Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125”

$651.00

Product 

Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 8'', Thickness: 0.125''

CAS No.

7440-33-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 183.84 g/mol

Melting Point

3422 °C

Boiling Point

 5555 °C

Density

19.25 g/cm³

Product Codes

NCZ-1585K

Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250”, Grey to Black

$650.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125”

$650.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Cobalt (Co) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$650.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

The chemical element cobalt has the atomic number 27 and the symbol Co. Cobalt is a silver-gray, hard, and shiny metal. Because it is one of only three room temperature ferromagnets with unaxial symmetry and hence suitability for digital recording, cobalt is employed in the production of high-strength, wear-resistant alloys as well as magnetic recording.

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.125”

$650.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125”

$650.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.

Prime CZ-Si Wafer, Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2-Side Polished, Thickness: 625±25um

Price range: $39.00 through $650.00
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Prime CZ-Si Wafer Size: 3”, Orientation: (100), Boron Doped, 2-Side Polished Technical Properties: Quality Prime Materials CZ-Si Size (inch) 3”

(-OH) Functionalized Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: 28-48 nm

Price range: $27.00 through $650.00
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Applications:

Multi Walled Carbon Nanotubes have a variety of potential applications in different fields. These applications include medicine, mechanics, electric-electronics, chemicals, energy and others. It can be applied in, 1-drug delivery, 2-biosensors, 3-CNT composites, 4-catalysis, 5-nanoprobes, 6-hydrogen storage, 7-lithium batteries, 8-gas-discharge tubes, 9-flat panel displays, 10-supercapacitors, 11-transistors, 12-solar cells, 13-photoluminescence, 14-templates

Vanadium Aluminum Carbide (V2AlC) MAX Phase Micron-Powder (1-40μm), 10g

$649.00
Product Vanadium Aluminum Carbide (V2AlC) MAX Phase Micron-Powder (1-40μm), 10g
CAS No. 12179-42-9
Appearance Dark gray to black
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1-40μm (Size Can be customized),  Ask for other available size range.
Ingredient V2AlC
Molecular Weight 140.8 g/mol
Melting Point N/A
Boiling Point N/A
Density 3.99–4.85 g/cm³
Product Codes NCZ-592I
 

Solid-Core Mesoporous Silica Nanoparticles Powder

Price range: $330.00 through $649.00
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Product Solid-Core Mesoporous Silica Nanoparticles Powder
CAS No. 7631-86-9
Appearance White to off-white fine
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 50-200nm (Size Can be customized),  Ask for other available size range.
Ingredient SiO₂
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 2.0–2.2 g/cm³
Product Codes NCZ-532I
 

Solid Silica Nanoparticles Water Suspension, 25 mg/mL

Price range: $517.00 through $649.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Solid Silica Nanoparticles Water Suspension, 25 mg/mL
CAS No. 7631-86-9
Appearance White to off-white fine
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 20-100nm (Size Can be customized),  Ask for other available size range.
Ingredient SiO₂
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 2.0–2.2 g/cm³
Product Codes NCZ-531I
 

Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”

$649.00

Product 

Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.125''

CAS No.

12190‑79‑3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

97.87 g/mol

Melting Point

Decomposes at ~1,100–1,130 °C

Boiling Point

N/A

Density

~4.80–4.95 g/cm³

Product Codes

NCZ-2054K

Copper-Nickel Nanowire Dispersion, 200mg/bottle

$649.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Copper-Nickel Nanowire Dispersion, 200mg/bottle
CAS No. N/A
Appearance Reddish-brown to brown
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 50–150nm (Size Can be customized),  Ask for other available size range.
Ingredient CuNi
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 1 g/cm³
Product Codes NCZ-331I
 

Chromium (Cr) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$649.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Silvery, shiny, hard, and brittle, chromium is a metal that resists corrosion and has a high mirror polish. Chromium sputtering targets are widely used in the automotive sector. Chromium sputtering targets work well as a shiny coating for bumpers and wheels. Chromium sputtering targets can be employed in a variety of vacuum applications, such as automotive glass coatings.

Because of its strong resistance to corrosion, chromium sputtering targets are a good choice for producing coatings that are resistant to corrosion. Hard material coatings made from chromium sputtering targets are used in industry to best protect engine parts like piston rings from premature wear and so increase the useful life of critical engine components.

