Coin Style Single Wafer Shipper, 5’’ / 125 mm , Natural PP

Price range: $9.52 through $59.00
Select options This product has multiple variants. The options may be chosen on the product page
1 piece: 8.5 € 5 pieces: 35 € 10 pieces: 53 € Coin Style Single Wafer Shipper, 5’’ / 125 mm , Natural PP  Introduction
  • The wafer shippers are specifically designed to ship, transport or store semiconductor wafers. Primarily designed to hold thin silicon wafers, but are equally suitable for glass, quartz, sapphire, GaAs and other thin round wafers in sizes from Ø2” to 6” or Ø51 to 150mm.
  • These wafer shippers/carriers are also known as coin shippers
  • They comprise of three parts: base, spider spring and locking cap.
  • The inside of the base is concave to ensure that the wafers are held at the edges only.
  • The spider spring holds the wafer in place once the cap is locked to the base.
  • Available in sizes of 2” to 6” or equivalent 51 to 150mm diameter which a translucent, natural polypropylene
  WAFER SHIPPER FEATURES •  For shipping and storage of 5'' wafers •  Positive closure •  Holds one wafer facedown •  Wafer face contact is on the edge only •  Eight spring cushion holds the wafer •  Stackable WAFER SHIPPER SPECIFICATIONS Polypropylene (PP) Properties: •  Translucent/milky white •  Low dielectric constant (insulating) •  Not hygroscopic (water absorption <0.01%) •  Continuous use temperature limit: 55 C •  Melting temperature: 164 C •  Specific gravity: 0.9g/cm^3 •  Chemical resistance: IPA OK, Acetone OK The “Coin Style” single wafer shippers or wafer holders are available in different sizes and materials (Natural PP). For easy loading/unloading in automated or manual applications. They are impact resistant with a screw-on lid for secure packing. Single wafer shipping container for safe transporting of your 5" (150 mm) wafers. The  coinstyle shippers are cylindrical shaped and usually include a sping (they can also be ordered without a spring). The coin style shippers are designed to absorb impact and have a screw-on lid for secure packing of your wafers.

Coin Style Single Wafer Shipper, 4’’ / 100 mm , Natural PP

Price range: $9.41 through $58.00
Select options This product has multiple variants. The options may be chosen on the product page
1 piece: 8.4 € 5 pieces: 34 € 10 pieces: 52 € Coin Style Single Wafer Shipper, 4’’ / 100 mm , Natural PP  Introduction
  • The wafer shippers are specifically designed to ship, transport or store semiconductor wafers. Primarily designed to hold thin silicon wafers, but are equally suitable for glass, quartz, sapphire, GaAs and other thin round wafers in sizes from Ø2” to 6” or Ø51 to 150mm.
  • These wafer shippers/carriers are also known as coin shippers
  • They comprise of three parts: base, spider spring and locking cap.
  • The inside of the base is concave to ensure that the wafers are held at the edges only.
  • The spider spring holds the wafer in place once the cap is locked to the base.
  • Available in sizes of 2” to 6” or equivalent 51 to 150mm diameter which a translucent, natural polypropylene

Product #

Wafer Size

Dimensions

Material

NG01WS0103 4” / 100 mm Ø130 x 15 mm Natural translucent PP
  WAFER SHIPPER FEATURES •  For shipping and storage of 4'' wafers •  Positive closure •  Holds one wafer facedown •  Wafer face contact is on the edge only •  Eight spring cushion holds the wafer •  Stackable WAFER SHIPPER SPECIFICATIONS Polypropylene (PP) Properties: •  Translucent/milky white •  Low dielectric constant (insulating) •  Not hygroscopic (water absorption <0.01%) •  Continuous use temperature limit: 55 C •  Melting temperature: 164 C •  Specific gravity: 0.9g/cm^3 •  Chemical resistance: IPA OK, Acetone OK The “Coin Style” single wafer shippers or wafer holders are available in different sizes and materials (Natural PP). For easy loading/unloading in automated or manual applications. They are impact resistant with a screw-on lid for secure packing. Single wafer shipping container for safe transporting of your 4" (100 mm) wafers. The  coinstyle shippers are cylindrical shaped and usually include a sping (they can also be ordered without a spring). The coin style shippers are designed to absorb impact and have a screw-on lid for secure packing of your wafers.

Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 1”, Thickness: 0.250”

$56.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Coin Style Single Wafer Shipper, 2’’ / 51 mm , Natural PP

Price range: $9.45 through $55.65
Select options This product has multiple variants. The options may be chosen on the product page
Introduction The wafer shippers are specifically designed to ship, transport or store semiconductor wafers. Primarily designed to hold thin silicon

Coin Style Single Wafer Shipper, 3’’ / 76 mm , Natural PP

Price range: $8.70 through $53.00
Select options This product has multiple variants. The options may be chosen on the product page
1 adet : 7.8€ 5 adet:  32€ 10 adet: 48€ Coin Style Single Wafer Shipper, 3’’ / 76 mm , Natural PP  Introduction
  • The wafer shippers are specifically designed to ship, transport or store semiconductor wafers. Primarily designed to hold thin silicon wafers, but are equally suitable for glass, quartz, sapphire, GaAs and other thin round wafers in sizes from Ø2” to 6” or Ø25 to 150mm.
  • These wafer shippers/carriers are also known as coin shippers
  • They comprise of three parts: base, spider spring and locking cap.
  • The inside of the base is concave to ensure that the wafers are held at the edges only.
  • The spider spring holds the wafer in place once the cap is locked to the base.
  • Available in sizes of 2” to 6” or equivalent 51 to 150mm diameter which a translucent, natural polypropylene

Product #

Wafer Size

Dimensions

Material

NG01WS0102 3” / 76 mm Ø85 x 13 mm Natural translucent PP
  WAFER SHIPPER FEATURES •  For shipping and storage of 3'' wafers •  Positive closure •  Holds one wafer facedown •  Wafer face contact is on the edge only •  Eight spring cushion holds the wafer •  Stackable WAFER SHIPPER SPECIFICATIONS Polypropylene (PP) Properties: •  Translucent/milky white •  Low dielectric constant (insulating) •  Not hygroscopic (water absorption <0.01%) •  Continuous use temperature limit: 55 C •  Melting temperature: 164 C •  Specific gravity: 0.9g/cm^3 •  Chemical resistance: IPA OK, Acetone OK The “Coin Style” single wafer shippers or wafer holders are available in different sizes and materials (Natural PP). For easy loading/unloading in automated or manual applications. They are impact resistant with a screw-on lid for secure packing. Single wafer shipping container for safe transporting of your 3" (76 mm) wafers. The  coinstyle shippers are cylindrical shaped and usually include a sping (they can also be ordered without a spring). The coin style shippers are designed to absorb impact and have a screw-on lid for secure packing of your wafers.

Calcium butyrate(C8H14O4Ca, 95%) (208970)

$50.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Calcium butyrate(C8H14O4Ca, 95%) (208970)

CAS No.

5743-36-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

  5 to 100 µm, (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

214.27 g/mol

Melting Point

N/A

Boiling Point

 164.3 °C at 760 mmHg

Density

N/A

Product Codes

NCZ-2617K

Nitinol Shape Memory Alloy Wire, Diameter: 2 mm, AF: 80-85°C

Price range: $9.75 through $49.25
Select options This product has multiple variants. The options may be chosen on the product page
1 meter / 9.75 € 5 meters /  33.75 € 10 meters /  49.25 €  Please contact us for quotes

Coin Style Single Wafer Shipper, 2’’ / 51 mm , Natural PP

Price range: $7.00 through $49.00
Select options This product has multiple variants. The options may be chosen on the product page
1 piece: 7 € 5 pieces: 29 € 10 pieces: 44 € Coin Style Single Wafer Shipper, 2’’ / 51 mm , Natural PP  Introduction
  • The wafer shippers are specifically designed to ship, transport or store semiconductor wafers. Primarily designed to hold thin silicon wafers, but are equally suitable for glass, quartz, sapphire, GaAs and other thin round wafers in sizes from Ø2” to 6” or Ø51 to 150mm.
  • These wafer shippers/carriers are also known as coin shippers
  • They comprise of three parts: base, spider spring and locking cap.
  • The inside of the base is concave to ensure that the wafers are held at the edges only.
  • The spider spring holds the wafer in place once the cap is locked to the base.
  • Available in sizes of 2” to 6” or equivalent 51 to 150mm diameter which a translucent, natural polypropylene

