Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250”

$914.00

Product 

Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 3'', Thickness: 0.250''

CAS No.

12190‑79‑3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

97.87 g/mol

Melting Point

 ~1,100–1,130 °C (decomposes rather than boils)

Boiling Point

N/A

Density

~4.80–4.95 g/cm³

Product Codes

NCZ-2050K

Silicon Carbide (SiC) Sputtering Target

Price range: $368.00 through $914.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Silicon Carbide (SiC) Sputtering Target

CAS No.

409-21-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

40.10 g/mol

Melting Point

~2,730 °C

Boiling Point

 ~2,700–3,000 °C

Density

~3.21 g/cm³

Product Codes

NCZ-1336K

Lithium Phosphate (Li3PO4) Sputtering Targets, elastomer, Purity: 99.95%, Size: 1”, Thickness: 0.125”

$913.00

Product 

Lithium Phosphate (Li3PO4) Sputtering Targets, elastomer, Purity: 99.95%, Size: 1'', Thickness: 0.125''

CAS No.

10377-52-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 115.79 g/mol

Melting Point

 ~837 °C

Boiling Point

N/A

Density

 ~2.53 g/cm³

Product Codes

NCZ-2019K

Graphdiyne Oxide (GDYO) Powder, 10mg

$913.00
Product Graphdiyne Oxide (GDYO) Powder, 10mg
CAS No. N/A
Appearance Brownish or dark
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 10–500nm (Size Can be customized),  Ask for other available size range.
Ingredient C₈H₂Oₓ
Molecular Weight 678.18 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.8–2.0 g/cm³
Product Codes NCZ-359I

Praseodymium (Pr) Micron Powder, Purity: 99.5 %, Size: 325 mesh

$912.00
Select options This product has multiple variants. The options may be chosen on the product page
100 grams/840 € Please contact us for quotes on larger quantities !!!

Praseodymium (Pr) Micron Powder

Purity: 99.5 %, Size: 325 mesh

Technical Properties:

PURITY

 99.5 %

PARTICLE SIZE

325 mesh

MELTING POINT

931 °C

BOILING POINT

3512 °C

DENSITY

6.773 g/cc

FORM  

Powder

ELECTRIC RESISTIVITY

68 microhm-cm @ 25 °C

     

Applications:

Praseodymium has paramagnetic magnetic property at any temperature above 1 K. It is never found free in nature. It is combined with other rare earths in various minerals. It can be found in the minerals monazite and bastnasite. It is reactive and oxidizes in air. Praseodymium is used as alloying agent for the manufacturing of high strength metals used in aircrafts. It is also used in super magnets due to its magnetic properties. Praseodymium is used as doping agent in glass and optic fibers. It gives the yellow color to the glasses and cubic zirconia. It has also applications in electronics. It is used in the core of carbon arc lights which are used in studio lighting and projector lights.

Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$910.00

Product 

Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 3'', Thickness: 0.125''

CAS No.

 7439-96-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

54.93804 g/mol

Melting Point

 1,246 °C

Boiling Point

 2,061 °C

Density

 7.21 g/cm³

Product Codes

NCZ-1950K

Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250”

$910.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250”

$910.00

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.

Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250”

$909.00

Product 

Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.250''

CAS No.

 1306-38-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 172.11 g/mol

Melting Point

2,400–2,600 °C

Boiling Point

Sublimes above 3,000 °C

Density

 7.13 g/cm³

Product Codes

NCZ-2332K

5N (99.999%) Copper (Cu) Pellets Evaporation Materials

Price range: $269.00 through $909.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 5N (99.999%) Copper (Cu) Pellets Evaporation Materials
CAS No. 7440-50-8
Appearance Reddish metallic solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1–4 mm (Size Can be customized),  Ask for other available size range.
Ingredient Cu
Molecular Weight 63.55 g/mol
Melting Point 1,085 °C
Boiling Point 2,562 °C
Density N/A
Product Codes NCZ-198I
 

Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”

$909.00

Product 

Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.250''

CAS No.

