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99.99% Alpha Alumina Polishing Powder Nanoparticles, 1kg
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99.99% Alpha Alumina Polishing Powder Nanoparticles, 1kg

Price range: $121.00 through $396.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 99.99% Alpha Alumina Polishing Powder Nanoparticles, 1kg
CAS No. 10115-40-1
Appearance White to off-white
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 20–50nm  (Size Can be customized),  Ask for other available size range.
Ingredient Al₂O₃
Molecular Weight N/A
Melting Point 2072 °C
Boiling Point N/A
Density 3.95 g/cm³
Product Codes NCZ-250I
 
10mL Silver (Ag) Nanoparticle Water Dispersion, 0.1mg/mL
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10mL Triangular Gold (Au) Nanoplates Water Dispersion, 140±25nm

$396.00
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Product 10mL Triangular Gold (Au) Nanoplates Water Dispersion, 140±25nm
CAS No. 7440-22-4
Appearance Deep red, purple, violet, or blue
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 140 ± 25nm (Size Can be customized),  Ask for other available size range.
Ingredient Au
Molecular Weight 196.97 g/mol
Melting Point 1064 °C
Boiling Point 2966 – 3080 °C
Density 19.32 g/cm³
Product Codes NCZ-131I
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125”

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$396.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation.

In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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QUICK VIEW Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”

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$396.00
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Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.
Sodium Hyaluronate(powder, Eyedrop grade, ≥95%) (337644)
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Sodium Hyaluronate(powder, Eyedrop grade, ≥95%) (337644)

$395.00
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Sodium Hyaluronate(powder, Eyedrop grade, ≥95%) (337644)
  Specifications
Test Items Standard
Appearance White powder
Hyaluronic acid ≥95%
Molecular weight (0.5-1.0) x 106
Chlorides ≤0.5
pH 5.5-8.0
Iron <80ppm
Loss on drying ≤10%
Protein ≤0.1%
Nitrogen 3.0%-4.0%
Heavy metal ≤10ppm
Bacterial counts ≤100cfu/g
Mold and Yeast ≤10cfu/g
Endotoxin ≤0. 5eu/mg
Nucleic Acids (A260nm) <0.5
Sterile Test Complies
    Product Codes- NCZ-2704K
Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 4'', Thickness: 0.250''
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Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 4”, Thickness: 0.250”

$395.00
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Product 

 Lead (Pb) Sputtering Targets, Purity: 99.99+%, Size: 4'', Thickness: 0.250''

CAS No.

7439‑92‑1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  207.2 g/mol

Melting Point

~327.5 °C

Boiling Point

~1,740 °C

Density

  ~11.34 g/cm³

Product Codes

NCZ-2071K
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Aluminum-Silicon Alloy Powder (Al-Si, 1-2 micron)

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Price range: $115.00 through $395.00
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$115/100g
$260/500g
$395/1000g

Product 

Aluminum-Silicon Alloy Powder (Al-Si, 1-2 micron)

CAS No.

24304-00-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

1-2 micron (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

40.982 g/mol

Melting Point

2200 °C

Boiling Point

2517 °C

Density

3.3 g/cm³

Product Codes

NCZ-1014K
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Samarium Oxide (Sm2O3) Nanopowder/Nanoparticles, Purity: 99.955%, Size: 13-47 nm

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Price range: $25.00 through $395.00
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Applications:

Samarium Oxide nanoparticles is used in high permittivity ceramics for dielectric resonators and substrates. It is used in nuclear reaction piles as structural and shielding materials. It is also used as a component material for making gas sensors, catalysts, and solid oxide fuel cell.
Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 3'', Thickness: 0.125''
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Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125”

$394.00
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Product 

 Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 3'', Thickness: 0.125''

CAS No.
7440-56-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  72.63 g/mol

Melting Point

  938.3 °C

Boiling Point

2,833 °C

Density

  5.32 g/cm³

Product Codes

NCZ-2240K
Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 6'', Thickness: 0.250''
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Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250”

$394.00
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Product 

 Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 6'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

  8.90 g/cm³

Product Codes

NCZ-1869K
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Titanium Nitride (TiN) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250”

, , ,
$394.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 8”, Thickness: 0.125”