Product #

Wafer Size

Dimensions

Material

NG01WS0101 2” / 51mm Ø61 x 13 mm Natural translucent PP
  WAFER SHIPPER FEATURES •  For shipping and storage of 2'' wafers •  Positive closure •  Holds one wafer facedown •  Wafer face contact is on the edge only •  Eight spring cushion holds the wafer •  Stackable WAFER SHIPPER SPECIFICATIONS Polypropylene (PP) Properties: •  Translucent/milky white •  Low dielectric constant (insulating) •  Not hygroscopic (water absorption <0.01%) •  Continuous use temperature limit: 55 C •  Melting temperature: 164 C •  Specific gravity: 0.9g/cm^3 •  Chemical resistance: IPA OK, Acetone OK The “Coin Style” single wafer shippers or wafer holders are available in different sizes and materials (Natural PP). For easy loading/unloading in automated or manual applications. They are impact resistant with a screw-on lid for secure packing. Single wafer shipping container for safe transporting of your 2" (51mm) wafers. The  coinstyle shippers are cylindrical shaped and usually include a sping (they can also be ordered without a spring). The coin style shippers are designed to absorb impact and have a screw-on lid for secure packing of your wafers.

Aluminum oxide, 99.999%

Price range: $16.00 through $45.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Aluminum oxide, 99.999%
CAS No. 1344-28-1
Appearance White crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient Al₂O₃
Molecular Weight 101.96 g/mol
Melting Point N/A
Boiling Point N/A
Density 4.1 g/cm³
Product Codes NCZ-103R

Aluminum nitrate, 99.999%

Price range: $16.00 through $45.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Aluminum nitrate, 99.999%
CAS No. 7784-27-2
Appearance White crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient Al(NO₃)₃·9H₂O
Molecular Weight 375.13 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.72 g/cm³
Product Codes NCZ-102R
 

Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 1”, Thickness: 0.125”

$45.00

Product 

Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 1'', Thickness: 0.125''

CAS No.

7631-86-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

60.08 g/mol

Melting Point

~1710°C

Boiling Point

 ~2,950 °C

Density

~2.20 g/cm³

Product Codes

NCZ-1719K

Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 1”, Thickness: 0.125”

$43.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250”

$39.00

Product 

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.250''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3 Copper: 7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

Weighted average depending on composition (example below)

Melting Point

 Approx. 570–660 °C

Boiling Point

 Approx. 2500–2650 °C

Density

~2.7 to 2.9 g/cm³

Product Codes

NCZ-2525K

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250”

$38.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum has a good strength to weight ratio. Aluminum plating is the best material to use on cars, trucks, and airplanes. Typically, aluminum

alloyed with silicon and copper, among other elements, to improve structural qualities and performance.

When compared to aluminum silicon alloys, aluminum silicon copper alloys are well known for their exceptionally high strength. Aluminum silicon copper sputtering targets are ideal for usage in the transportation and aerospace industries due to their exceptional strength.

Sputtering targets made of aluminum silicon copper have superior casting and machining properties. This alloy has excellent corrosion resistance and weldability, which make it ideal for use in gas and oil pans, engine parts, and other commercial applications.

Ammonium chloride, 99.999%

Price range: $16.00 through $36.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Ammonium chloride, 99.999%
CAS No. 12125-02-9
Appearance White crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient NH₄Cl
Molecular Weight 53.49 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.527 g/cm³
Product Codes NCZ-105R

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250”

$31.00

Product 

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 2'', Thickness: 0.250''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3 Copper: 7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

Weighted average depending on composition (example below)

Melting Point

 Approx. 570–660 °C

Boiling Point

 Approx. 2500–2650 °C

Density

~2.7 to 2.9 g/cm³

Product Codes

NCZ-2523K

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250”

$31.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation.

