Magnesium Oxide (MgO) Sputtering Targets, indium, Purity: 99.95%, Size:1”, Thickness: 0.125”

$868.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Cellulose Nanocrystal (Nanocrystalline Cellulose,CNC)

Price range: $20.00 through $868.00
Select options This product has multiple variants. The options may be chosen on the product page

Cellulose Nanocrystal (Nanocrystalline Cellulose,CNC)

Wide: 10-20 nm, Length: 300-900 nm, Dry powder

Crystalline Nanocellulose is cellulose in crystalline form, composed of nanosized cellulose fibrils. These submicroscopic particles, known as nanocellulose, have several features such as high strength, electro-magnetic response, large surface area, etc. There is a wide range of CNC application in different fields. We are glad to provide Nanocrystalline Cellulose with low price and high quality.

4N (99.99%) Calcium Fluoride (CaF2) Pieces Evaporation Materials

Price range: $270.00 through $867.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 4N (99.99%) Calcium Fluoride (CaF2) Pieces Evaporation Materials
CAS No. 7789-75-5
Appearance White crystalline solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 3-8mm (Size Can be customized),  Ask for other available size range.
Ingredient CaF2
Molecular Weight 78.07 g/mol
Melting Point 1,418 °C
Boiling Point 2,500 °C
Density 3.18 g/cm³
Product Codes NCZ-167I
 

3N (99.9%) Boron (B) Pieces Evaporation Materials

Price range: $462.00 through $867.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 3N (99.9%) Boron (B) Pieces Evaporation Materials
CAS No. 7440-42-8
Appearance Black, Semi-metallic 
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1–10mm (Size Can be customized),  Ask for other available size range.
Ingredient B
Molecular Weight 143.95 g/mol
Melting Point N/A
Boiling Point N/A
Density 2.34 g/cm³
Product Codes NCZ-134E
 

4N (99.99%) Calcium Fluoride (CaF2) Pieces Evaporation Materials

Price range: $270.00 through $867.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 4N (99.99%) Calcium Fluoride (CaF2) Pieces Evaporation Materials
CAS No. 7789-75-5
Appearance White, Crystalline Solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 3–6mm (Size Can be customized),  Ask for other available size range
Ingredient CaF2
Molecular Weight 78.07 g/mol
Melting Point 1,418 °C
Boiling Point 907°C
Density 3.18 g/cm³
Product Codes NCZ-103E

Prime CZ-Si Wafer, Size: 4”, Orientation: (110), Boron Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm

Price range: $48.00 through $867.00
Select options This product has multiple variants. The options may be chosen on the product page
1 piece/43 € 5 pieces/175 € 25 pieces/725 € Please contact us for quotes on larger quantities !!!

Prime CZ-Si Wafer

Size: 4”, Orientation: (110), Boron Doped, 1-Side Polished

Technical Properties:

Quality Prime
Materials CZ-Si
Size (inch) 4”
Orientation (100)
Coating
Thickness (μm) 525 ± 25
Doping Phosphor
Resistivity (ohm.cm) 1-10
Polished One Side
Silicon is one of the most common elements on earths crust. Main usage of Silicon wafers is electronics and technology. Silicon wafers have very flat and mirror like surfaces. It is produced by Czochralski method to obtain the highest purity. Depending on the usage area, silicon wafers can be doped with different materials to tailor its purity accordingly. The amount and type of dopants highly affect the electronic properties. Galium, indium, boron and nitrogen are some of the dopants that can be used in production process. Silicon wafers are used in semiconductors, microchips, integrated circuits, smartphones, computers etc. Silicon is the key platform for semiconductor gadgets. A wafer is just but a thin slice of the semiconductor material that acts as a substratum for microelectronic devices fitted in and above the wafer.

Silicon Carbide (SiC) Nanopowder/Nanoparticles, Beta, Purity: 99.5+%, Size: < 70 nm

Price range: $66.00 through $867.00
Select options This product has multiple variants. The options may be chosen on the product page
5 grams/59 € 25 grams/98 € 100 grams/196 € 500 grams/485 € 1000 grams/765 €
Please contact us for quotes on larger quantities !!!