Additionally, the production of batteries and solar cells uses chromium sputtering targets. In conclusion, chromium sputtering targets are employed in a variety of technologies for the physical deposition of thin films and functional coatings (the PVD method), in the manufacturing of electronic components, displays, and tools; in the vacuum chroming of watches, parts of household appliances, and the working surfaces of

Carbon Nanotube (CNT) Nanoribbon Water Dispersion, 1 mg/mL

Price range: $55.00 through $649.00
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Manufacturing Method:Ribbon is produced by chemical oxidation and longitudinal opening using strong oxidizing agents.  

Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250”

$648.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”

$648.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

CR2032 Coin Cell Cases with 316SS, Diameter: 20 mm, Height: 3.2 mm

Price range: $210.00 through $648.00
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Applications:

CR2032 Coin Cell Cases with 316SS is excellent for developing new rechargeable battery and battery electrodes

Borosilicate Wafer, Size: 3”, 2-Side polished, Thickness: 500 ± 25 μm

Price range: $58.00 through $648.00
Select options This product has multiple variants. The options may be chosen on the product page
Boroslicate Wafer Size: 3”, 2-Side polished, Thickness: 500 ± 25 μm Technical Properties: Materials Borosilicate Size(inch) 3” Orientation Coating Thickness (μm)

Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125”

$647.00

Product 

Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 4'', Thickness: 0.125''

CAS No.

 12138-09-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

247.97 g/mol

Melting Point

~1,250 °C

Boiling Point

N/A

Density

~7.5 g/cm³

Product Codes

NCZ-1580K

3N (99.9%) Magnesium Aluminate (MgAl2O4) Pieces (3-12mm) Evaporation Materials

Price range: $275.00 through $647.00
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Product 3N (99.9%) Magnesium Aluminate (MgAl2O4) Pieces (3-12mm) Evaporation Materials
CAS No. 12068-51-8
Appearance White 
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 3-12mm (Size Can be customized),  Ask for other available size range.
Ingredient MgAl2O4
Molecular Weight 142.27  g/mol
Melting Point 2,135 °C
Boiling Point N/A
Density 3.64 g/cm3
Product Codes NCZ-160E

Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250”

$647.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”

$647.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance, the

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

One of the most promising multiferroic materials is bismuth ferrite, an inorganic chemical compound with a perovskite structure and the chemical formula BiFeO3. In order to create a one-phase material called bismuth ferrite (BiFeO3), a bismuth ferrite sputtering target is often manufactured by high temperature sinttering or recrystallizing the mixture of the oxide compound of Bi and Fe. For targets that are sputtering bismuth ferrite, indium bonding is advised.

Zinc Fluoride (ZnF2) Powder 99.99% 4N

$646.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Zinc Fluoride (ZnF2) Powder 99.99% 4N
CAS No. 7789-38-0
Appearance White crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient ZnF2
Molecular Weight 81.38 g/mol
Melting Point N/A
Boiling Point N/A
Density 4.85 g/cm³
Product Codes NCZ-608I
 

Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”

$646.00

Product 

Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 2'', Thickness: 0.250''

CAS No.

12190‑79‑3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

97.87 g/mol

Melting Point

Decomposes at ~1,100–1,130 °C

Boiling Point

N/A

Density

~4.80–4.95 g/cm³

Product Codes

NCZ-2052K

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250”

$645.00

Product 

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 4'', Thickness: 0.250''

CAS No.

 10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

24.82 g/mol

Melting Point

~2973 °C

Boiling Point

N/A

Density

~2.1 g/cm³

Product Codes

NCZ-2368K

Tantalum Aluminum Carbide (Ta4AlC3) MAX Phase Micron-Powder

Price range: $171.00 through $645.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Tantalum Aluminum Carbide (Ta4AlC3) MAX Phase Micron-Powder
CAS No. N/A
Appearance Dark gray to black
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1–5µm (Size Can be customized),  Ask for other available size range.
Ingredient Ta4AlC3
Molecular Weight 654.48 g/mol
Melting Point N/A
Boiling Point N/A
Density 10.3 g/cm³
Product Codes NCZ-549I
 

