Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 2”, Thickness: 0.125”

$89.00

Product 

Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 2'', Thickness: 0.125''

CAS No.

7631-86-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

SiO₂ (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

60.08 g/mol

Melting Point

~1710 °C

Boiling Point

~2230 °C

Density

~2.20 g/cm³

Product Codes

NCZ-1406K

Iron (Fe) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250”

$88.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125”

$87.00

Product 

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 3'', Thickness: 0.125''

CAS No.

— (alloy)

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

AlSiCu (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

~55 g/mol

Melting Point

~600–760 °C

Boiling Point

N/A

Density

 ~2.7 g/cm³

Product Codes

NCZ-1411K

Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$86.00

Product 

Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 1'', Thickness: 0.125''

CAS No.

7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

28.0855 g/mol

Melting Point

 1,414 °C

Boiling Point

3,265 °C

Density

 2.33 g/cm³

Product Codes

NCZ-1753K

Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 1”, Thickness: 0.250”

$86.00

Product 

Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 1'', Thickness: 0.250''

CAS No.

7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

28.0855 g/mol

Melting Point

 1,414 °C

Boiling Point

3,265 °C

Density

 2.33 g/cm³

Product Codes

NCZ-1752K

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250”

$85.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 1'', Thickness: 0.250''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2272K

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”

$85.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

C-NERGY SUPER C65 Conductive Carbon Black

Price range: $47.00 through $85.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

  Applications: C-NERGY Super C65 Conductive Carbon Black as Conductive Additive for Lithium-Ion Batteries

C-NERGY SUPER C65 Conductive Carbon Black

Price range: $47.00 through $85.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

  Applications: C-NERGY Super C65 Conductive Carbon Black as Conductive Additive for Lithium-Ion Batteries

C-NERGY SUPER C65 Conductive Carbon Black

Price range: $47.00 through $85.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

  Applications: C-NERGY Super C65 Conductive Carbon Black as Conductive Additive for Lithium-Ion Batteries

Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$84.00

Product 

Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 1'', Thickness: 0.125''

CAS No.

7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

28.0855 g/mol

Melting Point

1,414 °C

Boiling Point

 3,265 °C

Density

 2.33 g/cm³

Product Codes

NCZ-1737K

Calcium Carbonate Nanoparticles / Nanopowder(CaCO3, 97.5+%, 15~40nm)

Price range: $53.00 through $84.00
Select options This product has multiple variants. The options may be chosen on the product page
$53/100g
$84/500g

Product 

Calcium Carbonate Nanoparticles / Nanopowder(CaCO3, 97.5+%, 15~40nm)

CAS No.

471-34-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

15~40nm(Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

100.09 g/mol

Melting Point

 Decomposes at ~825 °C

Boiling Point

N/A

Density

~2.71 g/cm³

Product Codes

NCZ-1108K

Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”

$83.00

Product 

Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.125''

CAS No.

7440-10-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 140.91 g/mol

Melting Point

931 °C

Boiling Point

 3520 °C

Density

 6.77 g/cm³

Product Codes

NCZ-1795K

Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”

$83.00

Product 

Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.250''

CAS No.

7440-10-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 140.91 g/mol

Melting Point

931 °C

Boiling Point

 3520 °C

Density

 6.77 g/cm³

Product Codes

NCZ-1794K

Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125”

$83.00

Product 

Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 1'', Thickness: 0.125''

CAS No.

7440-33-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 183.84 g/mol

Melting Point

3422 °C

Boiling Point

 5555 °C

Density

19.25 g/cm³

Product Codes

NCZ-1595K

Zinc (Zn) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125”

$82.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 2”, Thickness: 0.125”

$81.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250”

$81.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Microsphere(solid, from fly ash) (336621)

$80.00
Microsphere (solid, from fly ash) (336621) Powder shape: perfectly spherical Fineness: 0.3-300μm True density: 2.2-2.6g / cc Bulk density: 0.7-0.9g / cc Water content: ≤0.5% Color: L value = 64 to 69 pH: 3-12
Grade 12µm 24µm 45µm 300µm D(0.9) D(0.5) Price($/kg)
336621-F200 99.5% 7-10µm 80
336621-F400 99.5% 11-16µm 80
336621-F600 99.5% 18-26µm 80
336621-F800 100% 15-45µm 80
  Product Codes- NCZ-2682K

Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125”

$80.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125”

$79.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.125''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2270K

Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$78.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Silicon (Si) Sputtering Targets, P-type, Purity: 99.999%, Size: 1”, Thickness: 0.250”

$78.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250′

$77.40

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

99.9% 3N 1-5 um Alpha Aluminum Oxide (Alumina) Al2O3 Powder, 500 g

$77.00
Product 99.9% 3N 1-5 um Alpha Aluminum Oxide (Alumina) Al2O3 Powder, 500 g
CAS No. 1344-28-1
Appearance White crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1-5um (Size Can be customized),  Ask for other available size range.
Ingredient Al2O3
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 3.95–4.0 g/cm³
Product Codes NCZ-227I
 

1 kg, 75-85 um Alpha Aluminum Oxide (Alumina) Al2O3 Powder 99.9% 3N

$77.00
Product 1 kg, 75-85 um Alpha Aluminum Oxide (Alumina) Al2O3 Powder 99.9% 3N
CAS No. 1344-28-1
Appearance White
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1 - 2µm (Size Can be customized), Ask for other available size range.
Ingredient Al2O3
Molecular Weight 101.96 g/mol
Melting Point N/A
Boiling Point N/A
Density 3.987 g/cm3
Product Codes NCZ-110I

Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125”

$76.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Silicon (Si) Sputtering Targets, undoped, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$76.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Ammonium nitrate, 99.999%

Price range: $16.00 through $75.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Ammonium nitrate, 99.999%
CAS No. 6484-52-2
Appearance White crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient NH₄NO₃
Molecular Weight N/A
Melting Point 169.6 °C
Boiling Point N/A
Density 1.72 g/cm³
Product Codes NCZ-108R

Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”

$75.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”

$75.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”

$75.00

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.

Praseodymium (Pr) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”

$75.00

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.

Coin Style Single Wafer Shipper, 3’’ / 76 mm , Natural PP

Price range: $10.05 through $74.00
Select options This product has multiple variants. The options may be chosen on the product page
Introduction The wafer shippers are specifically designed to ship, transport or store semiconductor wafers. Primarily designed to hold thin silicon

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125”

$73.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 1'', Thickness: 0.125''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2274K

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125”

$73.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Coin Style Single Wafer Shipper, 6’’ / 150 mm , Natural PP

Price range: $10.50 through $70.35
Select options This product has multiple variants. The options may be chosen on the product page
Introduction The wafer shippers are specifically designed to ship, transport or store semiconductor wafers. Primarily designed to hold thin silicon

Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125”

$67.00

Product 

Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 1'', Thickness: 0.125''

CAS No.

 7429-90-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 26.98 g/mol

Melting Point

 660.3 °C

Boiling Point

 2519 °C

Density

 2.70 g/cm³

Product Codes

NCZ-2584K

Reference Electrode Filling Solution

Price range: $39.00 through $65.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Reference Electrode Filling Solution
CAS No. 7447-40-7
Appearance Clear, colorless liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient KCl
Molecular Weight 74.55 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.1 to 1.2 g/cm³
Product Codes NCZ-505I
 

Conductivity Standard Solution, 84μs/cm, 250mL

$65.00
Product Conductivity Standard Solution, 84μs/cm, 250mL
CAS No. 7447-40-7
Appearance Clear, colorless liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient KCl
Molecular Weight 74.55 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.04 g/cm³
Product Codes NCZ-328I
 

Conductivity Standard Solution, 146.5μs/cm, 250mL

$65.00
Product Conductivity Standard Solution, 146.5μs/cm, 250mL
CAS No. 7447-40-7
Appearance Clear, colorless liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient KCl
Molecular Weight 74.55 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.00 g/cm³
Product Codes NCZ-327I

Conductivity Standard Solution, 1413μs/cm, 250mL

$65.00
Product Conductivity Standard Solution, 1413μs/cm, 250mL
CAS No. 7447-40-7
Appearance Clear, colorless liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient KClH₂O
Molecular Weight 74.55 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.00 g/cm
Product Codes NCZ-326I
 