In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nitinol Shape Memory Alloy Wire, Diameter: 1,5 mm, AF: 35-40°C

Price range: $5.60 through $30.75
Select options This product has multiple variants. The options may be chosen on the product page
1 meter / 5.60 € 5 meters /  21 € 10 meters /  30.75 €  Nitinol Shape Memory Alloy Wire

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$25.00

Product 

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.125''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3 Copper: 7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

Weighted average depending on composition (example below)

Melting Point

 Approx. 570–660 °C

Boiling Point

 Approx. 2500–2650 °C

Density

~2.7 to 2.9 g/cm³

Product Codes

NCZ-2526K

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125”

$25.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum has a good strength to weight ratio. Aluminum plating is the best material to use on cars, trucks, and airplanes. To improve its structural qualities and overall performance, aluminum is typically alloyed with silicon and copper, among other elements.

When compared to aluminum silicon alloys, aluminum silicon copper alloys are well known for their exceptionally high strength. Aluminum silicon copper sputtering targets are ideal for usage in the transportation and aerospace industries due to their exceptional strength.

Sputtering targets made of aluminum silicon copper have superior casting and machining properties. This alloy has excellent corrosion resistance and weldability, which make it ideal for use in gas and oil pans, engine parts, and other commercial applications.

For semiconductor applications, aluminum silicon copper sputtering targets can also be employed. This alloy forms a homogeneous film due to its high purity.

Nitinol Shape Memory Alloy Wire, Diameter: 0,5 mm, AF: -10 – -15°C

Price range: $4.65 through $24.90
Select options This product has multiple variants. The options may be chosen on the product page
1 meter/  4.65  € 5 meters/  18.50  € 10 meters/  24.90   €  Please contact us for quotes on larger quantities !

Nitinol Shape Memory Alloy Wire, Diameter: 1 mm, AF: 45-50°C

Price range: $4.50 through $24.65
Select options This product has multiple variants. The options may be chosen on the product page
1 meter / 4,50 € 5 meters /  18 € 10 meters /  24,65 €  Please contact us for quotes

Nitinol Shape Memory Alloy Wire, Diameter: 1 mm, AF: 15-20°C

Price range: $4.50 through $24.65
Select options This product has multiple variants. The options may be chosen on the product page
1 meter / 4.50 € 5 meters /  18 € 10 meters /  24.65 €  Please contact us for quotes

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125”

$24.00

Product 

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 2'', Thickness: 0.125''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3 Copper: 7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

Weighted average depending on composition (example below)

Melting Point

 Approx. 570–660 °C

Boiling Point

 Approx. 2500–2650 °C

Density

~2.7 to 2.9 g/cm³

Product Codes

NCZ-2524K

Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125”

$24.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

The chemical element cobalt has the atomic number 27 and the symbol Co. Cobalt is a silver-gray, hard, and shiny metal. Because it is one of only three room temperature ferromagnets with unaxial symmetry and hence suitability for digital recording, cobalt is employed in the production of high-strength, wear-resistant alloys as well as magnetic recording.

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$22.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum has a good strength to weight ratio. Aluminum plating is the best material to use on cars, trucks, and airplanes. Typically, aluminum

alloyed with silicon and copper, among other elements, to improve structural qualities and performance.

When compared to aluminum silicon alloys, aluminum silicon copper alloys are well known for their exceptionally high strength. Aluminum silicon copper sputtering targets are ideal for usage in the transportation and aerospace industries due to their exceptional strength.

Sputtering targets made of aluminum silicon copper have superior casting and machining properties. This alloy has excellent corrosion resistance and weldability, which make it ideal for use in gas and oil pans, engine parts, and other commercial applications.

Graphene Sheet, Size: 1 cm x 1 cm, Thickness: 35 µm, Highly Conductive

Price range: $3.00 through $19.00
Select options This product has multiple variants. The options may be chosen on the product page
Potential applications include: • Thermal management and heat spreading • EMI Shielding • Electrodes for batteries and Supercapacitors

Consumer electronics: smartphones, tablets, PCs, TVs Applications:

  • LED lighting
  • Energy storage
  • Automotive
  • Industrial
  • Medical
  • Military and aerospace

Graphene Sheet, Size: 1 cm x 1 cm, Thickness: 35 µm, Highly Conductive

Price range: $2.00 through $19.00
Select options This product has multiple variants. The options may be chosen on the product page
Graphene sheets are essentially the finest materials in the world. Graphene sheet is a one-atom-thick planar sheet of carbon iotas which are intensively packed in a hexagonal lattice structure. Graphene sheets show high electrical conductance at room temperatures. They are used as fillers for the improvement of electrical and mechanical properties in composite materials. Graphene sheets have a vital importance for applications in biomaterials, biosensors, biomedical devices and drug delivery. Our company sells Graphene Sheet with low prices and high quality.

