Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125”

$631.00

Product 

Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 4'', Thickness: 0.125''

CAS No.

18282-10-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

150.71 g/mol

Melting Point

~1630 °C

Boiling Point

~1800–1900 °C

Density

~6.95 g/cm³

Product Codes

NCZ-1626K

Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250”

$632.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Strontium Titanate Sputtering Target SrTiO3

Price range: $632.00 through $833.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Strontium Titanate Sputtering Target SrTiO3
CAS No. 12060-59-2
Appearance Off-white to grey
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient SrTiO3
Molecular Weight 183.49 g/mol
Melting Point 2,080 °C
Boiling Point N/A
Density 5.11 g/cm3
Product Codes NCZ-140H

Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125”

$632.00

Product 

Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 4'', Thickness: 0.125''

CAS No.

1314-61-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 441.89 g/mol

Melting Point

 ~1872 °C

Boiling Point

N/A

Density

~8.2 g/cm³

Product Codes

NCZ-1649K

Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250”

$632.00

Product 

Cobalt Iron Boron (Co-Fe-B) Sputtering Targets, Purity: 99.9%, Size: 3'', Thickness: 0.250''

CAS No.

N/A

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ≈ 125.59 g/mol

Melting Point

N/A

Boiling Point

N/A

Density

N/A

Product Codes

NCZ-2275K

Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$632.00

Product 

Antimony Telluride (Sb2Te3) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.125''

CAS No.

12068-69-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

626.32 g/mol

Melting Point

620 °C

Boiling Point

N/A

Density

 6.50 g/cm³

Product Codes

NCZ-2500K

Molybdenum Disilicide (MoSi2) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$633.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250”

$633.00

Product 

Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.250''

CAS No.

 1304-82-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

800.55 g/mol

Melting Point

~585 °C

Boiling Point

~987 °C (sublimes)

Density

 ~7.7 g/cm³

Product Codes

NCZ-2402K

Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$633.00

Product 

Bismuth Telluride (Bi2Te3) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.125''

CAS No.

 1304-82-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

800.55 g/mol

Melting Point

~585 °C

Boiling Point

~987 °C (sublimes)

Density

 ~7.7 g/cm³

Product Codes

NCZ-2403K

Boron Carbide (B4C) Sputtering Targets, indium, Purity: 99.5%, Size: 2”, Thickness: 0.125”

$634.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125”

$634.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125”

$634.00

Product 

Tantalum Oxide (Ta2O5) Sputtering Targets, Purity: 99.99%, Size: 3'', Thickness: 0.125''

CAS No.

1314-61-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 441.89 g/mol

Melting Point

 ~1872 °C

Boiling Point

N/A

Density

~8.2 g/cm³

Product Codes

NCZ-1652K

Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125”

$634.00

Product 

Barium Titanate (BaTiO3) Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.125''

CAS No.

 12047‑27‑7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

1 – 5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

233.19 g/mol

Melting Point

~1625 °C

Boiling Point

N/A

Density

 ~6.02 g/cm³

Product Codes

NCZ-2464K

Cadmium Selenide Quantum Dots (CdSe/ZnS QD) 480 nm

Price range: $635.00 through $1,639.00
Select options This product has multiple variants. The options may be chosen on the product page
APPLICATIONS CdSe QDs have several uses because of their photoluminescence and electroluminescence capabilities. using CdSe quantum dots in;
  • Bioimaging,
  • Light Emitting Diodes (LEDs),
  • Solar Cell,
  • Sensors,
  • Single-electron transistors,
  • Display devices.

Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250”

$635.00

Product 

Indium Zinc Oxide/IZO (InZnO) Sputtering Targets, Purity: 99.99%, Size: 3'', Thickness: 0.250''

CAS No.

Indium oxide (In₂O₃): 1312-43-2
Zinc oxide (ZnO): 1314-13-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

Approx. 260–270 g/mol (depends on ratio)

Melting Point

Indium oxide: ~1910 °C Zinc oxide: ~1975 °C

Boiling Point

N/A

Density

~7.1 g/cm³

Product Codes

NCZ-2196K

Boron (B) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125”

$637.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.250”

$637.00

Product 

Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 6'', Thickness: 0.250''

CAS No.