Conductivity Standard Solution, 12.85ms/cm, 250mL

$65.00
Product Conductivity Standard Solution, 12.85ms/cm, 250mL
CAS No. 7447-40-7
Appearance Clear, colorless liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient KClH₂O
Molecular Weight 74.55 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.0 g/cm
Product Codes NCZ-325I

Conductivity Standard Solution, 111.3ms/cm, 250mL

$65.00
Product Conductivity Standard Solution, 111.3ms/cm, 250mL
CAS No. 7447-40-7
Appearance Clear, colorless liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient KClH₂O
Molecular Weight 74.55 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.0 – 1.05 g/cm³
Product Codes NCZ-324I
 

Iron (Fe) Nanopowder/Nanoparticles, Purity: 99.55+%, Size: 90-100 nm, Metal Basis

$65.00
Select options This product has multiple variants. The options may be chosen on the product page

Iron (Fe) Nanopowder/Nanoparticles

Purity 99.55+%, 90-100 nm, Metal Basis

Technical Properties:

Bulk Density (g/cm3) 0,7
True Density (g/cm3) 7,9
Color black
Crystal Structure cubic
Average Particle Size (nm) 90-100
Specific Surface Area (m2/g) 4,5-7,0
Elemental Analysis Fe Mn Ni Al Ca Others
99.55 0.13 0.12 0.09 0.05 0.02

Properties, Storage and Cautions:

Iron nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Iron (Fe) Nanopowder/Nanoparticles, Purity: 99.55+%, Size: 60-70 nm, Metal Basis

$65.00
Select options This product has multiple variants. The options may be chosen on the product page

Iron (Fe) Nanopowder/Nanoparticles

Purity: 99.55+%, Size: 60-70 nm, Metal Basis

Technical Properties:

Bulk Density (g/cm3) 0,4
True Density (g/cm3) 7,9
Color black
Crystal Structure cubic
Average Particle Size (nm) 60-70
Specific Surface Area (m2/g) 7,0-10,0
Elemental Analysis Fe Mn Ni Al Ca Others
99.55 0.13 0.12 0.09 0.05 0.02

Properties, Storage and Cautions:

Iron nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Applications:

Iron nanoparticles are known for their electrical and magnetic properties. With these properties iron nanopowder can be used in magnetic probes, magnetic data storage, vacuum seals, magnetic separators and contrast agents in MRI, hard metal degradation, transistor applications etc.  

Graphene Sheet, Size: 5cm x 5cm, Thickness: 35 µm, Highly Conductive

Price range: $7.00 through $65.00
Select options This product has multiple variants. The options may be chosen on the product page
Graphene sheets are essentially the finest materials in the world. Graphene sheet is a one-atom-thick planar sheet of carbon iotas which are intensively packed in a hexagonal lattice structure. Graphene sheets show high electrical conductance at room temperatures. They are used as fillers for the improvement of electrical and mechanical properties in composite materials. Graphene sheets have a vital importance for applications in biomaterials, biosensors, biomedical devices and drug delivery. Our company sells Graphene Sheet with low prices and high quality.

Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$64.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.125''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2273K

Graphene Sheet, Size: 5cm x 5cm, Thickness: 35 µm, Highly Conductive

Price range: $8.00 through $64.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

  • Consumer electronics: smartphones, tablets, PCs, TVs
  • LED lighting
  • Energy storage
  • Automotive
  • Industrial
  • Medical
  • Military and aerospace

Coin Style Single Wafer Shipper, 4’’ / 100 mm , Natural PP

Price range: $10.00 through $63.00
Select options This product has multiple variants. The options may be chosen on the product page
Introduction The wafer shippers are specifically designed to ship, transport or store semiconductor wafers. Primarily designed to hold thin silicon

Coin Style Single Wafer Shipper, 5’’ / 125 mm , Natural PP

Price range: $10.00 through $63.00
Select options This product has multiple variants. The options may be chosen on the product page
Introduction The wafer shippers are specifically designed to ship, transport or store semiconductor wafers. Primarily designed to hold thin silicon

Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125”

$62.00

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon. Aluminum which has the chemical symbol of Al, is a silvery white, soft, ductile metal that is the third most abundant element. Aluminum is notable due to for its light weight, strength, durability and for its ability to resist corrosion. Aluminum forms an extremely thin but very strong layer of oxide film. Aluminum has also high thermal and electrical conductivity. Aluminum sputtering targets have a particularly fine-grained microstructure. This property of Aluminum sputtering targets ensures that you benefit from uniform erosion and a low susceptibility to particle formation throughout the sputtering process.

