal fatigue resistance, and ceramic density for rubber, plastics, and ceramics. It is used in high strength aluminum oxide ceramic, high purity crucibles, furnace tubes, and cutting tools. It is added to metal products, semiconductors, tapes, polishing materials, and glass products. Aluminum oxide nanoparticles have excellent properties for far infrared emission. It is used in fiber fabric products and high pressure sodium lamp as far-infrared emission and thermal insulation materials. In addition it is used in the field of catalysis as catalyst or catalyst carrier.
Magnesium borate whisker(Mg2B2O5, L/D≥10) (121665)
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Magnesium borate whisker(Mg2B2O5, L/D≥10) (121665)

$335.00
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Magnesium borate whisker(Mg2B2O5, L/D≥10) (121665)
Test Items Specifications
Mg2B2O5 ≥99%
Acid insoluble matter ≤0.5%
Water content ≤0.5%
L/D ≥10
 
Product Codes- NCZ-2754K
Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 2'', Thickness: 0.125''
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Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125”

$335.00
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 Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 2'', Thickness: 0.125''

CAS No.
7440-39-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 137.327 g/mol

Melting Point

  727 °C

Boiling Point

 1845 °C

Density

  3.51 g/cm³

Product Codes

NCZ-2491K
Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 2'', Thickness: 0.250''
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Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250”

$335.00
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Product 

 Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 2'', Thickness: 0.250''

CAS No.
7440-39-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 137.327 g/mol

Melting Point

  727 °C

Boiling Point

 1845 °C

Density

  3.51 g/cm³

Product Codes

NCZ-2490K
Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 4'', Thickness: 0.125''
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Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125”

$334.00
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Product 

 Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 4'', Thickness: 0.125''

CAS No.
 7429-90-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  26.98 g/mol

Melting Point

  660.3 °C

Boiling Point

 2519 °C

Density

  2.70 g/cm³

Product Codes

NCZ-2573K
Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 3'', Thickness: 0.125''
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Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125”

$334.00
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Product 

 Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 3'', Thickness: 0.125''

CAS No.

7782-49-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  78.96 g/mol

Melting Point

 221 °C

Boiling Point

 685 °C

Density

  4.81 g/cm³

Product Codes

NCZ-1770K
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Mesocarbon Microbeads (MCMB) Graphite Micron Powder for Lithium Ion Battery

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Price range: $190.00 through $334.00
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500 grams/168 € 1000 grams/295 €
Please contact us for quotes on larger quantities !!!

Mesocarbon Microbeads (MCMB) Graphite Micron Powder for Lithium Ion Battery

SSA: 1.539 m2/g, Black Powder

MCMB (mesocarbon microbeads) synthetic graphite is prepared from petroleum pitch or coal tar. MCMB is one of the promising carbon anode materials for Li-ion batteries. MCMB has high specific capacity and a spherical structure, which is benefitial for high packing density of the anode. The low surface area of MCMB can minimize the unfavorable side reactions during the charge-discharge process. We offer Mesocarbon Microbeads(MCMB) Graphite Micron Powder for Lithium Ion Battery with low prices.

Technical Properties:

Appearance of MCMB Black Powder
Linear Formula C
CAS Number of MCMB 7782-42-5
Packed Container sealed in Al vacuumed bag
 
 D10  µm  7.195
 D50  µm  11.440
 D90  µm  18.000
 Moisture  %  0.025
 Tap  G/cm3  1.215
 SSA  M2/g  1.539
 C%  %  99.945
 Capacity  mAh/g  332.66
 Efficiency  %  92.48
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Highly Conductive Expanded Graphite Micron Powder, Purity: ≥ 96%, Size: 70 µm

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Price range: $32.00 through $334.00
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25 grams/29 € 100 grams/68 € 500 grams/197 € 1 kg/295 €
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Highly Conductive Expanded Graphite Micron Powder

Purity: ≥ 96%, Size: 70 µm

Expanded graphite powder is composed of natural flake graphite through chemical or electro-chemical treatment process. Expanded graphite has all the outstanding characteristics of natural crystalline graphite with high temperature resistance, corrosion resistance, and self-lubricity. Highly conductive expanded graphite powder is enormously conductive additive with unique thermal and electrical conductivity. It is used in a wide variety of applications where thermal conductivity is essential.