12069‑32‑8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~55.26 g/mol

Melting Point

~2350 °C

Boiling Point

> 3500 °C (decomposes above ~2800 °C)

Density

 ~2.37 g/cm³ (theoretical)

Product Codes

NCZ-2382K

Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125”

$639.00

Product 

Lithium Phosphate (Li3PO4) Sputtering Targets, Purity: 99.95%, Size: 1'', Thickness: 0.125''

CAS No.

10377-52-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 115.79 g/mol

Melting Point

 ~837 °C

Boiling Point

~158 °C (likely decomposition)

Density

 ~2.53 g/cm³

Product Codes

NCZ-2035K

Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125”

$640.00

Product 

Boron Carbide (B4C) Sputtering Targets, Purity: 99.5%, Size: 4'', Thickness: 0.125''

CAS No.

12069‑32‑8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~55.26 g/mol

Melting Point

~2350 °C

Boiling Point

> 3500 °C (decomposes above ~2800 °C)

Density

 ~2.37 g/cm³ (theoretical)

Product Codes

NCZ-2385K

Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”

$641.00

Product 

Lanthanum Strontium Manganate (La0.9Sr0.1MnO3) Sputtering Targets, Purity: 99.9%, Size: 2'', Thickness: 0.250''

CAS No.

~68189-52-4 (generic for La₁₋ₓSrₓMnO₃ compounds)

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

<5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~237.5 g/mol (calculated from atomic weights)

Melting Point

 >1300 °C (material decomposes before reaching a precise melting point)

Boiling Point

N/A

Density

 ~6.4 – 6.5 g/cm³ (typical for perovskite LSMO ceramics)

Product Codes

NCZ-2097K

Tungsten (W) Sputtering Targets, elastomer, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$642.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Hafnium Oxide (HfO2) Nanopowder, 50nm, ≥99.99% (4N) Purity, 100g

$642.00
Product Hafnium Oxide (HfO2) Nanopowder, 50nm, ≥99.99% (4N) Purity, 100g
CAS No. 12055-23-1
Appearance White to off-white fine
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 50nm (Size Can be customized),  Ask for other available size range.
Ingredient HfO₂
Molecular Weight 210.49 g/mol
Melting Point N/A
Boiling Point N/A
Density 9.68 g/cm³
Product Codes NCZ-372I

Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125”, Beige to White

$643.00

Product 

Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.99%, Size: 1'', Thickness: 0.125'', Beige to White

CAS No.

13463‑67‑7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

TiO₂ (black granules) (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

79.94 g/mol

Melting Point

~1,843 °C

Boiling Point

~2,972 °C

Density

~4.23 g/cm³

Product Codes

NCZ-1444K

Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125”

$643.00

Product 

Tin (Sn) Sputtering Targets, Purity: 99.99%, Size: 6'', Thickness: 0.125''

CAS No.

7440-31-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

118.71 g/mol

Melting Point

231.93 °C

Boiling Point

2602 °C

Density

~7.31 g/cm³

Product Codes

NCZ-1637K

Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250”

$643.00

Product 

Niobium Oxide (Nb2O5) Sputtering Targets, Purity: 99.5%, Size: 4'', Thickness: 0.250''

CAS No.

1313-96-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 265.81 g/mol

Melting Point

~1512 °C

Boiling Point

N/A

Density

 4.6 – 4.9 g/cm³

Product Codes

NCZ-1805K

Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”

$643.00

Product 

Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 2'', Thickness: 0.250''

CAS No.