Silicon Carbide (SiC) Nanopowder/Nanoparticles

Beta, Purity: 99.5+%, Size: < 70 nm

Storage Condition:

Silicon Carbide nanoparticles should be sealed in vacuum and stored in cool and dry room. It should not be exposure to air and avoid stress.

Applications:

Silicon carbide nanopowder can be used as a hard and high grade refractory material. It can be used in ceramics such as ceramic besrings, textile ceramics, high frequency ceramics, and ceramic engine parts. It also can be used in hard discs, polishing abrasives, grinding wheels, and as a support for multichip modules. Silicon carbide nanopowder has also high thermal conductivity. It can be used in high temperature sealing valves, high temperature spray nozzles, and high temperature fluid transport parts. It aslo can be used in composites to increase strength and heat resistance.

Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 3”, Thickness: 0.125”

$866.00

Product 

Aluminum Nitride (AlN) Sputtering Targets, Purity: 99.8%, Size: 3'', Thickness: 0.125''

CAS No.

 24304-00-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

40.99 g/mol

Melting Point

 ~2200 °C

Boiling Point

 N/A

Density

 ~3.26 g/cm³

Product Codes

NCZ-2557K

Antimony (Sb) Sputtering Targets, indium, Purity: 99.999%, Size: 3”, Thickness: 0.125”

$866.00

Product 

Antimony (Sb) Sputtering Targets, indium, Purity: 99.999%, Size: 3'', Thickness: 0.125''

CAS No.

 7440-36-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 121.76 g/mol

Melting Point

 630.6 °C

Boiling Point

 1587 °C

Density

 6.69 g/cm³

Product Codes

NCZ-2501K

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.250”

$866.00

Product 

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 6'', Thickness: 0.250''

CAS No.

 10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

24.82 g/mol

Melting Point

~2973 °C

Boiling Point

N/A

Density

~2.1 g/cm³

Product Codes

NCZ-2366K

Praseodymium (Pr) Metal 99.5% 2N5

$865.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Praseodymium (Pr) Metal 99.5% 2N5
CAS No. 7440-10-0
Appearance Silvery-gray metal, slightly soft
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 10–50µm (Size Can be customized),  Ask for other available size range.
Ingredient Pr
Molecular Weight 140.91 g/mol
Melting Point N/A
Boiling Point N/A
Density 6.77 g/cm³
Product Codes NCZ-499I
 

Niobium (V) Pentoxide (Nb2O5) 99.99% 4N Powder

Price range: $128.00 through $865.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Niobium (V) Pentoxide (Nb2O5) 99.99% 4N Powder
CAS No. 1313-96-8
Appearance Off-white to very light yellow
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 100nm (Size Can be customized),  Ask for other available size range.
Ingredient Nb2O5
Molecular Weight 265.81 g/mol
Melting Point N/A
Boiling Point N/A
Density 4.47–4.60 g/cm³
Product Codes NCZ-478I
 

Neodymium (Nd) Metal 99.5% 2N5

$865.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Neodymium (Nd) Metal 99.5% 2N5
CAS No. 7440-00-8
Appearance Silvery-white, soft, malleable metal
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1–50µm (Size Can be customized),  Ask for other available size range.
Ingredient Nd
Molecular Weight N/A
Melting Point 1024 °C
Boiling Point 3074 °C
Density 7.01 g/cm³
Product Codes NCZ-471I
 

Lithium Fluoride (LiF) 99.99% 4N Powder

Price range: $205.00 through $865.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Lithium Fluoride (LiF) 99.99% 4N Powder
CAS No. 7789-24-4
Appearance White crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 10nm (Size Can be customized),  Ask for other available size range.
Ingredient LiF
Molecular Weight 25.94 g/mol
Melting Point 845 °C
Boiling Point 1,676 °C
Density 2.64 g/cm³
Product Codes NCZ-444I
 

5N (99.999%) Barium Fluoride (BaF2) Pieces (<3mm) Evaporation Materials

Price range: $176.00 through $865.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 5N (99.999%) Barium Fluoride (BaF2) Pieces (<3mm) Evaporation Materials
CAS No. 7787-32-8
Appearance White, Crystalline Solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 3mm (Size Can be customized),  Ask for other available size range.
Ingredient BaF2
Molecular Weight 175.34 g/mol
Melting Point 1368 °C
Boiling Point N/A
Density N/A
Product Codes NCZ-194I
 