Painting pigments (077608)

$5.00
Select options This product has multiple variants. The options may be chosen on the product page
Painting pigments (077608)
 
Product Codes- NCZ-2788K

Ti3C2Tx MXene Thin Layer Dispersion Solution

$1.00

Product Name: Ti2AlC Ceramic Material

Ti2AlC MAX Phase
Product Ti2AlC Ceramic Material
Product Code NCZ-MX-101
Colour Black powder
Purity(At.%) 98%
Molecular Formula Ti2AlC
CAS 12537-81-4

Ti2AlC Ceramic Material APPLICATION FIELDS

MAXenes and MXenes-based nanocomposites have been widely used in nano-adsorption, biosensors, ion sieving, catalysis, lithium-ion batteries, supercapacitors, lubrication, and many other fields.

RELATED INFORMATION

Storage Conditions: Airtight sealed, avoid light and keep dry at room temperature. Please email us for the customization. Email: contact@nanochemazone.com  

Ti2C MXene Powder

$1.00

Product Name: Ti2AlC Ceramic Material

Ti2AlC MAX Phase
Product Ti2AlC Ceramic Material
Product Code NCZ-MX-101
Colour Black powder
Purity(At.%) 98%
Molecular Formula Ti2AlC
CAS 12537-81-4

Ti2AlC Ceramic Material APPLICATION FIELDS

MAXenes and MXenes-based nanocomposites have been widely used in nano-adsorption, biosensors, ion sieving, catalysis, lithium-ion batteries, supercapacitors, lubrication, and many other fields.

RELATED INFORMATION

Storage Conditions: Airtight sealed, avoid light and keep dry at room temperature. Please email us for the customization. Email: contact@nanochemazone.com  

Ti3C2Tx (MXene) Nanosize thin layer dispersion

$1.00

Nb2CTx (MXene) Multilayer Nanoflake

Product Code: NCZ-MX-102
Product Nb2C (MXene) Multilayer Nanoflakes
Colour Black powder
Purity ~ 99%
MF Nb2C
Size 50-150 nm
CAS No. 12011-99-3
APPLICATION FIELDS

Nb2CTx MXene Multilayer Nanoflake Powder

Nb2C MXenes and MXenes-based nanocomposites have been widely used in nano-adsorption, biosensors, ion sieving, catalysis, lithium-ion batteries, supercapacitors, lubrication, and many other fields.

Nb2C (MXene) Multilayer Nanoflakes RELATED INFORMATION

Storage Conditions: Airtight sealed, avoid light and keep dry at room temperature. Please email us for the customization. Email: contact@nanochemazone.com  

Nb2CTx MXene Multilayer Nanoflake

$1.00

Nb2CTx (MXene) Multilayer Nanoflake

Product Code: NCZ-MX-102
Product Nb2C (MXene) Multilayer Nanoflakes
Colour Black powder
Purity ~ 99%
MF Nb2C
Size 50-150 nm
CAS No. 12011-99-3
APPLICATION FIELDS

Nb2CTx MXene Multilayer Nanoflake Powder

Nb2C MXenes and MXenes-based nanocomposites have been widely used in nano-adsorption, biosensors, ion sieving, catalysis, lithium-ion batteries, supercapacitors, lubrication, and many other fields.

Nb2C (MXene) Multilayer Nanoflakes RELATED INFORMATION

Storage Conditions: Airtight sealed, avoid light and keep dry at room temperature. Please email us for the customization. Email: contact@nanochemazone.com  

Ti2AlC Ceramic Material

$1.00

Product Name: Ti2AlC Ceramic Material

Ti2AlC MAX Phase
Product Ti2AlC Ceramic Material
Product Code NCZ-MX-101
Colour Black powder
Purity(At.%) 98%
Molecular Formula Ti2AlC
CAS 12537-81-4

Ti2AlC Ceramic Material APPLICATION FIELDS

MAXenes and MXenes-based nanocomposites have been widely used in nano-adsorption, biosensors, ion sieving, catalysis, lithium-ion batteries, supercapacitors, lubrication, and many other fields.