Technical Properties:

D₅₀ (µm)

70
Powder Density (g/l)

120
Carbon Content (%) (at 800 °C; 20 h)

≥ 96
Moisture Content (%) (at 110 °C; 8 h)

≤ 5

Applications:

Thermally conductive plastics; adhesives; sealants; or as in inorganic materials, e. g. molds in foundry technology; electric/antistatic applications; mechanical applications; manufacturing graphite foil, graphite braided packings and other sealing products; fire retardant additive in plastics and fire retardant foams for insulation; coating; and so on.  
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Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 35 nm, Metal Basis

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Price range: $167.00 through $334.00
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Copper (Cu) Nanopowder/Nanoparticles

Purity: 99.95%, Size: 35 nm, Metal Basis

Technical Properties:

Bulk Density (g/cm3) 0,19
True Density (g/cm3) 8,9
Color warm copper brown
Shape spherical
Crystal Structure cubic
Average Particle Size (nm) 35
Specific Surface Area (m2/g) 11,0-15,0
Elemental Analysis Cu Fe Ni Others
≥99.95 ≤0.006 ≤0.005 ≤0.002

Properties, Storage and Cautions:

Copper nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.
Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 3'', Thickness: 0.125''
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Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125”

$333.00
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Product 

 Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 3'', Thickness: 0.125''

CAS No.

7440-62-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 50.9415 g/mol

Melting Point

1910 °C

Boiling Point

3407 °C

Density

 6.11 g/cm³

Product Codes

NCZ-1548K
Silicon Oxide Nanoparticles / Nanopowder modified with double layer
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Silicon Oxide Nanoparticles / Nanopowder modified with double layer

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Price range: $70.00 through $333.00
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$70/25g
$133/100g
$333/500g

Product 

 Silicon Oxide Nanoparticles / Nanopowder modified with double layer

CAS No.

7631-86-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 10-20nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 60.08 g/mol

Melting Point

~1,710 °C (core SiO₂)

Boiling Point

~2,230 °C

Density

 ~2.1 – 2.2 g/cm³

Product Codes

NCZ-1170K
Silicon Oxide Nanoparticles / Nanopowder modified with double bond
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Silicon Oxide Nanoparticles / Nanopowder modified with double bond

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Price range: $70.00 through $333.00
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$70/25g
$133/100g
$333/500g

Product 

 Silicon Oxide Nanoparticles / Nanopowder modified with double bond

CAS No.

7631-86-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 10-20nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 60.08 g/mol

Melting Point

~1,710 °C (core SiO₂)

Boiling Point

~2,230 °C

Density

 ~2.1 – 2.2 g/cm³

Product Codes

NCZ-1169K
Silicon Oxide Nanoparticles/ Nanopowder Modified with amino group
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Silicon Oxide Nanoparticles/ Nanopowder Modified with amino group

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Price range: $70.00 through $333.00
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$70/25g
$133/100g
$333/500g

Product 

 Silicon Oxide Nanoparticles/ Nanopowder Modified with amino group

CAS No.