4N (99.99%) Tungsten Oxide (WO3) Pieces (3-12mm) Evaporation Materials

Price range: $97.00 through $865.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 4N (99.99%) Tungsten Oxide (WO3) Pieces (3-12mm) Evaporation Materials
CAS No. 1314-35-8
Appearance Lemon Yellow, Solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 3-12mm (Size Can be customized),  Ask for other available size range.
Ingredient WO3
Molecular Weight 231.85 g/mol
Melting Point N/A
Boiling Point N/A
Density 7.16 g/cm³
Product Codes NCZ-175I

Indium Sputtering Target In

Price range: $152.00 through $865.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Indium Sputtering Target In
CAS No. 7440-74-6
Appearance Silvery Lustrous Gray, Metallic
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient In
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 7.31 g/cm³
Product Codes NCZ-121H

4N (99.99%) Tungsten Oxide (WO3) Pieces (3-12mm) Evaporation Materials

Price range: $97.00 through $865.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 4N (99.99%) Tungsten Oxide (WO3) Pieces (3-12mm) Evaporation Materials
CAS No. 1314-35-8
Appearance Lemon Yellow, Solid 
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 3-12mm (Size Can be customized),  Ask for other available size range.
Ingredient WO3
Molecular Weight 231.85 g/mol
Melting Point 1,473 °C
Boiling Point N/A
Density 7.16 g/cm³
Product Codes NCZ-138E
 

5N (99.999%) Barium Fluoride (BaF2) Pieces (<3mm) Evaporation Materials

Price range: $176.00 through $865.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 5N (99.999%) Barium Fluoride (BaF2) Pieces (<3mm) Evaporation Materials
CAS No. 7787-32-8
Appearance White, Crystalline Solid 
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS <3mm (Size Can be customized),  Ask for other available size range.
Ingredient BaF2
Molecular Weight 175.34 g/mol
Melting Point 1368°C
Boiling Point N/A
Density 4.893 g/cm³
Product Codes NCZ-105E

Multi Walled Carbon Nanotubes, Purity: > 96%, Outside Diameter: < 8 nm

Price range: $21.00 through $865.00
Select options This product has multiple variants. The options may be chosen on the product page

Multi Walled Carbon Nanotubes

Purity: > 96%,  Outside Diameter: < 8 nm

Multi walled carbon nanotubes (MWCNTs, MWNTs) are a particular form of carbon nanotubes in which several single walled carbon nanotubes are embedded inside one another. MWCNTs exhibit exceptional electrical, mechanical and thermal properties such as the electrical conductivity, mechanical strength and thermal conductivity. These impressive properties contribute to gain an important place in a wide range of applications such as batteries, solar cells, transistors, nano-electronics, flat panel display, energy storage and many more. We are glad to provide Multi Walled Carbon Nanotubes with lowest prices and highest quality.

Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.125”

$864.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125”

$864.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Boron Carbide (B4C) Sputtering Targets, indium, Purity: 99.5%, Size: 3”, Thickness: 0.125”

$864.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Graphene Oxide Water Dispersion, Purity: 99.5%, Black Liquid, GO: 2,0 wt%

Price range: $138.00 through $864.00
Select options This product has multiple variants. The options may be chosen on the product page
25 ml / 126€ 100 ml / 390€ 500 ml / 582€ 1000 ml / 784€                Please contact us for quotes on larger quantities !!!

Graphene Oxide Water Dispersion

Purity: 99.5%, Black Liquid, GO: 2,0 wt%

Graphene Oxide Water Dispersion is black, odorless and very stable liquid which is suitable for the preparation of reduced graphene and graphene film. Graphene Oxide (GO) water dispersion has a wide range of applications such as transparent conductive films/coatings, solar energy, bio-sensing material, super capacitors and many more. Nanografi supplies graphene oxide water dispersion with high quantity and more types for different applications.

Technical Properties:

GO Purity (%) 99,5
GO Thickness (nm) 0,5-1,3 (single layer)
GO Diameter (µm) 2,0-6,0
Appearance Black
Concentration  (wt%) 2,0 (can be easily diluted)
Elemental Analysis C O S
68,75 31,02 0,17

Applications:

Graphene Oxide (GO) is the oxidized form of graphene nanoplatelets. It can be reduced with various chemical or physical treatments. In many of the chemical exfoliation experiments graphene is synthesized by reducing graphene oxide which comes from chemically treated graphite powder. Graphene oxide is also an attractive material for electronics industry because of its semiconducting properties. Graphene oxide is generally hydrophilic and can be dispersed in water (as it is in this dispersion).

Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125”

$863.00

Product 

Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 3'', Thickness: 0.125''

CAS No.

 12201-04-6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

<5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

~234.77 g/mol

Melting Point

~1,770 °C (ceramic decomposes)

Boiling Point

N/A

Density

 ~6.25 g/cm³

Product Codes

NCZ-2090K

Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125”

$863.00

Product 

Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 6'', Thickness: 0.125''

CAS No.

 12201-04-6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

<5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

~234.77 g/mol

Melting Point

~1,770 °C (ceramic decomposes)

Boiling Point

N/A

Density

 ~6.25 g/cm³

Product Codes

NCZ-2084K

Gadolinium Nitrate Hexahydrate (Gd(NO3)3 · 6H2O) 99.99% 4N

Price range: $286.00 through $862.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Gadolinium Nitrate Hexahydrate (Gd(NO3)3 · 6H2O) 99.99% 4N
CAS No. 19598-90-4
Appearance White to colorless crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1–5µm (Size Can be customized),  Ask for other available size range.
Ingredient Gd(NO3)3·6H2O
Molecular Weight 451.36 g/mol
Melting Point N/A
Boiling Point N/A
Density 2.33–2.41 g/cm³
Product Codes NCZ-351I
 

Graphene Oxide Water Dispersion, Purity: 99.5%, Black Liquid, GO: 2,0 wt%

Price range: $139.00 through $862.00
Select options This product has multiple variants. The options may be chosen on the product page
Graphene Oxide Water Dispersion Purity: 99.5%, Black Liquid, GO: 2,0 wt% Graphene Oxide Water Dispersion is black, odorless and very stable

Graphene Oxide Water Dispersion, Purity: 99.5%, Black Liquid, GO: 2,0 wt%

Price range: $139.00 through $862.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

Graphene Oxide (GO) is the oxidized form of graphene nanoplatelets. It can be reduced with various chemical or physical treatments. In many of the chemical exfoliation experiments graphene is synthesized by reducing graphene oxide which comes from chemically treated graphite powder. Graphene oxide is also an attractive material for electronics industry because of its semiconducting properties. Graphene oxide is generally hydrophilic and can be dispersed in water (as it is in this dispersion).

Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250”

$861.00

Product 

Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 3'', Thickness: 0.250''

CAS No.

12031-63-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 147.85 g/mol

Melting Point

~1,240–1,257 °C

Boiling Point

N/A

Density

~4.30 g/cm³ (ceramic); up to 4.65 g/cm³ (crystal)

Product Codes

NCZ-2038K

Titanium Boride (TiB2) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250”

$860.00

Product 

Titanium Boride (TiB2) Sputtering Targets, Purity: 99.5%, Size: 4'', Thickness: 0.250''

CAS No.

 12045-63-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

69.49 g/mol

Melting Point

 ~3225 °C

Boiling Point

N/A

Density

 4.52 g/cm³

Product Codes

NCZ-1615K

Molybdenum Oxide (MoO3) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125”

$859.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

3N5 (99.95%) Molybdenum (Mo) Wire (1mm Dia.) Evaporation Materials

Price range: $79.00 through $858.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 3N5 (99.95%) Molybdenum (Mo) Wire (1mm Dia.) Evaporation Materials
CAS No. 7439-98-7
Appearance Grey, Metallic
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1mm (Size Can be customized),  Ask for other available size range.
Ingredient Mo
Molecular Weight 58.69 g/mol
Melting Point 2,617°C
Boiling Point N/A
Density 10.2 g/cm³
Product Codes NCZ-123E

Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125”

$857.00

Product 

Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 3'', Thickness: 0.125''

CAS No.

 1312-43-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

< 5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 277.64 g/mol

Melting Point

 ~1,910 °C

Boiling Point

 3,000 °C(approx., decomposes)

Density

~7.18 g/cm³ (sintered form)

Product Codes

NCZ-2216K

Vanadium (V) Sputtering Targets, indium, Purity: 99.5%, Size: 3”, Thickness: 0.125”

$856.00

Product 

Vanadium (V) Sputtering Targets, indium, Purity: 99.5%, Size: 3'', Thickness: 0.125''

CAS No.