Lithium Zirconate (Li2ZrO3) Powder, 99.5% 2N5

Price range: $229.00 through $645.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Lithium Zirconate (Li2ZrO3) Powder, 99.5% 2N5
CAS No. 12031-83-3
Appearance White to off-white fine
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 100nm (Size Can be customized),  Ask for other available size range.
Ingredient Li2ZrO3
Molecular Weight 157.22 g/mol
Melting Point 1,500 °C
Boiling Point N/A
Density 4.4 g/cm³
Product Codes NCZ-447I

Lithium Titanate (Li2TiO3) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$645.00

Product 

Lithium Titanate (Li2TiO3) Sputtering Targets, indium, Purity: 99.95%, Size: 3'', Thickness: 0.125''

CAS No.

12031-82-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

109.75 g/mol

Melting Point

Decomposes before melting (~1,200 °C)

Boiling Point

N/A

Density

~3.41 g/cm³

Product Codes

NCZ-2008K

High Purity 5N (99.999%) Gallium Phosphide (GaP) Pieces (1-5mm) Evaporation Materials

$645.00
Select options This product has multiple variants. The options may be chosen on the product page
Product High Purity 5N (99.999%) Gallium Phosphide (GaP) Pieces (1-5mm) Evaporation Materials
CAS No. 7723-14-0
Appearance Shiny, crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1–5mm (Size Can be customized),  Ask for other available size range.
Ingredient GaP
Molecular Weight 145.27 g/mol
Melting Point 1460 °C
Boiling Point N/A
Density 4.138 g/cm³
Product Codes NCZ-396I
 

Graphdiyne Film on 100um Cu Base, 1cm×1cm

$645.00
Product Graphdiyne Film on 100um Cu Base, 1cm×1cm
CAS No. N/A
Appearance Dark brown to black
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 100um (Size Can be customized),  Ask for other available size range.
Ingredient C₈H₂
Molecular Weight 98.1 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.9–2.1 g/cm³
Product Codes NCZ-357I

Erbium Nitrate Pentahydrate (Er(NO3)3 · 5H2O) 99.5% 2N5

Price range: $242.00 through $645.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Erbium Nitrate Pentahydrate (Er(NO3)3 · 5H2O) 99.5% 2N5
CAS No. 10031-51-3
Appearance Pink
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 40–100µm (Size Can be customized),  Ask for other available size range.
Ingredient Er(NO3)3·5H2O
Molecular Weight 443.35 g/mol
Melting Point N/A
Boiling Point N/A
Density N/A
Product Codes NCZ-342I
 

Cerium (IV) Fluoride, CeF4, 99.95% 3N5 High Purity Powder

$645.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Cerium (IV) Fluoride, CeF4, 99.95% 3N5 High Purity Powder
CAS No. 13709-97-8
Appearance White to pale yellow
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient CeF4
Molecular Weight 194.08 g/mol
Melting Point N/A
Boiling Point N/A
Density 6.8 g/cm³
Product Codes NCZ-312I
 

High Purity 5N (99.999%) Gallium Phosphide (GaP) Pieces (1-5mm) Evaporation Materials

$645.00
Select options This product has multiple variants. The options may be chosen on the product page
Product High Purity 5N (99.999%) Gallium Phosphide (GaP) Pieces (1-5mm) Evaporation Materials
CAS No. 12063-98-8
Appearance Pale orange solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1-5mm (Size Can be customized),  Ask for other available size range.
Ingredient GaP
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 4.138 g/cm3
Product Codes NCZ-150E

High Purity 5N (99.999%) Gallium Phosphide (GaP) Pieces (1-5mm) Evaporation Materials

$645.00
Select options This product has multiple variants. The options may be chosen on the product page
Product High Purity 5N (99.999%) Gallium Phosphide (GaP) Pieces (1-5mm) Evaporation Materials
CAS No. 12063-98-8
Appearance Pale orange solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1-5mm (Size Can be customized),  Ask for other available size range.
Ingredient GaP
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 4.138 g/cm3
Product Codes NCZ-150E

MWNTs -COOH Functionalized 95% <8 nm

Price range: $90.00 through $645.00
Select options This product has multiple variants. The options may be chosen on the product page
$90/5g
$240/25g
$645/100g

Product 

MWNTs -COOH Functionalized 95% <8 nm

CAS No.