123273‑09‑6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 ~1–5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~313.9 g/mol

Melting Point

 ~1,550 °C (approximate; ceramic decomposition likely above)

Boiling Point

N/A

Density

 ~5.3 g/cm³ @ room temp

Product Codes

NCZ-2155K

Molybdenum Disulfide (MoS2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250”

$644.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Cadmium Selenide Quantum Dots (CdSe/ZnS QD) 460 nm

Price range: $645.00 through $1,650.00
Select options This product has multiple variants. The options may be chosen on the product page
APPLICATIONS CdSe QDs have several uses because of their photoluminescence and electroluminescence capabilities. using CdSe quantum dots in;
  • Bioimaging,
  • Light Emitting Diodes (LEDs),
  • Solar Cell,
  • Sensors,
  • Single-electron transistors,
  • Display devices.

Calcium Manganate (CaMnO3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”

$645.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tungsten Titanium (TiW) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250”

$645.00

Applications of Sputtering Targets;

For film deposition, sputtering targets are employed. A sputtering technique called "deposition made by sputter targets" entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Targets are etched using semiconductor sputtering targets. When etching anisotropy is required to a great degree and selectivity is not an issue, sputter etching is the method of choice. By etching away the target material, sputter targets are also utilized for investigation. In one instance, the target sample is sputtered at a steady pace in secondary ion spectroscopy (SIMS). Using mass spectrometry, the concentration and identity of the spewed atoms are determined when the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

High Purity 5N (99.999%) Gallium Phosphide (GaP) Pieces (1-5mm) Evaporation Materials

$645.00
Select options This product has multiple variants. The options may be chosen on the product page
Product High Purity 5N (99.999%) Gallium Phosphide (GaP) Pieces (1-5mm) Evaporation Materials
CAS No. 12063-98-8
Appearance Pale orange solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1-5mm (Size Can be customized),  Ask for other available size range.
Ingredient GaP
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 4.138 g/cm3
Product Codes NCZ-150E

High Purity 5N (99.999%) Gallium Phosphide (GaP) Pieces (1-5mm) Evaporation Materials

$645.00
Select options This product has multiple variants. The options may be chosen on the product page
Product High Purity 5N (99.999%) Gallium Phosphide (GaP) Pieces (1-5mm) Evaporation Materials
CAS No. 12063-98-8
Appearance Pale orange solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1-5mm (Size Can be customized),  Ask for other available size range.
Ingredient GaP
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 4.138 g/cm3
Product Codes NCZ-150E

Cerium (IV) Fluoride, CeF4, 99.95% 3N5 High Purity Powder

$645.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Cerium (IV) Fluoride, CeF4, 99.95% 3N5 High Purity Powder
CAS No. 13709-97-8
Appearance White to pale yellow
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient CeF4
Molecular Weight 194.08 g/mol
Melting Point N/A
Boiling Point N/A
Density 6.8 g/cm³
Product Codes NCZ-312I
 

Graphdiyne Film on 100um Cu Base, 1cm×1cm

$645.00
Product Graphdiyne Film on 100um Cu Base, 1cm×1cm
CAS No. N/A
Appearance Dark brown to black
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 100um (Size Can be customized),  Ask for other available size range.
Ingredient C₈H₂
Molecular Weight 98.1 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.9–2.1 g/cm³
Product Codes NCZ-357I

High Purity 5N (99.999%) Gallium Phosphide (GaP) Pieces (1-5mm) Evaporation Materials

$645.00
Select options This product has multiple variants. The options may be chosen on the product page
Product High Purity 5N (99.999%) Gallium Phosphide (GaP) Pieces (1-5mm) Evaporation Materials
CAS No. 7723-14-0
Appearance Shiny, crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1–5mm (Size Can be customized),  Ask for other available size range.
Ingredient GaP
Molecular Weight 145.27 g/mol
Melting Point 1460 °C
Boiling Point N/A
Density 4.138 g/cm³
Product Codes NCZ-396I
 

Lithium Titanate (Li2TiO3) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$645.00

Product 

Lithium Titanate (Li2TiO3) Sputtering Targets, indium, Purity: 99.95%, Size: 3'', Thickness: 0.125''

CAS No.

