Silicon Oxide Nanoparticles / Nanopowder modified with single layer chain

Price range: $93.00 through $247.00
Select options This product has multiple variants. The options may be chosen on the product page
$93/25g
$247/100g

Product 

Silicon Oxide Nanoparticles / Nanopowder modified with single layer chain

CAS No.

7631-86-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 10-25 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

60.08 g/mol

Melting Point

~1,710 °C (core SiO₂)

Boiling Point

~2,230 °C

Density

~2.2 g/cm³

Product Codes

NCZ-1173K

Silicon Oxide Nanoparticles / Nanopowder modified with single layer chain

Price range: $93.00 through $247.00
Select options This product has multiple variants. The options may be chosen on the product page
$93/25g
$247/100g

Product 

Silicon Oxide Nanoparticles / Nanopowder modified with single layer chain

CAS No.

7631-86-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 10-20nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

60.08 g/mol

Melting Point

~1,710 °C (core SiO₂)

Boiling Point

~2,230 °C

Density

~2.2 g/cm³

Product Codes

NCZ-1171K

Styrene-Butadiene Rubber (SBR) Binder for Li-ion Battery Anode Materials

Price range: $148.00 through $247.00
Select options This product has multiple variants. The options may be chosen on the product page
500 ml/148 € 1000 ml/247 € Please contact us for quotes on larger quantities !!! Styrene-Butadiene Rubber (SBR) Binder for Li-ion Battery Anode

Tungsten (W) Nanopowder/Nanoparticles, Purity: 99.955+%, Size: 65 nm, Metal Basis

Price range: $82.86 through $246.30
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Tungsten (W) Nanopowder/Nanoparticles Purity: 99.955+%, Size: 65 nm, Metal Basis Technical Properties: True Density (g/cm3) 19,3 Bulk Density (g/cm3) 4,1

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$246.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 3'', Thickness: 0.125''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-1999K

Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250”

$246.00

Product 

Molybdenum (Mo) Sputtering Targets, Purity: 99.95%, Size: 4'', Thickness: 0.250''

CAS No.

 7439-98-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

95.95 g/mol

Melting Point

 2623 °C

Boiling Point

 4639 °C

Density

10.28 g/cm³

Product Codes

NCZ-1934K

Silicon (Si) Sputtering Targets, N-type, Purity: 99.999%, Size: 1”, Thickness: 0.250”

$246.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 4”, Thickness: 0.250”

$246.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250”

$245.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 3'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

~1453–1455 °C

Boiling Point

~2913 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1882K

Nickel Powder ( Ni, 99.9%, -325 mesh )

Price range: $55.00 through $245.00
Select options This product has multiple variants. The options may be chosen on the product page
$55/100g
$175/500g
$245/1kg

Product 

Nickel Powder ( Ni, 99.9%, -325 mesh )

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

-325 mesh (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

58.69 g/mol

Melting Point

1455 °C

Boiling Point

2913 °C

Density

8.90 g/cm³

Product Codes

NCZ-1058K

Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125”

$244.00

Product 

Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 4'', Thickness: 0.125''

CAS No.

 7782‑42‑5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

12.01 g/mol

Melting Point

~3,652 °C (no liquid phase)

Boiling Point

 ~4,200 °C

Density

 ~2.25 g/cm³

Product Codes

NCZ-2350K

Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250”

$244.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 3'', Thickness: 0.250''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2263K

Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250”

$244.00

Product 

Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 1'', Thickness: 0.250''

CAS No.

12061-16-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

382.52 g/mol

Melting Point

~2,343 °C

Boiling Point

N/A

Density

~8.64 g/cm³

Product Codes

NCZ-2249K

Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 5”, Thickness: 0.250”

$244.00

Product 

Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 5'', Thickness: 0.250''

CAS No.

7631-86-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

60.08 g/mol

Melting Point

~1710°C

Boiling Point

 ~2,950 °C

Density

~2.20 g/cm³

Product Codes

NCZ-1713K

Nickel Vanadium (NiV) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250”

$244.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250”

$244.00

Applications of Sputtering Targets;

For film deposition, sputtering targets are employed. Using a "target" source to erode material onto a "substrate" like a silicon wafer, sputter targets are a technique for depositing thin layers. Targets are etched using semiconductor sputtering targets. When etching anisotropy is required to a great degree and selectivity is not an issue, sputter etching is the method of choice. By etching away the target material, sputter targets are also utilized for investigation. In one instance, the target sample is sputtered at a steady pace in secondary ion spectroscopy (SIMS). Using mass spectrometry, the concentration and identity of the spewed atoms are determined when the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

The chemical element cobalt has the atomic number 27 and the symbol Co. Cobalt is a silver-gray, hard, and shiny metal. Because it is one of only three room temperature ferromagnets with unaxial symmetry and hence suitability for digital recording, cobalt is employed in the production of high-strength, wear-resistant alloys as well as magnetic recording.