12068-40-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

706.32 g/mol

Melting Point

~1,790 °C

Boiling Point

N/A

Density

~5.17 – 5.36

Product Codes

NCZ-1514K

5N (99.999%) Copper (Cu) Pellets Evaporation Materials

Price range: $269.00 through $909.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 5N (99.999%) Copper (Cu) Pellets Evaporation Materials
CAS No. 7440-50-8
Appearance Reddish-orange, metallic 
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient Cu
Molecular Weight 78.07 g/mol
Melting Point 1,083 °C
Boiling Point N/A
Density 8.96 g/cm³
Product Codes NCZ-104E
 

Titanium Dioxide (TiO2) Sputtering Targets, indium, Purity: 99.95%, Size: 4”, Thickness: 0.125” , Grey to Black

$909.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Strontium Titanate (SrTiO3) Sputtering Targets, elastomer, Purity: 99.9%, Size: 2”, Thickness: 0.125”

$909.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Indium(III) Oxide (In2O3) Nanopowder, 50nm, ≥99.99% (4N) Purity

Price range: $446.00 through $908.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Indium(III) Oxide (In2O3) Nanopowder, 50nm, ≥99.99% (4N) Purity
CAS No. 1312-43-2
Appearance Yellowish-white or pale tan
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 50nm (Size Can be customized),  Ask for other available size range.
Ingredient In2O3
Molecular Weight 277.64 g/mol
Melting Point N/A
Boiling Point N/A
Density 7.18 g/cm³
Product Codes NCZ-430I

Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125”

$907.00

Product 

Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 6'', Thickness: 0.125''

CAS No.

12060-08-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

183.49 g/mol

Melting Point

 ~2080 °C

Boiling Point

N/A

Density

~5.12 g/cm³

Product Codes

NCZ-1674K

Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125”

$907.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance, the

It is possible to identify the target material and even detect incredibly tiny impurity amounts.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

The chemical compound barium zirconate has the formula BaZrO3. An electroceramic, or family of ceramic materials principally employed for their electrical capabilities, is what barium zirconate is. In semiconductor, chemical vapor deposition (CVD), physical vapor deposition (PVD), and optical applications, barium zirconate sputtering targets can be employed. Barium zirconate sputtering targets can also be employed for ferroelectric applications.

Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250”

$906.00

Product 

Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 4'', Thickness: 0.250''

CAS No.

1317‑61‑9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 231.6 g/mol

Melting Point

~1,597 °C

Boiling Point

 ~2,623 °C (material may decompose before boiling)

Density

 ~5.17 g/cm³ (sintered target)

Product Codes

NCZ-2170K

Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125”

$906.00

Product 

Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, indium, Purity: 99.9%, Size: 2'', Thickness: 0.125''

CAS No.

12190‑79‑3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

97.87 g/mol

Melting Point

~1,130 °C

Boiling Point

N/A

Density

~4.95 g/cm³

Product Codes

NCZ-2047K

Zinc Oxide (ZnO) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125”

$906.00

Product 

Zinc Oxide (ZnO) Sputtering Targets, indium, Purity: 99.99%, Size: 2'', Thickness: 0.125''

CAS No.

1314-13-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 (ZnO) (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

81.38 g/mol

Melting Point

1975 °C

Boiling Point

N/A

Density

5.61 g/cm³

Product Codes

NCZ-1496K

Germanium Nanoparticles/Nanopowder ( Ge, 200nm)

Price range: $260.00 through $906.00
Select options This product has multiple variants. The options may be chosen on the product page
$260/25g $906/100g

Product 

Germanium Nanoparticles/Nanopowder ( Ge, 200nm)

CAS No.

7440-56-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

~200 nm (microns) (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

72.63 g/mol

Melting Point

937.4 °C

Boiling Point

2833 °C

Density

~5.32 g/cm³

Product Codes

NCZ-1047K

Graphene Nanoplatelet, Purity: 99.9+%, Size: 3 nm, S.A: 320 m2/g, Dia: 1.5 μm

Price range: $8.00 through $906.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications of Graphene Nanoplatelet

  • Use as a high performance additive for composites with PPO, POM ,PPS, PC, ABS, PP, PE, PS, Nylon and rubbers.
  • Can improve composites tensile strength, stiffness, corrosion resistance, abrasion resistance and anti-static electricity and lubricant properties.
  • For all mechanical properties modifications, typical amounts are about 2-6 wt%.
  • For conductivity modification, typical amounts are about 2-8wt%.