12031-82-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

109.75 g/mol

Melting Point

Decomposes before melting (~1,200 °C)

Boiling Point

N/A

Density

~3.41 g/cm³

Product Codes

NCZ-2008K

Sodium Beta Alumina Solid Electrolyte Powder, 99.9% Purity, 1um Size

Price range: $645.00 through $5,485.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Sodium Beta Alumina Solid Electrolyte Powder, 99.9% Purity, 1um Size
CAS No. 1302-74-5
Appearance White or off-white fine
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1um (Size Can be customized),  Ask for other available size range.
Ingredient NaAl₁₁O₁₇
Molecular Weight 1,950 °C
Melting Point N/A
Boiling Point N/A
Density 3.26 g/cm³
Product Codes NCZ-527I

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250”

$645.00

Product 

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 4'', Thickness: 0.250''

CAS No.

 10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

24.82 g/mol

Melting Point

~2973 °C

Boiling Point

N/A

Density

~2.1 g/cm³

Product Codes

NCZ-2368K

Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”

$646.00

Product 

Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 2'', Thickness: 0.250''

CAS No.

12190‑79‑3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

97.87 g/mol

Melting Point

Decomposes at ~1,100–1,130 °C

Boiling Point

N/A

Density

~4.80–4.95 g/cm³

Product Codes

NCZ-2052K

Zinc Fluoride (ZnF2) Powder 99.99% 4N

$646.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Zinc Fluoride (ZnF2) Powder 99.99% 4N
CAS No. 7789-38-0
Appearance White crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient ZnF2
Molecular Weight 81.38 g/mol
Melting Point N/A
Boiling Point N/A
Density 4.85 g/cm³
Product Codes NCZ-608I
 

Bismuth Ferrite (BiFeO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”

$647.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance, the

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

One of the most promising multiferroic materials is bismuth ferrite, an inorganic chemical compound with a perovskite structure and the chemical formula BiFeO3. In order to create a one-phase material called bismuth ferrite (BiFeO3), a bismuth ferrite sputtering target is often manufactured by high temperature sinttering or recrystallizing the mixture of the oxide compound of Bi and Fe. For targets that are sputtering bismuth ferrite, indium bonding is advised.

Cerium Oxide (CeO2) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250”

$647.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125”

$647.00

Product 

Tungsten Disulfide (WS2) Sputtering Targets, Purity: 99.9%, Size: 4'', Thickness: 0.125''

CAS No.

 12138-09-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

247.97 g/mol

Melting Point

~1,250 °C

Boiling Point

N/A

Density

~7.5 g/cm³

Product Codes

NCZ-1580K

Strontium Titanate (SrTiO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.250”

$648.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Zinc Oxide (ZnO) with Alumina Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250”

$648.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Chromium (Cr) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$649.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Silvery, shiny, hard, and brittle, chromium is a metal that resists corrosion and has a high mirror polish. Chromium sputtering targets are widely used in the automotive sector. Chromium sputtering targets work well as a shiny coating for bumpers and wheels. Chromium sputtering targets can be employed in a variety of vacuum applications, such as automotive glass coatings.

Because of its strong resistance to corrosion, chromium sputtering targets are a good choice for producing coatings that are resistant to corrosion. Hard material coatings made from chromium sputtering targets are used in industry to best protect engine parts like piston rings from premature wear and so increase the useful life of critical engine components.

Additionally, the production of batteries and solar cells uses chromium sputtering targets. In conclusion, chromium sputtering targets are employed in a variety of technologies for the physical deposition of thin films and functional coatings (the PVD method), in the manufacturing of electronic components, displays, and tools; in the vacuum chroming of watches, parts of household appliances, and the working surfaces of

Copper-Nickel Nanowire Dispersion, 200mg/bottle

$649.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Copper-Nickel Nanowire Dispersion, 200mg/bottle
CAS No. N/A
Appearance Reddish-brown to brown
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 50–150nm (Size Can be customized),  Ask for other available size range.
Ingredient CuNi
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 1 g/cm³
Product Codes NCZ-331I
 

Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”

$649.00

Product 

Lithium Cobalt Oxide (LiCoO2) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.125''

CAS No.