, , ,
$394.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Tellurium (Te) Micron Powder Purity: 99.95 %, Size: 325 mesh

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Price range: $9.00 through $394.00
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1 gram/8 € 5 grams/30 € 25 grams/98 € 100 grams/350 €
Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 1'', Thickness: 0.250''
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Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 1”, Thickness: 0.250”

$393.00
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Product 

 Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 1'', Thickness: 0.250''

CAS No.
1308-38-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  151.99 g/mol

Melting Point

 2,435 °C

Boiling Point

 ~3,000 °C (approximate; may decompose before boiling)

Density

 5.21 g/cm³

Product Codes

NCZ-2305K
Silicon Powder (Si, 99.99%, -325mesh)
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Silicon Powder (Si, 99.99%, -325mesh)

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Price range: $115.00 through $393.00
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$115/100g
$215/500g
$393/kg

Product 

 Silicon Powder (Si, 99.99%, -325mesh)

CAS No.
7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

-325mesh (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

28.0855 g/mol

Melting Point

1,414 °C

Boiling Point

3,265 °C

Density

 ~2.33 g/cm³

Product Codes

NCZ-1072K
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Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125”

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$393.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125”

, , ,
$393.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Poly(DL-lactide-co-glycolide)(PLGA75/25) (621989)
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Poly(DL-lactide-co-glycolide)(PLGA75/25) (621989)

$392.00
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Poly(DL-lactide-co-glycolide)(PLGA75/25) (621989)
Grade Inherent viscosity (d L/g) Weight average molecular weight ("10000)
PLGA75/25-02 0.1-0.2 0.7-2
PLGA75/25-04 0.2-0.4 2-5
PLGA75/25-06 0.4-0.5
PLGA75/25-08 0.6-0.8 7-10
PLGA75/25-10 0.8-1 0 10-13
PLGA75/25-12 1.0 1 2 13 20
PLGA75/25-15 1.2-1.5 20-30
Product Codes- NCZ-2636K
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Poly(DL-lactide-co-glycolide)(PLGA50/50) (611989)
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Poly(DL-lactide-co-glycolide)(PLGA50/50) (611989)

$392.00
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Poly(DL-lactide-co-glycolide)(PLGA50/50) (611989)
Grade Inherent viscosity (dL/g) Weight average molecular weight (x10000)
PLGA50/50-02 0.1-0.2 0.7-2
PLGA50/50-04 0.2-0.4 2 5
PLGA50/50-06 0.4-0.6
PLGA50/50-08 0.6-0.8 7-10
PLGA50/50-10 0.8-1.0 10-13
Product Codes- NCZ-2635K
Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 4'', Thickness: 0.250''
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Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250”

$392.00
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 Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 4'', Thickness: 0.250''

CAS No.
7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 63.55 g/mol

Melting Point

 1,084 °C

Boiling Point

 2,562 °C

Density

 8.96 g/cm³

Product Codes

NCZ-2259K
High Purity 99.99% Quartz Rods
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High Purity 99.99% Quartz Rods

Price range: $5.00 through $392.00
Select options This product has multiple variants. The options may be chosen on the product page
Product High Purity 99.99% Quartz Rods
CAS No. 60676-86-0
Appearance Transparent or translucent
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1-50mm (Size Can be customized),  Ask for other available size range.
Ingredient SiO₂
Molecular Weight 60.08 g/mol
Melting Point 1710 °C
Boiling Point 1665 °C
Density 2.2 g/cm³
Product Codes NCZ-401I
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Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125”

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$392.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”, Grey to Black

, , ,
$392.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Tantalum (Ta) Sputtering Targets, elastomer, Purity: 99.95%, Size: 2”, Thickness: 0.125”

, , ,
$392.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Magnesium Oxide (MgO) Nanopowder/Nanoparticles Ethanol Dispersion, Size: 45 nm, 22 wt%

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Price range: $60.00 through $392.00
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Magnesium Oxide (MgO) Nanopowder/Nanoparticles Ethanol Dispersion Size: 45 nm, 22 wt%
beta-Arbutin (439513)
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beta-Arbutin (439513)