Titanium Nitride (TiN) Sputtering Targets, indium, Purity: 99.5%, Size: 2”, Thickness: 0.125”

$905.00

Product 

Titanium Nitride (TiN) Sputtering Targets, indium, Purity: 99.5%, Size: 2'', Thickness: 0.125''

CAS No.

25583-20-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

61.88 g/mol

Melting Point

 ~2950 °C

Boiling Point

~4300 °C

Density

5.22 g/cm³

Product Codes

NCZ-1599K

Tantalum (Ta) Sputtering Target

Price range: $137.00 through $904.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Tantalum (Ta) Sputtering Target

CAS No.

7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 180.95 g/mol

Melting Point

3,017 °C

Boiling Point

5,458 °C

Density

16.69 g/cm³

Product Codes

NCZ-1305K

Gadolinium (Gd) Sputtering Target

Price range: $254.00 through $904.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Gadolinium (Gd) Sputtering Target

CAS No.

7440-54-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

157.25 g/mol

Melting Point

1,312 °C

Boiling Point

3,273 °C

Density

7.90 g/cm³

Product Codes

NCZ-1289K

PLL (Polylysine) Coated Fe2O3 Nanoparticle Water Dispersion, 1mg/mL

Price range: $286.00 through $902.00
Select options This product has multiple variants. The options may be chosen on the product page
Product PLL (Polylysine) Coated Fe2O3 Nanoparticle Water Dispersion, 1mg/mL
CAS No. 1309-37-1
Appearance Dark reddish-brown colloidal suspension
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 10–50nm (Size Can be customized),  Ask for other available size range.
Ingredient Fe₂O₃
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 5.24 g/cm³
Product Codes NCZ-494I
 

Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 7”, Thickness: 0.250”

$902.00

Product 

Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 7'', Thickness: 0.250''

CAS No.

12060-08-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

183.49 g/mol

Melting Point

 ~2080 °C

Boiling Point

N/A

Density

~5.12 g/cm³

Product Codes

NCZ-1671K

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250”

$902.00

Product 

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 6'', Thickness: 0.250''

CAS No.

 7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 180.95 g/mol

Melting Point

3017 °C

Boiling Point

 5458 °C

Density

16.65 g/cm³

Product Codes

NCZ-1659K

Tin Oxide (SnO2) Sputtering Targets, elastomer, Purity: 99.99%, Size: 4”, Thickness: 0.125”

$902.00

Product 

Tin Oxide (SnO2) Sputtering Targets, elastomer, Purity: 99.99%, Size: 4'', Thickness: 0.125''

CAS No.

18282-10-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

150.71 g/mol

Melting Point

~1630 °C

Boiling Point

~1800–1900 °C

Density

~6.95 g/cm³

Product Codes

NCZ-1622K

Aluminum Fluoride (AlF3) Sputtering Target

Price range: $348.00 through $901.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Aluminum Fluoride (AlF3) Sputtering Target

CAS No.

 7784‑18‑1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 83.98 g/mol

Melting Point

~1,291 °C

Boiling Point

N/A

Density

 ~2.88 g/cm³

Product Codes

NCZ-1384K

Ytterbium Oxide (Yb2O3) Sputtering Target

Price range: $348.00 through $901.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Ytterbium Oxide (Yb2O3) Sputtering Target

CAS No.

1314‑37‑0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 394.08 g/mol

Melting Point

 2,355 °C

Boiling Point

 ~4,070 °C

Density

 9.17 g/cm³

Product Codes

NCZ-1380K

Gadolinium Oxide (Gd2O3) Sputtering Target

Price range: $348.00 through $901.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Gadolinium Oxide (Gd2O3) Sputtering Target

CAS No.