7727-54-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

<8 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

228.20 g/mol

Melting Point

 ~120 °C

Boiling Point

NA

Density

 1.98 g/cm³

Product Codes

NCZ-1270K

MWNTs -OH Functionalized 95% <8 nm 5-20 um

Price range: $90.00 through $645.00
Select options This product has multiple variants. The options may be chosen on the product page
$90/5g
$240/25g
$645/100g

Product 

MWNTs -OH Functionalized 95% <8 nm 5-20 um

CAS No.

7727-54-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

~5 – 20 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 228.18 g/mol

Melting Point

 ~120 °C

Boiling Point

N/A

Density

 1.98 g/cm³

Product Codes

NCZ-1249K

Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250”

$645.00

Applications of Sputtering Targets;

For film deposition, sputtering targets are employed. A sputtering technique called "deposition made by sputter targets" entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Targets are etched using semiconductor sputtering targets. When etching anisotropy is required to a great degree and selectivity is not an issue, sputter etching is the method of choice. By etching away the target material, sputter targets are also utilized for investigation. In one instance, the target sample is sputtered at a steady pace in secondary ion spectroscopy (SIMS). Using mass spectrometry, the concentration and identity of the spewed atoms are determined when the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”

$645.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250”

$644.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Graphene Water Dispersion, Purity: 99.5%, Black Liquid, Graphene: 2 wt%

Price range: $104.00 through $644.00
Select options This product has multiple variants. The options may be chosen on the product page
30 ml/104 € 60 ml/174 €                          120 ml/ 259

Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”

$643.00

Product 

Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 2'', Thickness: 0.250''

CAS No.

123273‑09‑6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 ~1–5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~313.9 g/mol

Melting Point

 ~1,550 °C (approximate; ceramic decomposition likely above)

Boiling Point

N/A

Density

 ~5.3 g/cm³ @ room temp

Product Codes

NCZ-2155K

Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250”

$643.00

Product 

Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 4'', Thickness: 0.250''

CAS No.

1313-96-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 265.81 g/mol

Melting Point

~1512 °C

Boiling Point

N/A

Density

 4.6 – 4.9 g/cm³

Product Codes

NCZ-1805K

Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125”

$643.00

Product 

Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 6'', Thickness: 0.125''

CAS No.

7440-31-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

118.71 g/mol

Melting Point

231.93 °C

Boiling Point

2602 °C

Density

~7.31 g/cm³

Product Codes

NCZ-1637K

Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125”, Beige to White

$643.00

Product 

Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 1'', Thickness: 0.125'', Beige to White

CAS No.

13463‑67‑7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

TiO₂ (black granules) (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

79.94 g/mol

Melting Point

~1,843 °C

Boiling Point

~2,972 °C

Density

~4.23 g/cm³

Product Codes

NCZ-1444K

Carbon Nanotube-Carbon Black Prepared by Electrostatic Adsorption, CNTs: 34.4 wt%, Carbon Black: 65.6 wt%

Price range: $151.00 through $643.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

Super conductive black carbon nanoparticles surface is usually negatively charged. Carbon nanotubes are treated with cationic surfactant (Cetyl trimethyl ammonium bromide). Carbon nanotubes and black carbon self assemble to form a uniform stable complex. The complex shows high strength and conductivity which makes it suitable for processing into conductive plastics, conductive sheets, and films.  

Hafnium Oxide (HfO2) Nanopowder, 50nm, ≥99.99% (4N) Purity, 100g

$642.00
Product Hafnium Oxide (HfO2) Nanopowder, 50nm, ≥99.99% (4N) Purity, 100g
CAS No. 12055-23-1
Appearance White to off-white fine
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 50nm (Size Can be customized),  Ask for other available size range.
Ingredient HfO₂
Molecular Weight 210.49 g/mol
Melting Point N/A
Boiling Point N/A
Density 9.68 g/cm³
Product Codes NCZ-372I

Tungsten (W) Sputtering Targets, elastomer, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$642.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”

$641.00

Product 

Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 2'', Thickness: 0.250''

CAS No.