$391.00
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beta-Arbutin (439513)
Synonym  Arbutine, arbutin, ursin Chemical name 4-Hydroxyphenyl-beta-D-glucopyranoside CAS# 497-76-7 Physical and chemical properties Appearance: White powder. Infrared signature peak: 1515cm-1 1220cm-1 1050±(5~8)cm-1 Melting point/Melting range:195~199℃. Boiling point/Boiling range: Not available. pH (1% soln/water): 5.0 ~ 7.0 Solubility: Soluble in water, methanol or alcohol. Partially soluble in cold water. Insoluble in aether, chloroform or benzene. Specification Arbutin more than 99.5%. Hydroquinone less than 10 ppm.
Product Codes- NCZ-2707K
Aluminum Oxide Powder (Alumina, alpha-Al2O3, 99.999%, 0.5-10 um)
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Aluminum Oxide Powder (Alumina, alpha-Al2O3, 99.999%, 0.5-10 um)

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Price range: $130.00 through $391.00
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$135/100g
$282/500g $396/1kg

Product

Aluminum Oxide Powder (Alumina, alpha-Al2O3, 99.999%, 0.5-10 um)
CAS No. 1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

0.5–10 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

101.96 g/mol

Melting Point

2,072°C

Boiling Point

2980 °C (5400 °F)

Density

 3.60g/cm

Product Codes

NCZ-1087K
Silicon Nanoparticles/ Nanopowder (Si, 99% 50~80nm)
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Silicon Nanoparticles/ Nanopowder (Si, 99% 50~80nm)

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Price range: $153.00 through $391.00
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$153/25g
$391/100g

Product 

Silicon Nanoparticles/ Nanopowder (Si, 99% 50~80nm)

CAS No.
7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

50~80nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

28.0855 g/mol

Melting Point

 1,414 °C

Boiling Point

3,265 °C

Density

 ~2.33 g/cm³

Product Codes

NCZ-1066K
Chitosan(from Mushroom) (236555)
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Chitosan(from Mushroom) (236555)

$390.00
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Chitosan(from Mushroom) (236555)

ANALYSIS SPECIFICATION
Deacetylation ≥90%
Appearance White or light yellow powder
pH 7-8
Viscosity in 1% Acetic acid ≥15cps
Mesh size 100% pass 80 mesh
Loss on drying ≤8%
Total ash ≤ 2%
Heavy Metals ≤20.0ppm
As ≤ 2.0ppm
Pb ≤ 1.0ppm
Cd ≤ 0.5ppm
Hg ≤ 0.5ppm
Microbiological quality Total Plate Count Yeast & Mold E.Coli. Salmonella . <1000cfu/g <100cfu/g Negative Negative
  Product Codes- NCZ-2661K
Zinc (Zn) Sputtering Target
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Zinc (Zn) Sputtering Target

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Price range: $70.00 through $390.00
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Product 

 Zinc (Zn) Sputtering Target

CAS No.

7440-66-6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 65.38 g/mol

Melting Point

419.5 °C

Boiling Point

907 °C

Density

  7.14 g/cm³

Product Codes

NCZ-1310K
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Silver Ag Nanoparticles/ Nanopowder (Ag, 99.95%, 100nm)

Price range: $55.00 through $390.00
Select options This product has multiple variants. The options may be chosen on the product page
$55/5g $95/10g $155/25g $390/100g  

Product 

Silver Ag Nanoparticles/ Nanopowder (Ag, 99.95%, 100nm)

CAS No.

24304-00-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

50-100 nm, 1-5 µM, 10-53 µM  (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

40.982 g/mol

Melting Point

2200 °C

Boiling Point

2517 °C

Density

3.3 g/cm³

Product Codes

NCZ-1001K
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Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 8”, Thickness: 0.250”

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$390.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.5%, Size:4”, Thickness: 0.125”

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$390.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125”

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$390.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Iron (Fe) Sputtering Targets, Purity: 99.95%, Size: 1'', Thickness: 0.250''
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Iron (Fe) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125”

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Product 

 Iron (Fe) Sputtering Targets, Purity: 99.99%, Size: 1'', Thickness: 0.125''

CAS No.