RELATED INFORMATION

Storage Conditions: Airtight sealed, avoid light and keep dry at room temperature. Please email us for the customization. Email: contact@nanochemazone.com  

Stainless steel powder (839680)

Stainless steel powder (839680)
Grade Cr Ni Mo Sn Cu S P C Si Mn Fe Corresponding MPIF35
303 17/19 8/13 / / / 0.15/0.30 ≤0.20 ≤0.15 ≤1 ≤2 Bal SS-303N1,N2
304 18/20 8/12 / / / ≤0.03 ≤0.04 ≤0.08 ≤1 ≤2 Bal SS-304N1,N2
316 16/18 10/14 2/3 / / ≤0.03 ≤0.04 ≤0.08 ≤1 ≤2 Bal SS-316N1,N2
303L 17/19 8/13 / / 0.15/0.30 ≤0.20 ≤0.03 ≤1 ≤2 Bal SS-303L
304L 18/20 8/12 / / / ≤0.03 ≤0.04 ≤0.03 ≤1 ≤2 Bal SS-304H,L
316L 16/18 10/14 2/3 / / ≤0.03 ≤0.04 ≤0.03 ≤1 ≤2 Bal SS-316H,L
317L 18/21 12/16 3/4 / / ≤0.03 ≤0.04 ≤0.03 ≤1 ≤2 Bal /
314 24/27 18/21 / / / ≤0.03 ≤0.04 ≤0.20 1.5/2.5 ≤1.5 Bal /
310 24/26 19/22 / / / ≤0.03 ≤0.04 ≤0.08 ≤1 ≤2 Bal /
303LSC 17/19 8/13 / 1 2 0.15/0.30 ≤0.20 ≤0.03 ≤1 ≤2 Bal /
304LSC 17/19 8/13 / 1 2 ≤0.03 ≤0.04 ≤0.03 ≤1 ≤2 Bal /
316LSC 16/19 10/14 2/3 1 2 ≤0.03 ≤0.04 ≤0.03 ≤1 ≤2 Bal /
409L 10.5/11.75 / Nb:8*C/0.8 ≤0.03 ≤0.04 ≤0.03 ≤1 ≤1 Bal SS-409L
409LE 10.5/11.75 ≤0.5 Nb:8*C/0.8 ≤0.03 ≤0.04 ≤0.03 ≤1 ≤1 Bal SS-409LE
410L 11.5/13.5 / / / / ≤0.03 ≤0.04 ≤0.03 ≤1 ≤1 Bal SS-410L
430L 16/18 / / / / ≤0.03 ≤0.04 ≤0.03 ≤1 ≤1 Bal SS-430L
434L 16/18 / 0.75/1.25 / / ≤0.03 ≤0.04 ≤0.03 ≤1 ≤1 Bal SS-434L
434LNb 16/18 / 0.75/1.25 Nb:0.4/0.6 ≤0.03 ≤0.04 ≤0.03 ≤1 ≤1 Bal SS-434LCb
410 11.5/13.5 / / / / ≤0.03 ≤0.04 ≤0.25 ≤1 ≤1 Bal SS-410
420 12/14 / / / / ≤0.03 ≤0.04 0.25/0.35 ≤1 ≤1 Bal /
430 16/18 / / / / ≤0.03 ≤0.04 ≤0.08 ≤1 ≤1 Bal SS-430N2
434 16/18 / 0.75/1.25 / / ≤0.03 ≤0.04 ≤0.08 ≤1 ≤1 Bal SS-434N2
440 16/18 / / / ≤0.03 ≤0.04 0.9/1.2 ≤1 ≤1 Bal /
17-4PH 15.5/17.5 3/5 Nb:0.15/0.45 3/5 ≤0.03 ≤0.04 ≤0.07 ≤1 ≤1 Bal /
 
Product Codes- NCZ-2784K

Activated carbon fiber Felt(Rayon based, low wind resistance) (262584)

$228.00
Activated carbon fiber Felt(Rayon based, low wind resistance) (262584)
CAS 7440-44-0
Low wind resistance, mainly used for organic waste gas purification. Thickness=3.5-4mm, 250±10g/m2
Product Codes- NCZ-2690K