~68189-52-4 (generic for La₁₋ₓSrₓMnO₃ compounds)

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

<5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~237.5 g/mol (calculated from atomic weights)

Melting Point

 >1300 °C (material decomposes before reaching a precise melting point)

Boiling Point

N/A

Density

 ~6.4 – 6.5 g/cm³ (typical for perovskite LSMO ceramics)

Product Codes

NCZ-2097K

Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125”

$640.00

Product 

Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 4'', Thickness: 0.125''

CAS No.

12069‑32‑8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~55.26 g/mol

Melting Point

~2350 °C

Boiling Point

> 3500 °C (decomposes above ~2800 °C)

Density

 ~2.37 g/cm³ (theoretical)

Product Codes

NCZ-2385K

Prime CZ-Si Wafer, Size: 2”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 2-Side Polished, Thickness: 500 ± 25 μm

Price range: $53.00 through $640.00
Select options This product has multiple variants. The options may be chosen on the product page
Prime CZ-Si Wafer Size: 2”, Orientation: (100), Boron Doped, 2-Side Polished Technical Properties: Quality Prime Materials CZ-Si Size (inch) 2”

Prime CZ-Si Wafer, Size: 3”, Orientation: (100), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 380±25um

Price range: $52.00 through $640.00
Select options This product has multiple variants. The options may be chosen on the product page
Prime CZ-Si Wafer Size: 3”, Orientation: (100), Boron Doped, 1-Side Polished Technical Properties: Quality Prime Materials CZ-Si Size (inch) 3”

Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125”

$639.00

Product 

Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 1'', Thickness: 0.125''

CAS No.

10377-52-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 115.79 g/mol

Melting Point

 ~837 °C

Boiling Point

~158 °C (likely decomposition)

Density

 ~2.53 g/cm³

Product Codes

NCZ-2035K

Graphite Nanoparticles (GNP)

Price range: $341.00 through $638.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Graphite Nanoparticles (GNP)
CAS No. 7782-42-5
Appearance Fine black
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1µm (Size Can be customized),  Ask for other available size range.
Ingredient C
Molecular Weight 12.01 g/mol
Melting Point 3,650 °C
Boiling Point N/A
Density 1.8–2.2 g/cm³
Product Codes NCZ-368I
 

Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.250”

$637.00

Product 

Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 6'', Thickness: 0.250''

CAS No.

12069‑32‑8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~55.26 g/mol

Melting Point

~2350 °C

Boiling Point

> 3500 °C (decomposes above ~2800 °C)

Density

 ~2.37 g/cm³ (theoretical)

Product Codes

NCZ-2382K

Boron (B) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125”

$637.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Phosphorus (P) Micron Powder Purity: 99.95%, Size:1 µm, Metal Basis

Price range: $20.00 through $636.00
Select options This product has multiple variants. The options may be chosen on the product page
5 grams/18 € 25 grams/38 €                      
100 grams/125 €                     
500 grams/345 €                   
1000 grams/565 €

Purity: 99.95%, Size:1 µm, Metal Basis

Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250”

$635.00

Product 

Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 3'', Thickness: 0.250''

CAS No.

Indium oxide (In₂O₃): 1312-43-2
Zinc oxide (ZnO): 1314-13-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

Approx. 260–270 g/mol (depends on ratio)

Melting Point

Indium oxide: ~1910 °C Zinc oxide: ~1975 °C

Boiling Point

N/A

Density

~7.1 g/cm³

Product Codes

NCZ-2196K

Boron Nanoparticles/ Nanopowders ( B, 97.5%, <400nm)

Price range: $225.00 through $635.00
Select options This product has multiple variants. The options may be chosen on the product page
$225/25g
$635/100g

Product 

Boron Nanoparticles/ Nanopowders ( B, 97.5%, <400nm)

CAS No.

7440-42-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

<400nm (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

10.81 g/mol

Melting Point

2076°C

Boiling Point

4,000°C

Density

~2.34 g/cm³

Product Codes

NCZ-1020K

Platinum Oxide (PtO2) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: <100 nm

Price range: $159.00 through $635.00
Select options This product has multiple variants. The options may be chosen on the product page
1 gram/140 € 5 grams/559 €                            
Please contact us for quotes on larger quantities !!!

Platinum Oxide (PtO2) Nanopowder/Nanoparticles

Purity: 99.5+%, Size: <100 nm