12064-62-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

362.50 g/mol

Melting Point

 2,420 °C

Boiling Point

~4,000 °C

Density

7.41 g/cm³

Product Codes

NCZ-1371K

Magnesium Oxide (MgO) Sputtering Target

Price range: $423.00 through $901.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Magnesium Oxide (MgO) Sputtering Target

CAS No.

1309-48-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

40.30 g/mol

Melting Point

 ~2,800 °C

Boiling Point

 ~3,600 °C

Density

~3.58 g/cm³

Product Codes

NCZ-1320K

Cellulose Nanofiber (Cellulose Nanofibril, Nanofibrillated Cellulose, CNFs)

Price range: $34.00 through $901.00
Select options This product has multiple variants. The options may be chosen on the product page

Cellulose Nanofiber (Cellulose Nanofibril, Nanofibrillated Cellulose, CNFs)

Wide: 10-20 nm, Length: 2-3 µm, Dry powder

Cellulose Nanofibril is originally generated from wood-derived fibrils with length in the micrometer and width in the nanometric range during the biosynthesis of cellulose. Today, there is widespread scientific and commercial interest in cellulose nanofibrils (CNF). There have several application areas including foods, cosmetics, pharmaceuticals, paints, drilling muds, paper additives and paperboard barriers, medical products, etc. Our Nanofibrillated Cellulose product competes on price and performance with counterparts.

Iron Oxide (Fe3O4) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125”

$900.00

Product 

Iron Oxide (Fe3O4) Sputtering Targets, indium, Purity: 99.9%, Size: 2'', Thickness: 0.125''

CAS No.

1317‑61‑9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 231.6 g/mol

Melting Point

~1,597 °C

Boiling Point

 ~2,623 °C (material may decompose before boiling)

Density

 ~5.17 g/cm³ (sintered target)

Product Codes

NCZ-2162K

Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”

$900.00

Product 

Yttrium Ferrite (Y3Fe5O12) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.125''

CAS No.

12063-56-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

~2–10 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

737.94 g/mol

Melting Point

~1040–1550 °C

Boiling Point

N/A

Density

~5.11 g/cm³

Product Codes

NCZ-1515K

Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250”

$900.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Boron Doped, Resistivity: 0.001 – 0.005 (ohm.cm), 2- Polished, Thickness: 200 ± 10 μm

Price range: $49.00 through $900.00
Select options This product has multiple variants. The options may be chosen on the product page
Prime CZ-Si Wafer Size: 4”, Orientation: (100), Boron Doped, 2- Polished Technical Properties: Quality Prime Materials CZ-Si Size (inch) 4”

Ti3C2 MXene Powder Multilayer

Price range: $75.00 through $900.00
Select options This product has multiple variants. The options may be chosen on the product page

Product Name: Ti3C2Tx (MXene) Multilayer Powder

Ti3C2Tx MXene

Ti3C2 Mxene multilayer

Product Ti3C2Tx (MXene) Multilayer
MF Product Code: NCZMX-109-20
Colour Black Powder
Purity 99 wt %
Number of layers 10-50 (customizable)
Ingredient Ti3C2
CAS NO 12363-89-2
Powder size: 1 Micron, 5 Micron, 10 Micron, 20 Micron, 30 Micron, 45 Micron. Ask for size customization. Ti3C2 MXene Powder Multilayer APPLICATION FIELDS MXenes and MXenes-based nanocomposites have been widely used in nano-adsorption, biosensors, ion sieving, catalysis, lithium-ion batteries, supercapacitors, lubrication, and many other fields. RELATED INFORMATION Storage Conditions: Airtight sealed, avoid light and keep dry at room temperature. Please email us for the customization. Email: contact@nanochemazone.com

Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250”

$899.00

Product 

Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 6'', Thickness: 0.250''

CAS No.

7783-40-6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 62.30 g/mol

Melting Point

~1263 °C

Boiling Point

~2260 °C

Density

 3.18 g/cm³

Product Codes

NCZ-1978K

Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”

$899.00

Product 

Tungsten Oxide (WO3) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.250''

CAS No.