7631-86-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 10-20nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 60.08 g/mol

Melting Point

~1,710 °C (core SiO₂)

Boiling Point

~2,230 °C

Density

 ~2.1 – 2.2 g/cm³

Product Codes

NCZ-1167K
Tungsten (W) nanoparticles/nanopowder ( W, 99.7%, 80~100nm)
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Tungsten (W) nanoparticles/nanopowder ( W, 99.7%, 80~100nm)

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Price range: $111.00 through $333.00
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$111/25g
$333/100g

Product 

 Tungsten (W) nanoparticles/nanopowder ( W, 99.7%, 80~100nm)

CAS No.
7440-33-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

80~100nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

183.84 g/mol

Melting Point

3,422 °C

Boiling Point

5,555 °C

Density

 19.3 g/cm³

Product Codes

NCZ-1082K
Molybdenum Nanoparticles/ Mo Nanopowder ( 99.7%, 40~60nm)
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Molybdenum Nanoparticles/ Mo Nanopowder ( 99.7%, 40~60nm)

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Price range: $116.00 through $333.00
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$116/25g
$333/100g

Product 

Molybdenum Nanoparticles/ Mo Nanopowder ( 99.7%, 40~60nm)

CAS No.
7439-98-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

40~60nm (microns) (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

95.95 g/mol

Melting Point

2623 °C

Boiling Point

4639 °C

Density

10.28 g/cm³

Product Codes

NCZ-1048K
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Antimony (Sb) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250”

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$333.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance, There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering. Group 15 of the periodic table contains antimony (Sb), which shares an atomic number of 51 with bismuth and arsenic. It is bluish-white in color and has a gleaming metallic sheen. While antimony does not have the same negative image as arsenic, its chemical characteristics are generally fairly comparable to that of arsenic. Its average natural abundance in the earth's crust is 0.2 to 0.5 parts per million. Antimony exhibits excellent fire resistance.
Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 1'', Thickness: 0.250''
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Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250”

$332.00
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Product 

 Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 1'', Thickness: 0.250''

CAS No.

12136-78-6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 152.11 g/mol

Melting Point

 ~2030 °C

Boiling Point

 ~2300 °C to 2500 °C

Density

 ~6.26 g/cm³

Product Codes

NCZ-1928K
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Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250”

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$332.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125”

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$332.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Tin (Sn) Sputtering Targets, elastomer, Purity: 99.99%, Size: 1”, Thickness: 0.125”

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$332.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Indium Tin Oxide/ITO (In203:Sn02) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250”

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$332.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 3'', Thickness: 0.250''
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Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250”

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Product 

 Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 3'', Thickness: 0.250''

CAS No.

11137-91-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~57.9 g/mol

Melting Point

~1,350–1,450 °C

Boiling Point

N/A

Density

  ~8.5 g/cm³

Product Codes

NCZ-1825K
Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 2'', Thickness: 0.250''
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Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 2”, Thickness: 0.250”

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Product 

 Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 2'', Thickness: 0.250''

CAS No.

7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 28.0855 g/mol

Melting Point

 1,414 °C

Boiling Point

3,265 °C

Density

  2.33 g/cm³

Product Codes

NCZ-1764K
99.9wt% Hierarchical Porous Silica Microspheres Powder, 400 nm-900 nm
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99.9wt% Hierarchical Porous Silica Microspheres Powder, 400 nm-900 nm

Price range: $180.00 through $330.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 99.9wt% Hierarchical Porous Silica Microspheres Powder, 400 nm-900 nm
CAS No. 7631-86-9
Appearance White or off-white fine
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 400-900nm (Size Can be customized),  Ask for other available size range.
Ingredient SiO₂
Molecular Weight 60.08 g/mol
Melting Point N/A
Boiling Point N/A
Density 2.0–2.2 g/cm³
Product Codes NCZ-271I
99.99% 4N 20 nm Gamma Aluminum Oxide (Alumina) Al2O3 Powder, 500 g
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99.99% 4N 20 nm Gamma Aluminum Oxide (Alumina) Al2O3 Powder, 500 g

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Product 99.99% 4N 20 nm Gamma Aluminum Oxide (Alumina) Al2O3 Powder, 500 g
CAS No. 1344-28-1
Appearance White to off-white
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 20nm (Size Can be customized),  Ask for other available size range.
Ingredient Al2O3
Molecular Weight 101.96 g/mol
Melting Point N/A
Boiling Point N/A
Density 3.6 g/cm³
Product Codes NCZ-239I
 