 7439-89-6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  55.85 g/mol

Melting Point

 1538 °C

Boiling Point

 2862 °C

Density

  7.87 g/cm³

Product Codes

NCZ-2191K
Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 6'', Thickness: 0.250''
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Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250”

$389.00
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Product 

 Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 6'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

  8.90 g/cm³

Product Codes

NCZ-1870K
Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 8'', Thickness: 0.125''
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Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125”

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Product 

 Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 8'', Thickness: 0.125''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

  8.90 g/cm³

Product Codes

NCZ-1867K
Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 8'', Thickness: 0.125''
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Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 8”, Thickness: 0.125”

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Product 

 Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 8'', Thickness: 0.125''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

  8.90 g/cm³

Product Codes

NCZ-1865K
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Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.125''
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Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125”

$389.00
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Product 

 Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.125''

CAS No.

1314-98-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 (ZnS) (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 97.45 g/mol

Melting Point

~1700 °C

Boiling Point

N/A

Density

  4.09 g/cm³

Product Codes

NCZ-1507K
Carbon (C) Sputtering Targets, indium, Purity: 99.999%, Size: 1'', Thickness: 0.125''
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Carbon (C) Sputtering Targets, indium, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$388.00
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Product 

 Carbon (C) Sputtering Targets, indium, Purity: 99.999%, Size: 1'', Thickness: 0.125''

CAS No.
 7782‑42‑5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 12.01 g/mol

Melting Point

 Sublimates at ~3,652 °C

Boiling Point

Sublimates at ~4,200 °C

Density

  ~2.25 g/cm³

Product Codes

NCZ-2348K
Silicon Dioxide (SiO2) Sputtering Target
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Silicon Dioxide (SiO2) Sputtering Target

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Price range: $105.00 through $388.00
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Product 

 Silicon Dioxide (SiO2) Sputtering Target

CAS No.

7631-86-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  60.08 g/mol

Melting Point

~1,710 °C

Boiling Point

~2,950 °C

Density

 ~2.2–2.65 g/cm³

Product Codes

NCZ-1323K
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Zinc Oxide (ZnO) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125”

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$388.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 5”, Thickness: 0.125”

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$388.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 4”, Thickness: 0.250”

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$388.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Copper (Cu) Micron Powder, Purity: 99.99 %, Size: 325 mesh, Spherical

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Price range: $9.00 through $388.00
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5 grams/8 €  25 grams/28 €  100 grams/94 €  500 grams/174 €  1000 grams/345 €  Please contact us for quotes on larger quantities !!!

Copper (Cu) Micron Powder

Purity: 99.99 %, Size: 325 mesh, Spherical

Boron Nitride Nanoparticles/ Nanopowder (BN, Hexagonal, 99.5%,
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Boron Nitride Nanoparticles/ Nanopowder (BN, Hexagonal, 99.5%, <100nm)

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Price range: $151.00 through $387.00
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$151/25g
$387/100g

Product 

 Boron Nitride Nanoparticles/ Nanopowder (BN, Hexagonal, 99.5%, <100nm)

CAS No.
10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

<100nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

>2,973 °C (sublimes without melting)

Boiling Point

Sublimes at ~2,973 °C

Density

 ~2.1–2.3 g/cm³

Product Codes

NCZ-1103K
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Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250”

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$387.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance, the

It is possible to identify the target material and even detect incredibly tiny impurity amounts.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

With the chemical formula Al2O3, aluminum oxide is a compound made of aluminum and oxygen. Because of its high melting point, Al2O3 is useful as a refractory material and as an abrasive due to its hardness, as well as for the production of aluminum metal. Because of their superior properties, aluminum oxide thin films, which can be produced via aluminum oxide sputtering targets, are extensively employed in several mechanical, optical, and microelectronic applications.

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Terbium Oxide (Tb4O7) Nanopowder/Nanoparticles, Purity: 99.97%, Size: 8-110 nm, Cubic

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Price range: $75.00 through $387.00
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Applications:

Terbium oxide nanoparticles have good magnetic and optical properties. It is used in magneto-optical glasses, and magneto-optical recording materials. It is also used in glass materials with Faraday Rotation effect for optical and laser based devices. It has catalytic application in automobile exhaust converter, and is used as activating agent for fluorescent powder.
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Activated Carbon (C) Nanopowder/Nanoparticles, Size: < 90 nm, Coconut

Price range: $14.00 through $387.00
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Activated Carbon (C) Nanopowder/Nanoparticles