1314-35-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

231.84 g/mol

Melting Point

1,473 °C

Boiling Point

1,700–1,850 °C

Density

7.16 g/cm³

Product Codes

NCZ-1573K

Graphene Ethanol Dispersion, Purity: 99.5%, Graphene: 0.5 wt%

Price range: $65.00 through $899.00
Select options This product has multiple variants. The options may be chosen on the product page
Graphene Ethanol Dispersion, Purity: 99.5%,  Graphene: 0.5 wt%
Graphene Purity (%) 99,5
Graphene Thickness (nm) 0,6-1,2
Diameter (µm) 2,0-12,0
Appearance Black Liquid
Concentration (wt%) 0.5 (mg/ml)
Specific Surface Area (m2/g) 600-1200
Elemental Analysis (%) C            O 99,6    <0,4
Surfactant                                                                                                           YES

Graphene Nanoplatelet, Purity: 99.9%, Size: 3 nm, S.A: 800 m2/g, Dia: 1.5 μm

Price range: $6.00 through $899.00
Select options This product has multiple variants. The options may be chosen on the product page

Graphene Nanoplatelet

Purity: 99.9%, Size: 3 nm, S.A: 800 m2/g, Dia: 1.5 μ

Graphene Nanoplatelets are nanoparticles consisting of short stacks of platalet-shaped graphene sheets that are in a planar form. Graphene nanoplatelets are excellent electrical and thermal conductors as a result of their pure graphitic composition. Graphene nanoplatelets help increase thermal, electrical conductivity and stability and improve barrier properties. Unique features of graphene nanoplatelets benefit it greatly to gain a place in the market. Nanografi supplies Graphene Nanoplatelet with high quantity and more types for different applications.

Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250”

$897.00

Product 

Titanium Carbide (TiC) Sputtering Targets, Purity: 99.5%, Size: 3'', Thickness: 0.250''

CAS No.

 12070-08-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

59.89 g/mol

Melting Point

 ~3160 °C

Boiling Point

N/A

Density

4.93 g/cm³

Product Codes

NCZ-1609K

Lithium Niobate (LiNbO3) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125”

$897.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Micron Powder, Purity: 99.95%, Size: 35 µm, Metal Basis

Price range: $42.00 through $897.00
Select options This product has multiple variants. The options may be chosen on the product page
1 gram/38 € 5 grams/65 € 25 grams/135 € 100 grams/338 € 500 grams/526 € 1000 grams/796 € Please contact us for quotes on larger quantities !!!

Magnesium (Mg) Micron Powder

Purity: 99.95%, Size: 35 µm, Metal Basis

Technical Properties:

True Density (g/cm3) 1,74
Shape spherical-rectangular
Crystal Structure cubic
Tmelting (oC) 650
Tboiling (oC) 1100
Average Particle Size (µm) 35,0
Elemental Analysis Mg Cu Mn Na K Others
99.9 0.02 0.01 0.01 0.01 0.001

Applications:

Magnesium is one of the lightest metals. This property gives Mg a wide range of applications from aircraft and automobile parts to material handling equipment.  

Magnesium Oxide (MgO) Sputtering Targets, Purity: 99.95%, Size: 7”, Thickness: 0.125”

$896.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Impending Self-Help Transfer Nickel Graphene Foam, Thickness: 1±0.1 mm, Size: 1×1 cm

Price range: $198.00 through $896.00
Select options This product has multiple variants. The options may be chosen on the product page
Please contact us for quotes for larger quantities !   Impending self-help transfer nickel graphene foam is produced by etching the nickel of nickel graphene foam in etching liquid and being transferred to impending substrate. Graphene foam, can be gently released in deionized water and transferred directly to any base. This product is widely used for producing sensors, super capacitors and as the electrode materials of lithium battery to improve the battery capacity.

D-Arbutin(Deoxyarbutin) (440513)

$895.00
Select options This product has multiple variants. The options may be chosen on the product page
D-Arbutin(Deoxyarbutin) (440513)

Chemical name: 4-[(Tetrahydro-2H-pyran-2-yl)oxy]phenol CAS#: 53936-56-4 Specification: Deoxyarbutin more than 99%, and hydroquinone less than 0.1% (HPLC).
Product Codes- NCZ-2708K

Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250”

$895.00

Product 

Indium Oxide (In2O3) Sputtering Targets, Purity: 99.99%, Size: 4'', Thickness: 0.250''

CAS No.