12190‑79‑3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

97.87 g/mol

Melting Point

Decomposes at ~1,100–1,130 °C

Boiling Point

N/A

Density

~4.80–4.95 g/cm³

Product Codes

NCZ-2054K

Nanocellulose Water Solution, 100mL/bottle

Price range: $649.00 through $1,144.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Nanocellulose Water Solution, 100mL/bottle
CAS No. N/A
Appearance Milky white to translucent gel
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 10–50nm (Size Can be customized),  Ask for other available size range.
Ingredient C₆H₁₀O₅
Molecular Weight 162.14 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.01–1.05 g/cm³
Product Codes NCZ-469I
 

Vanadium Aluminum Carbide (V2AlC) MAX Phase Micron-Powder (1-40μm), 10g

$649.00
Product Vanadium Aluminum Carbide (V2AlC) MAX Phase Micron-Powder (1-40μm), 10g
CAS No. 12179-42-9
Appearance Dark gray to black
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1-40μm (Size Can be customized),  Ask for other available size range.
Ingredient V2AlC
Molecular Weight 140.8 g/mol
Melting Point N/A
Boiling Point N/A
Density 3.99–4.85 g/cm³
Product Codes NCZ-592I
 

Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125”

$650.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.125”

$650.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Cobalt (Co) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$650.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

The chemical element cobalt has the atomic number 27 and the symbol Co. Cobalt is a silver-gray, hard, and shiny metal. Because it is one of only three room temperature ferromagnets with unaxial symmetry and hence suitability for digital recording, cobalt is employed in the production of high-strength, wear-resistant alloys as well as magnetic recording.

Lanthanum Calcium Manganate (La0.7Ca0.3MnO3) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125”

$650.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250”, Grey to Black

$650.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125”

$651.00

Product 

Tungsten (W) Sputtering Targets, Purity: 99.95%, Size: 8'', Thickness: 0.125''

CAS No.

7440-33-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 183.84 g/mol

Melting Point

3422 °C

Boiling Point

 5555 °C

Density

19.25 g/cm³

Product Codes

NCZ-1585K

Cesium iodide(CsI, 99.999%) (553836)

$651.00
Select options This product has multiple variants. The options may be chosen on the product page
Cesium iodide(CsI, 99.999%) (553836)
CAS NO.: 7789-17-5 [Formula] CsI [Properties] White crystal, soluble in water and alcohol. M. P. 621℃ [Standard of Quality]  
CsI min% Impurities Max ppm
Li K Na Ca Mg Fe Al Sr Rb Cr Mn SiO2
99.999 0.5 1 0.5 0.5 0.2 0.2 0.1 1 1 0.1 0.5 /
 
Product Codes- NCZ-2744K

Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125”

$652.00

Product 

Tin Oxide (SnO2) Sputtering Targets, Purity: 99.99%, Size: 3'', Thickness: 0.125''

CAS No.

18282-10-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

150.71 g/mol

Melting Point

~1630 °C

Boiling Point

~1800–1900 °C

Density

~6.95 g/cm³

Product Codes

NCZ-1628K

Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125”

$652.00

Product 

Magnesium Fluoride (MgF2) Sputtering Targets, Purity: 99.9%, Size: 3'', Thickness: 0.125''

CAS No.

7783-40-6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 62.30 g/mol

Melting Point

~1263 °C

Boiling Point

~2260 °C

Density

 3.18 g/cm³

Product Codes

NCZ-1982K

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125”

$653.00

Product 

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 2'', Thickness: 0.125''

CAS No.

 1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

101.96 g/mol

Melting Point

~2,072 °C

Boiling Point

~2,977 °C

Density

~3.97–3.98 g/cm³

Product Codes

NCZ-2544K