Calcium copper titanate(CCTO, CaCu3Ti4O12) (535616)

$445.00
Calcium copper titanate(CCTO, CaCu3Ti4O12) (535616)
D50 Dielectric constant
1-3μm 9,600-12,000
    Product Codes- NCZ-2684K

Lanthanum (La) Metal 99.5% 2N5

Product Lanthanum (La) Metal 99.5% 2N5
CAS No. 7439-91-0
Appearance Soft, silvery-white metal
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1-100nm (Size Can be customized),  Ask for other available size range.
Ingredient La
Molecular Weight 325.81 g/mol
Melting Point 920 °C
Boiling Point N/A
Density 6.15 g/cm³
Product Codes NCZ-437I

High Purity (>95%) Short Carboxylic Multi-walled Carbon Nanotube, 25g

Product High Purity (>95%) Short Carboxylic Multi-walled Carbon Nanotube, 25g
CAS No. 308068-56-6
Appearance Black fine
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 10–20 nm (Size Can be customized),  Ask for other available size range.
Ingredient (C)x(COOH)y
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 2.1 g/cm³
Product Codes NCZ-390I

Tin Oxide (SnO2) Sputtering Target

Price range: $284.00 through $762.00

Product 

Tin Oxide (SnO2) Sputtering Target

CAS No.

 18282–10–5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

150.69 g/mol

Melting Point

 1,630 °C

Boiling Point

~1,800–1,900 °C

Density

6.95 g/cm³

Product Codes

NCZ-1378K

Vanadium Oxide (V2O5) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Vanadium (V) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250”

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tin (Sn) Sputtering Targets, elastomer, Purity: 99.99%, Size: 2”, Thickness: 0.125”

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125”

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

To achieve film deposition, sputtering targets are used. "Deposition made by sputter targets" is a method of sputtering thin films that involves eroding material from a "target" source onto a "substrate," such as a silicon wafer. Semiconductor sputtering targets are used for target etching. Sputter etching is the preferred technique when a high degree of etching anisotropy is needed and selectivity is not a concern. Sputter targets are also used for research, where the target material is removed via etching. One instance in secondary ion spectroscopy (SIMS) is a continual sputtering of the target material. When the target is sputtered, mass spectrometry is utilized to measure the concentration and identify the atoms that are spewed.

Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125”

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Germanium (Ge) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125”

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250”

Bismuth Ferrite (BiFeO3) Sputtering Targets Purity: 99.9%, Size: 6”, Thickness: 0.250” Sputtering is a well-established technique that can deposit thin

Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250”

Barium Zirconate (BaZrO3) Sputtering Targets Purity: 99.99%, Size: 4”, Thickness: 0.250” Sputtering is a well-established technique that can deposit thin

Barium Zirconate (BaZrO3) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250”

Barium Zirconate (BaZrO3) Sputtering Targets Purity: 99.99%, Size: 3”, Thickness: 0.250” Sputtering is a well-established technique that can deposit thin

MOL-C Dry 206 Black

Product Description Heat-curing dry-film paint-like solid lubricants. Dry 206 Black AFCs are formulated with PTFE (polytetrafluoroethylene) in organic binder-solvent system as a

MOL-C Dry 207 Grey

Product Description Heat-curing, solid dry-film paint-like lubricants. Dry 207 Grey AFC are formulated with MoS2 (Molybdenum Disulfide), white solids and epoxy

Mol-C Dry 305 Spray

Applications

For metal/metal combinations with slow to medium fast movements and high loads. Both the liquid coating and aerosolized spray have been used for improving the running-in process and for lubrication of plain bearings, bushings and sleeves, power screw drives, threaded connections/fasteners, and high voltage switches – even under high vacuum and at extreme temperatures. Additionally, Mol-C Dry 305 Spray is used frequently for slides, guides and tracks. Mol-C Dry 305 Spray is frequently used on hard to reach surfaces or for emergency boundary lubrication as well as on chains or as a multi-purpose penetrant.