7440-62-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

50.9415 g/mol

Melting Point

1910 °C

Boiling Point

3407 °C

Density

6.11 g/cm³

Product Codes

NCZ-1543K

Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250”

$855.00

Product 

Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 3'', Thickness: 0.250''

CAS No.

1314-61-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 441.89 g/mol

Melting Point

 ~1872 °C

Boiling Point

N/A

Density

~8.2 g/cm³

Product Codes

NCZ-1651K

High Purity Short MWNTs -COOH Functionalized 98+%, <8nm

Price range: $155.00 through $855.00
Select options This product has multiple variants. The options may be chosen on the product page
$155/5g
$355/25g
$855/100g

Product 

High Purity Short MWNTs -COOH Functionalized 98+%, <8nm

CAS No.

7727-54-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

50-100 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

228.18 g/mol

Melting Point

~120 °C

Boiling Point

NA

Density

1.98 g/cm³

Product Codes

NCZ-1283K

High Purity Short MWNTs -COOH Functionalized 98+%, >50nm

Price range: $155.00 through $855.00
Select options This product has multiple variants. The options may be chosen on the product page
$155/5g
$355/25g
$855/100g

Product 

High Purity Short MWNTs -COOH Functionalized 98+%, >50nm

CAS No.

708051-49-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

>50nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

NA

Melting Point

 >600 °C

Boiling Point

NA

Density

 ~1.8–2.1 g/cm³

Product Codes

NCZ-1279K

High Purity Short MWNTs -OH Functionalized 98+%, 30~50nm

Price range: $155.00 through $855.00
Select options This product has multiple variants. The options may be chosen on the product page
$155/5g
$355/25g
$855/100g

Product 

High Purity Short MWNTs -OH Functionalized 98+%, 30~50nm

CAS No.

7727-54-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

30~50nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

228.18 g/mol

Melting Point

 120 °C

Boiling Point

NA

Density

1.98 g/cm³

Product Codes

NCZ-1282K

High Purity Short MWNTs -OH Functionialized 98+%, 20~30nm

Price range: $155.00 through $855.00
Select options This product has multiple variants. The options may be chosen on the product page
$155/5g
$355/25g
$855/100g

Product 

High Purity Short MWNTs -OH Functionialized 98+%, 20~30nm

CAS No.

7727-54-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

8~15nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

228.20 g/mol

Melting Point

 ~120 °C

Boiling Point

N/A

Density

 1.98 g/cm³

Product Codes

NCZ-1265K

High Purity Short MWNTs -COOH Functionialized 98+%, 20~30nm

Price range: $155.00 through $855.00
Select options This product has multiple variants. The options may be chosen on the product page
$155/5g
$355/25g
$855/100g

Product 

High Purity Short MWNTs -COOH Functionialized 98+%, 20~30nm

CAS No.

708051-49-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

20~30nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

NA

Melting Point

 >600 °C

Boiling Point

NA

Density

 ~1.8–2.1 g/cm³

Product Codes

NCZ-1277K

High Purity Short MWNTs -COOH Functionalized 98+%, 8~15nm

Price range: $155.00 through $855.00
Select options This product has multiple variants. The options may be chosen on the product page
$155/5g
$355/25g
$855/100g

Product 

High Purity Short MWNTs -COOH Functionalized 98+%, 8~15nm

CAS No.

708051-49-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

8~15nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

NA

Melting Point

 >600 °C

Boiling Point

NA

Density

 ~1.8–2.1 g/cm³

Product Codes

NCZ-1276K

High Purity Short MWNTs -OH Functionalized 98+%, >50nm

Price range: $155.00 through $855.00
Select options This product has multiple variants. The options may be chosen on the product page
$155/5g
$355/25g
$855/100g

Product 

High Purity Short MWNTs -OH Functionalized 98+%, >50nm

CAS No.

7727-54-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

>50nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 228.20 g/mol

Melting Point

 120 °C

Boiling Point

NA

Density

1.98 g/cm³

Product Codes

NCZ-1266K

High Purity Short MWNTs -OH Functionalized 98+%, 8~15nm

Price range: $155.00 through $855.00
Select options This product has multiple variants. The options may be chosen on the product page
$155/5g
$355/25g
$855/100g

Product 

High Purity Short MWNTs -OH Functionalized 98+%, 8~15nm

CAS No.