Size: < 90 nm, Coconut

Technical Properties:

True Density (g/cm3) 0,41
Bulk Density (g/cm3) 0,32
Color black
pH 7,5-10,5
Ash/H2O Content (%) <1,8/<4,5
Shape spherical
Average Particle Size (nm) <90 nm
Specific Surface Area (m2/g) 1350
Resistivity  (Ω.cm) 0,2
Pore Size (nm)/Pore Volume (cm3/g) 3-45/1,2-1,4

Applications:

Porous Carbon nanopowder (a.k.a. activated coal) has very high surface area which makes it super reactive, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. This nanopowder is all natural, produced from plants and has very high surface area. It can be easily dispersed in various solvents. With its attracting properties, it can be used in food storage, cosmetics and health-care products, medicine and applications that need high adsorption and chemical reactivity.
Silicon (Si, Polycrystalline, 99.999%, lumps)
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Silicon (Si, Polycrystalline, 99.999%, lumps)

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Price range: $145.00 through $386.00
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$145/100g
$386/500g

Product 

 Silicon (Si, Polycrystalline, 99.999%, lumps)

CAS No.
7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

lumps (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

28.0855 g/mol

Melting Point

1,414 °C

Boiling Point

3,265 °C

Density

 ~2.33 g/cm³

Product Codes

NCZ-1074K
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Fullerene-C60, Purity: 99%

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Price range: $85.00 through $386.00
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1 gram/76 € 5 grams/345 €                          
Please contact us for quotes on larger quantities !!!

Fullerene-C60

Purity: 99% 

Technical Properties:

Fullerene Compound Formula C60
Fullerene  Molecular Weight 720.64
Fullerene  Size Diameter: 0.8 nm, Length: 1.2 nm
Fullerene  Purity % 99
Fullerene  Melting Point >280 °C
Fullerene  True Density 1.71 g/cm3
Fullerene  Electrical Resistivity 1034 ohms m-1
Fullerene  Appearance Shinning Black
Fullerene  CAS 99685-96-8

Applications:

1. Pharmaceutical: Diagnostic reagents, super drugs, cosmetics, nuclear magnetic resonance (NMR) with the developer. DNA affinity 2. Energy: Solar battery, fuel cell, secondary battery. 3. Industry: Wear resistant material, flame retardant materials, lubricants, polymer additives, high-performance membrane, catalyst, artificial diamond, hard alloy, electric viscous fluid, ink filters, high-performance coatings, fire retardant coatings, manufacturing bioactive materials , memory materials, embedded molecular and other characteristics, composite materials etc. 4. Information industry: Semiconductor record medium, magnetic materials, printing ink, toner, ink, paper special purposes. 5. Electronic parts: Superconducting semiconductor, diodes, transistors, inductor.  , 6. Optical materials, electronic camera, fluorescence display tube, nonlinear optical materials. 7. Environment: Gas adsorption, gas storage.  
Silica aerogel powder (147575)
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Silica aerogel powder (147575)

$385.00
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Silica aerogel powder (147575)
Particle Size 15, 20, 25μm
Pore Diameter 20-50nm
Specific Surface Area 500-1000m2/g
Hydrophobicity ≥98%
Density 60-100kg/m3
Thermal Conductivity ≤0.021W/m·K
Recommended Service temperature  -200-650°C
Product Codes- NCZ-2776K
Hemicellulose(from Bagasse) (353510)
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Hemicellulose(from Bagasse) (353510)

$385.00
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Product 
Hemicellulose(from Bagasse) (353510)

CAS No.
No verified CAS = 353510; general hemicellulose CAS = 9034‑32‑6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

  N/A(Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 Generic range: 2,000–200,000 Da; preferred 3,000–40,000 Da

Melting Point

 N/A

Boiling Point

N/A

Density

 N/A

Product Codes

NCZ-2652K
Microwave-Alkali extraction, Molecular weight 8000-20000g/mol, Ash ≤0.06%, Lignin ≤0.8%
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Microwave-Alkali extraction, Molecular weight 8000-20000g/mol, Ash ≤0.06%, Lignin ≤0.8%

$385.00
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Product 

 Microwave-Alkali extraction, Molecular weight 8000-20000g/mol, Ash ≤0.06%, Lignin ≤0.8%