Roll to Roll PE-CVD System for Continuous Graphene or 2D Film Growth

Applications:

  • Single layer (transparent) barrier coatings
  • Optical Coatings
  • Dielectric Coating
  • Protection Coating
  • Hard Coating Film
  • Solar Cell Technology
  • Surface Modification

Three Roll Mill

Applications:

  • Printing Inks
  • Electronic Thick Film Inks
  • High Performance Ceramics
  • Cosmetics
  • Plastisols
  • Carbon/Graphite
  • Paints
  • Pharmaceuticals
  • Chemicals
  • Glass Coatings
  • Dental Composites
  • Pigment
  • Coatings
  • Adhesives
  • Sealants

Prime CZ-Si Wafer

1 piece/53 € 5 pieces/225 € 25 pieces/1050 € Please contact us for quotes on larger quantities !!! 

Prime CZ-Si Wafer

Size: 6”, Orientation: (100), Boron Doped, 1-Side Polished, Thickness: 675 ± 15 μm

Technical Properties:

Quality Prime
Materials CZ-Si
Size (inch) 6”
Orientation (100)
Coating
Thickness (μm) 675 ± 15
Doping Boron
Resistivity (ohm.cm) 1-10
Polished One Side
Silicon is one of the most common elements on earths crust. Main usage of Silicon wafers is electronics and technology. Silicon wafers have very flat and mirror like surfaces. It is produced by Czochralski method to obtain the highest purity. Depending on the usage area, silicon wafers can be doped with different materials to tailor its purity accordingly. The amount and type of dopants highly affect the electronic properties. Galium, indium, boron and nitrogen are some of the dopants that can be used in production process. Silicon wafers are used in semiconductors, microchips, integrated circuits, smartphones, computers etc. Silicon is the key platform for semiconductor gadgets. A wafer is just but a thin slice of the semiconductor material that acts as a substratum for microelectronic devices fitted in and above the wafer.

Iron Nickel (Fe-Ni) Alloy Nanopowder/Nanoparticles, Size: 35-95 nm, Fe:Ni/2:8

Iron Nickel (Fe-Ni) Alloy Nanopowder/Nanoparticles

Size: 35-95 nm, Fe:Ni/2:8

Technical Properties:

Alloy Ratio (Fe-Ni) 20-80
Average Particle Size (nm) 35-95

Properties, Storage and Cautions:

Fe-Ni alloy nanoparticles are highly reactive, therefore it should be handled with care and rapid moves, vibrations should be avoided. The powder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, the powder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Applications:

Fe-Ni alloys are known for their low thermal expansion coefficient and high dimensional stability. They can be used in motor valves, watches, clocks, precision tools etc.  

Titanium Disilicide TiSi2

$0.00

Titanium Disilicide TiSi2 Nanoparticles

Nano Titanium Disilicide

MF TiSi2
Chemical Name Titanium  Disilicide
Purity ≥ 99%
APS 50-100 nm, 1 to 5 um, 10 um, 325 Mesh  (Size Customization possible)
Form Gray Powder
Product Number NCZ3248-20
CAS Number 12039-83-7

Note: We supply different products of microparticles and Nanoparticles powder in all sizes range according to the client’s requirements.

Titanium Disilicide Powder

Titanium disilicide (TiSi2) possesses various advantages including low electrical resistivity, high-temperature resistance, and good stability, etc. TiSi2 can be applied to a wide range of areas including microelectronics, aviation high-temperature-resistant materials, coating materials, etc. And it has become a research hotspot of relative areas.

Tantalum Disilicide Ta5Si3

$0.00

Tantalum Disilicide Nanoparticles

Tantalum Disilicide Powder Ta5Si3
MF Ta5Si3
Chemical Name Tantalum Silicide
Purity ≥ 99%
APS 50-100 nm, 1 to 5 um, 10 um, 325 Mesh  (Size Customization possible)
Form Gray Powder
Product Number NCZ3247-20
CAS Number 12067-56-0

Note: We supply different products of microparticles and Nanoparticles powder in all sizes range according to the client’s requirements.

Tantalum Disilicide is a kind of dark grey powder with cubic crystal. Ta5Si3 is mainly used in areas like heating element, integrated circuit, high-temperature oxidation resistant coating, high-temperature structural materials, and aviation and spaceflight, etc. The tantalum disilicide compound by our company based on new techniques is featured with high purity, even size distribution, large specific area, high surface activity, and low apparent density, etc.