7727-54-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

8~15nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

228.20 g/mol

Melting Point

 120 °C

Boiling Point

NA

Density

 1.98 g/cm³

Product Codes

NCZ-1264K

Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250”

$855.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Graphene Oxide Water Dispersion, Purity: 99.5%, Black Liquid, GO: 2,0 wt%

Price range: $142.00 through $855.00
Select options This product has multiple variants. The options may be chosen on the product page

Graphene Oxide Water Dispersion

Purity: 99.5%, Black Liquid, GO: 2,0 wt%

Graphene Oxide Water Dispersion is black, odorless and very stable liquid which is suitable for the preparation of reduced graphene and graphene film. Graphene Oxide (GO) water dispersion has a wide range of applications such as transparent conductive films/coatings, solar energy, bio-sensing material, super capacitors and many more. Nanografi supplies graphene oxide water dispersion with high quantity and more types for different applications.

Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 4”, Thickness: 0.125”

$854.00

Product 

Chromium Oxide (Cr2O3) Sputtering Targets, Purity: 99.8%-99.9%, Size: 4'', Thickness: 0.125''

CAS No.

1308-38-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 151.99 g/mol

Melting Point

2,435 °C

Boiling Point

 ~3,000 °C (approximate; may decompose before boiling)

Density

5.21 g/cm³

Product Codes

NCZ-2300K

Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125”

$853.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Lead Zirconium Titanate/PZT (O5PbTiZr) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”

$853.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

An inorganic substance is lead zirconium titanate. This ceramic perovskite material has a strong piezoelectric effect, which means that when an electric field is applied, the compound changes shape. Lead zirconium titanate is employed in a number of practical applications such as ultrasonic transducers and piezoelectric resonators.

Iron Oxide (Fe3O4) Sputtering Targets, indium, Purity: 99.9%, Size: 1”, Thickness: 0.125”

$852.00

Product 

Iron Oxide (Fe3O4) Sputtering Targets, indium, Purity: 99.9%, Size: 1'', Thickness: 0.125''

CAS No.

1317‑61‑9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 231.6 g/mol

Melting Point

~1,597 °C

Boiling Point

 ~2,623 °C (material may decompose before boiling)

Density

 ~5.17 g/cm³ (sintered target)

Product Codes

NCZ-2163K

Boron Nitride (BN) Sputtering Target

Price range: $288.00 through $852.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Boron Nitride (BN) Sputtering Target

CAS No.

10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

24.82 g/mol

Melting Point

~2,973 °C

Boiling Point

N/A

Density

 ~2.1–3.5 g/cm³

Product Codes

NCZ-1333K

Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125”

$851.00

Product 

Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 4'', Thickness: 0.125''

CAS No.

7440-39-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

137.33 g/mol

Melting Point

727 °C

Boiling Point

1897 °C

Density

3.62 g/cm³ (solid at room temp)

Product Codes

NCZ-2487K

Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250”

$851.00

Product 

Barium (Ba) Sputtering Targets, Purity: 99.5%, Size: 4'', Thickness: 0.250''

CAS No.

7440-39-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

137.33 g/mol

Melting Point

727 °C

Boiling Point

1897 °C

Density

3.62 g/cm³ (solid at room temp)

Product Codes

NCZ-2486K

Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250”

$850.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125”

$850.00

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.

Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250”

$850.00

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.

Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250”

$850.00
Select options This product has multiple variants. The options may be chosen on the product page
but allow experts a large degree of control over the growth and microstructure of the area.

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.

Boron (B) Sputtering Targets, indium, Purity: 99.9%, Size: 3”, Thickness: 0.125”

$849.00

Product 

Boron (B) Sputtering Targets, indium, Purity: 99.9%, Size: 3'', Thickness: 0.125''

CAS No.

7440-42-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 10.81 g/mol

Melting Point

~2076 °C

Boiling Point

 ~3927 °C

Density

 ~2.34 g/cm³

Product Codes

NCZ-2388K

Zinc Sulfide (ZnS) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125”

$849.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250”, Beige to White

$848.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.