CAS No.
 Generic for cellulose: 9004-34-6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 ~10 – 50 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

  8,000 – 20,000 g/mol

Melting Point

 N/A

Boiling Point

N/A

Density

 ~1.5 – 1.6 g/cm³

Product Codes

NCZ-2599K
Two-dimensional ZnNiAl Layered Double Hydroxide (ZnNiAl-LDH) Powder, 500 mg/bottle
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Two-dimensional ZnNiAl Layered Double Hydroxide (ZnNiAl-LDH) Powder, 500 mg/bottle

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Product Two-dimensional ZnNiAl Layered Double Hydroxide (ZnNiAl-LDH) Powder, 500 mg/bottle
CAS No. N/A
Appearance White to pale-green
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 0.5–2µm (Size Can be customized),  Ask for other available size range.
Ingredient Zn₄Ni₂Al₂(OH)₁₆CO₃·4H₂O
Molecular Weight 650–700 g/mol
Melting Point N/A
Boiling Point N/A
Density 2.2–2.4 g/cm³
Product Codes NCZ-589I
Two-dimensional ZnAl Layered Double Hydroxide (ZnAl-LDH) Powder, 500 mg/bottle
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Two-dimensional ZnAl Layered Double Hydroxide (ZnAl-LDH) Powder, 500 mg/bottle

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Product Two-dimensional ZnAl Layered Double Hydroxide (ZnAl-LDH) Powder, 500 mg/bottle
CAS No. N/A
Appearance White
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1–3µm (Size Can be customized),  Ask for other available size range.
Ingredient Zn₆Al₂(OH)₁₆CO₃·4H₂O
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 0.2–0.5 g/cm³
Product Codes NCZ-588I
 
Europium Chloride Hexahydrate (EuCl3 · 6H2O) 99.99% 4N
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Europium Chloride Hexahydrate (EuCl3 · 6H2O) 99.99% 4N

$385.00
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Product Europium Chloride Hexahydrate (EuCl3 · 6H2O) 99.99% 4N
CAS No. 13759-92-7
Appearance White to off-white crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 40–60µm (Size Can be customized),  Ask for other available size range.
Ingredient EuCl3·6H2O
Molecular Weight 351.296  g/mol
Melting Point 850 °C
Boiling Point N/A
Density 4.89 g/cm³
Product Codes NCZ-344I
Carboxyl Graphene Oxide Powder, 500mg
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Carboxyl Graphene Oxide Powder, 500mg

$385.00
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Product Carboxyl Graphene Oxide Powder, 500mg
CAS No. 7789-75-5
Appearance Brown to dark brown
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 5–10µm (Size Can be customized),  Ask for other available size range.
Ingredient CxHyOz(−COOH)p​
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 0.45 g/cm³
Product Codes NCZ-304I
 
99.999% 5N Germanium (Ge) Pieces Evaporation Materials, Size 23-25 mm
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99.999% 5N Germanium (Ge) Pieces Evaporation Materials, Size 23-25 mm

Price range: $176.00 through $385.00
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Product 99.999% 5N Germanium (Ge) Pieces Evaporation Materials, Size 23-25 mm
CAS No. 7440-56-4
Appearance Gray-white metallic luster, brittle solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 23-25mm (Size Can be customized),  Ask for other available size range.
Ingredient Ge
Molecular Weight 72.63 g/mol
Melting Point 938.3 °C
Boiling Point 2833 °C
Density 5.323 g/cm³
Product Codes NCZ-262I
4N (99.99%) Yttrium Oxide (Y2O3) Pieces (2-5mm) Evaporation Materials
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4N (99.99%) Yttrium Oxide (Y2O3) Pieces (2-5mm) Evaporation Materials

Price range: $176.00 through $385.00
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Product 4N (99.99%) Yttrium Oxide (Y2O3) Pieces (2-5mm) Evaporation Materials
CAS No. 1314-36-9
Appearance Lemon Yellow, Solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 2-5mm (Size Can be customized),  Ask for other available size range.
Ingredient Y2O3
Molecular Weight 225.81 g/mol
Melting Point N/A
Boiling Point N/A
Density 5.01 g/cm³
Product Codes NCZ-176I