Coin Style Single Wafer Shipper, 6’’ / 150 mm , Natural PP

Price range: $9.60 through $62.00
Select options This product has multiple variants. The options may be chosen on the product page
1 piece: 8.6 € 5 pieces: 37 € 10 pieces: 56 € Coin Style Single Wafer Shipper, 6’’ / 150 mm , Natural PP  Introduction
  • The wafer shippers are specifically designed to ship, transport or store semiconductor wafers. Primarily designed to hold thin silicon wafers, but are equally suitable for glass, quartz, sapphire, GaAs and other thin round wafers in sizes from Ø2” to 6” or Ø51 to 150mm.
  • These wafer shippers/carriers are also known as coin shippers
  • They comprise of three parts: base, spider spring and locking cap.
  • The inside of the base is concave to ensure that the wafers are held at the edges only.
  • The spider spring holds the wafer in place once the cap is locked to the base.
  • Available in sizes of 2” to 6” or equivalent 51 to 150mm diameter which a translucent, natural polypropylene

Product #

Wafer Size

Dimensions

Material

NG01WS0401 6” / 150 mm Ø160 x 20 mm Natural translucent PP
  WAFER SHIPPER FEATURES •  For shipping and storage of 6'' wafers •  Positive closure •  Holds one wafer facedown •  Wafer face contact is on the edge only •  Eight spring cushion holds the wafer •  Stackable WAFER SHIPPER SPECIFICATIONS Polypropylene (PP) Properties: •  Translucent/milky white •  Low dielectric constant (insulating) •  Not hygroscopic (water absorption <0.01%) •  Continuous use temperature limit: 55 C •  Melting temperature: 164 C •  Specific gravity: 0.9g/cm^3 •  Chemical resistance: IPA OK, Acetone OK The “Coin Style” single wafer shippers or wafer holders are available in different sizes and materials (Natural PP). For easy loading/unloading in automated or manual applications. They are impact resistant with a screw-on lid for secure packing. Single wafer shipping container for safe transporting of your 6" (150 mm) wafers. The  coinstyle shippers are cylindrical shaped and usually include a sping (they can also be ordered without a spring). The coin style shippers are designed to absorb impact and have a screw-on lid for secure packing of your wafers.

Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 1”, Thickness: 0.250”

$60.00

Product 

Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 1'', Thickness: 0.250''

CAS No.

7631-86-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

60.08 g/mol

Melting Point

~1710°C

Boiling Point

 ~2,950 °C

Density

~2.20 g/cm³

Product Codes

NCZ-1718K

Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$60.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$60.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum chloride, anhydrous, 99.999%

Price range: $16.00 through $59.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Aluminum chloride, anhydrous, 99.999%
CAS No. 7446-70-0
Appearance White to yellow solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient AlCl₃
Molecular Weight 133.34 g/mol
Melting Point 192.6 °C
Boiling Point 180°C
Density 2.44 g/cm³
Product Codes NCZ-100R
 

Standard pH 7.00 Buffer Solution, 250 mL

$59.00
Product Standard pH 7.00 Buffer Solution, 250 mL
CAS No. N/A
Appearance Clear, colorless liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient KH₂PO₄
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density N/A
Product Codes NCZ-539I

Standard pH 4.01 Buffer Solution, 250 mL

$59.00
Product Standard pH 4.01 Buffer Solution, 250 mL
CAS No. N/A
Appearance Clear, colorless liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient KHC₈H₄O₄
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density N/A
Product Codes NCZ-536I
 

Standard pH 10.01 Buffer Solution, 250 mL

$59.00
Product Standard pH 10.01 Buffer Solution, 250 mL
CAS No. N/A
Appearance Clear, colorless liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient Na₂B₄O₇·10H₂O
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density N/A
Product Codes NCZ-534I