Iron Nanoparticles/ Nanopowder ( Fe, 99.7%, 100~130nm)
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Iron Nanoparticles/ Nanopowder ( Fe, 99.7%, 100~130nm)

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Price range: $110.00 through $330.00
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$110/25g
$330/100g

Product 

Iron Nanoparticles/ Nanopowder ( Fe, 99.7%, 100~130nm)

CAS No.
7439-89-6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

100~130nm (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

63.55 g/mol

Melting Point

1084.62 °C

Boiling Point

2562 °C

Density

8.96 g/cm³

Product Codes

NCZ-1043K
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Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125”

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$330.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance, the

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

The metal bismuth is silvery with a hint of pink and is fragile. Both in air and water, it is stable. Despite having poor thermal and electrical qualities, bismuth is used to create fusible alloys, a class of materials with low melting points that can be used in a variety of applications, such as thermal fuses and solders. Because pure bismuth exhibits a high absorption of gamma rays, it can be used as a window or filter for these particles while allowing neutrons to pass through.

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Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125”

, , ,
$330.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer.

Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance, the

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

The metal bismuth is silvery with a hint of pink and is fragile. Both in air and water, it is stable. Despite having poor thermal and electrical qualities, bismuth is used to create fusible alloys, a class of materials with low melting points that can be used in a variety of applications, such as thermal fuses and solders. Because pure bismuth exhibits a high absorption of gamma rays, it can be used as a window or filter for these particles while allowing neutrons to pass through.

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Fullerene-C60, Purity: 95%

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Price range: $75.00 through $330.00
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1 gram/67 € 5 grams/295 € Please contact us for quotes on larger quantities.

Fullerene-C60

Purity: 95% 

Technical Properties:

Fullerene Compound Formula C60
Fullerene  Molecular Weight 720.64
Fullerene  Size Diameter: 0.8 nm, Length: 1.2 nm
Fullerene  Purity 95%
Fullerene  Melting Point >280 °C
Fullerene  True Density 1.71 g/cm3
Fullerene  Electrical Resistivity 1034 ohms m-1
Fullerene  Appearance Shinning Black
Fullerene  CAS 99685-96-8 

Applications:

1. Pharmaceutical: Diagnostic reagents, super drugs, cosmetics, nuclear magnetic resonance (NMR) with the developer. DNA affinity 2. Energy: Solar battery, fuel cell, secondary battery. 3. Industry: Wear resistant material, flame retardant materials, lubricants, polymer additives, high-performance membrane, catalyst, artificial diamond, hard alloy, electric viscous fluid, ink filters, high-performance coatings, fire retardant coatings, manufacturing bioactive materials , memory materials, embedded molecular and other characteristics, composite materials etc. 4. Information industry: Semiconductor record medium, magnetic materials, printing ink, toner, ink, paper special purposes. 5. Electronic parts: Superconducting semiconductor, diodes, transistors, inductor.  , 6. Optical materials, electronic camera, fluorescence display tube, nonlinear optical materials. 7. Environment: Gas adsorption, gas storage.
Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 3'', Thickness: 0.250''
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Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250”

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Product 

 Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 3'', Thickness: 0.250''

CAS No.
7440‑69‑9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

1 – 5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~208.98 g/mol

Melting Point

  271.4 °C

Boiling Point

~1560 °C

Density

  ~9.78–9.80 g/cm³

Product Codes

NCZ-2435K
Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 3'', Thickness: 0.125''
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Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 3”, Thickness: 0.125”

$328.00
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Product 

 Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 3'', Thickness: 0.125''

CAS No.