 1312-43-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

< 5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 277.64 g/mol

Melting Point

 ~1,910 °C

Boiling Point

 3,000 °C(approx., decomposes)

Density

~7.18 g/cm³ (sintered form)

Product Codes

NCZ-2213K

Tin Oxide (SnO2) Sputtering Targets, elastomer, Purity: 99.99%, Size: 3”, Thickness: 0.125”

$895.00

Product 

Tin Oxide (SnO2) Sputtering Targets, elastomer, Purity: 99.99%, Size: 3'', Thickness: 0.125''

CAS No.

18282-10-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

150.71 g/mol

Melting Point

~1630 °C

Boiling Point

~1800–1900 °C

Density

~6.95 g/cm³

Product Codes

NCZ-1623K

Manganese (Mn) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250”

$894.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Iron Oxide (Fe3O4) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125”

$894.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

 

Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250”

$893.00

Product 

Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 8'', Thickness: 0.250''

CAS No.

123273‑09‑6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~313.9 g/mol

Melting Point

 ~1,550 °C (approximate; ceramic decomposition likely above)

Boiling Point

N/A

Density

 ~5.3 g/cm³ @ room temp

Product Codes

NCZ-2143K

Zirconium Diboride (ZrB2) Powder, 99.5% Purity, -325 Mesh

$891.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Zirconium Diboride (ZrB2) Powder, 99.5% Purity, -325 Mesh
CAS No. 12045-64-6
Appearance Gray to black
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 44µm (Size Can be customized),  Ask for other available size range.
Ingredient ZrB2
Molecular Weight 81.38 g/mol
Melting Point N/A
Boiling Point N/A
Density 5.61 g/cm³
Product Codes NCZ-611I

Prime CZ-Si Wafer, Size: 4”, Orientation: (100), Phosphor Doped, Resistivity: 0.05 – 0.152 (ohm.cm), 2-Side Polished, Thickness: 365 ± 15 μm

Price range: $63.00 through $890.00
Select options This product has multiple variants. The options may be chosen on the product page
Prime CZ-Si Wafer Size: 4”, Orientation: (100), Phosphor Doped, 2-Side Polished Technical Properties: Quality Prime Materials CZ-Si Size (inch) 4” Orientation

Niobium Aluminum Carbide (Nb2AlC) MAX Phase Micron-Powder

Price range: $289.00 through $889.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Niobium Aluminum Carbide (Nb2AlC) MAX Phase Micron-Powder
CAS No. 60687-94-7
Appearance Gray-black to black
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS  0.8–30µm (Size Can be customized),  Ask for other available size range.
Ingredient Nb2AlC
Molecular Weight 224.8 g/mol
Melting Point N/A
Boiling Point N/A
Density 6.43 g/cm³
Product Codes NCZ-479I

Lanthanum Titanate (LaTiO3) Sputtering Targets, Purity: 99.9%, Size: 5”, Thickness: 0.250”

$889.00

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.

Prime FZ-Si Wafer, Size: 2”, Orientation: (100), Phosphor Doped, Resistivity: 7000 – 8000 (ohm.cm), 2-Side Polished, Thickness: 250 ± 15 μm

Price range: $68.00 through $888.00
Select options This product has multiple variants. The options may be chosen on the product page
Prime FZ-Si Wafer Size: 2”, Orientation: (100), Phosphor Doped, 2-Side Polished, Thickness: 250 ± 15 μm Technical Properties: Quality Prime

Prime Si+SiO2 Wafer (wet), Size: 2”, Orientation: (111), Boron Doped, Resistivity: 1 -20 (ohm.cm), 2-Side Polished, Thickness: 500 ± 25 μm, Coating 500 nm

Price range: $68.00 through $888.00
Select options This product has multiple variants. The options may be chosen on the product page
Prime Si+SiO2 Wafer (wet) Size: 2”, Orientation: (111), Boron Doped, 2-Side Polished, Thickness: 500 ± 25 μm, Coating 500 nm