7439‑92‑1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  207.2 g/mol

Melting Point

~327.5 °C

Boiling Point

~1,740 °C

Density

  ~11.34 g/cm³

Product Codes

NCZ-2074K
Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 5'', Thickness: 0.250''
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Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.250”

$328.00
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Product 

 Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 5'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

  8.90 g/cm³

Product Codes

NCZ-1874K
Boron (B)
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Boron (B) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”

, , ,
$328.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Zirconium Oxide (ZrO2) Nanopowder/Nanoparticles Water Dispersion, Size: 40-50 nm, 22 wt%

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Price range: $26.00 through $328.00
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25 ml/24 € 50 ml/38 € 100 ml/65 € 500 ml/195 € 1000 ml/298 €
Please contact us for quotes on larger quantities !!!

Zirconium Oxide (ZrO2) Nanopowder/Nanoparticles Water Dispersion

Size: 40-50 nm, 22 wt%

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Cobalt Chromium (Co-Cr) Alloy Powder, Size: < 44 µm, Co: 20%, Cr: 80%

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Price range: $107.00 through $328.00
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100 grams/95 €                     
500 grams/174 €                    
1000 grams/290 € Please contact us for quotes on larger quantities !!!

Cobalt Chromium (Co-Cr) Alloy Powder

Size: < 44 µm, Co: 20%, Cr: 80%

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Cobalt Chromium (Co-Cr) Alloy Powder, Size: < 44 µm, Co: 20%, Cr: 80%

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Price range: $107.00 through $328.00
Select options This product has multiple variants. The options may be chosen on the product page
100 grams/95 €                     
500 grams/174 €                    
1000 grams/290 € Please contact us for quotes on larger quantities !!!

Cobalt Chromium (Co-Cr) Alloy Powder

Size: < 44 µm, Co: 20%, Cr: 80%

Yttrium Oxide Micron Powder (Y2O3, 99.995%, 1~2um)
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Yttrium Oxide Micron Powder (Y2O3, 99.995%, 1~2um)

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Price range: $117.00 through $327.00
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$117/100g
$280/500g
$327/Kg

Product 

 Yttrium Oxide Micron Powder (Y2O3, 99.995%, 1~2um)

CAS No.

1314-36-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 1~2um (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 225.81 g/mol

Melting Point

~2,430 °C

Boiling Point

~4,300 °C

Density

 ~5.01 g/cm³

Product Codes

NCZ-1211K
Titanium Oxide Nanoparticles / Nanopowder (TiO2, Rutile, 99.5%, 20~40nm, Coated with SiO2, highly Hydrophilic)
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Titanium Oxide Nanoparticles / Nanopowder (TiO2, Rutile, 99.5%, 20~40nm, Coated with SiO2, highly Hydrophilic)

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Price range: $105.00 through $327.00
Select options This product has multiple variants. The options may be chosen on the product page
  $105/100g $225/500g
$327/1kg

Product 

 Titanium Oxide Nanoparticles / Nanopowder (TiO2, Rutile, 99.5%, 20~40nm, Coated with SiO2, highly Hydrophilic)

CAS No.

 13463-67-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

  20~40nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 79.87 g/mol

Melting Point

~1,843 °C

Boiling Point

~2,972 °C

Density

 ~4.23 g/cm³

Product Codes

NCZ-1199K
Carbon Powder (C, 99.99%, 20-50 micron)
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Carbon Powder (C, 99.99%, 20-50 micron)

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Price range: $90.00 through $327.00
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$90/100g $327/500g

Product 

Carbon Powder (C, 99.99%, 20-50 micron)

CAS No.
7440-44-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

20-50 micron (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

12.01 g/mol

Melting Point

~ 3,900 °C

Boiling Point

~600–800 °C

Density

~1.8–2.1 g/cm³

Product Codes

NCZ-1029K
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Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”

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$327.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125”

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$327.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Selenium (Se) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250”

, ,
$327.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.125''
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Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”

$326.00
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Product 

 Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.125''

CAS No.
12058-85-6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 157.87 g/mol

Melting Point

  Approx. 1400 °C (decomposes)

Boiling Point

N/A

Density

  ~4.7 g/cm³

Product Codes

NCZ-2363K