Aluminum Oxide (Al2O3) Nanopowder/Nanoparticles, Gamma, Purity: 99.5+%, Size: 18 nm, Hydrophilic

Price range: $12.00 through $244.00
Select options This product has multiple variants. The options may be chosen on the product page
Applications  Aluminum Oxide Nanoparticles show high hardness and high dimensional stability. It is used to improve toughness, wear resistance, thermal fatigue resistance, and ceramic density for rubber, plastics, and ceramics. It is used in high strength aluminum oxide ceramic, high purity crucibles, furnace tubes, and cutting tools. It is added to metal products, semiconductors, tapes, polishing materials, and glass products. Aluminum Oxide Nanoparticles have excellent properties for far infrared emission. It is used in fiber fabric products and high pressure sodium lamp as far-infrared emission and thermal insulation materials. In addition it is used in the field of catalysis as catalyst or catalyst carrier.

Lanthanum Oxide (La2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh

Price range: $12.00 through $244.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

Lanthanum oxide is used as a catalyst in organic chemical productions, autompbile exhausts, and in improving propellant burning rates. In electronics it can be used in light converting films due to its high photoelectric conversion efficiency. It can also be used in piezoelectric materials, electrode materials, laser materials, hydrogen storage materials, and light emmitting materials. Lanthanum oxide can also be used for manufacturing all kinds of alloy materials, optical glass, and high refraction optical fibers.

APPLICATION AREAs • Energy Storage, including Batteries and Fuel Cells • Conductive Paper • Conductive Liquid Dispersion • As a Catalyst Support • Antistatic and conductive applications

Price range: $69.00 through $244.00
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100 grams/69 €                      500 grams/173 €             

Lithium Iron Phosphate (LiFePO4) Powder for Li-ion Battery Cathode Application

Price range: $69.00 through $244.00
Select options This product has multiple variants. The options may be chosen on the product page
100 grams/69 €                      500 grams/173 €             

Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 18 nm, Partially Passivated

Price range: $35.00 through $244.00
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Nickel (Ni) Nanopowder/Nanoparticles

Purity: 99.95%, Size: 18 nm, Partially Passivated

Technical Properties:

Ni Purity (%) ≥99.95 (partially passivated by coating nanoparticles with 0,9 wt% Oxygen for only safe shipping)
True Density (g/cm3) 8,9
Shape spherical
Color black
Average Particle Size (nm) 18
Specific Surface Area (m2/g) 45,0-70,0
Elemental Analysis Ni Na Mg Fe Others
99.9 0.002 0.001 0.001 0.001

Properties, Storage and Cautions:

Nickel nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250”

$243.00

Product 

Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 6'', Thickness: 0.250''

CAS No.

 7429-90-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 26.98 g/mol

Melting Point

 660.3 °C

Boiling Point

 2519 °C

Density

 2.70 g/cm³

Product Codes

NCZ-2567K

Graphite Sheet Thermal Interface Material, EYG Series, 1600 W/m.K, Thickness: 25 µm, Lenght: 180 mm, Width: 115 mm

Price range: $59.00 through $243.00
Select options This product has multiple variants. The options may be chosen on the product page
1 piece / 59 € 5 pieces / 243 € Please contact us for quotes on larger quantities !   Graphite

Aluminum (Al) Micron Powder, Purity: 99.9 %, Size: 100 mesh

Price range: $17.00 through $243.00
Select options This product has multiple variants. The options may be chosen on the product page
25 grams/16 € 100 grams/56 € 500 grams/124 € 1000 grams/215 €
Please contact us for quotes on larger quantities !!

Aluminum (Al) Micron Powder

Purity: 99.9 %, Size: 100 mesh

99.99% 4N Purity Gallium Nitride (GaN) Powder

$242.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 99.99% 4N Purity Gallium Nitride (GaN) Powder
CAS No. 25617-97-4
Appearance Gray to light gray
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1–5μm (Size Can be customized),  Ask for other available size range.
Ingredient GaN
Molecular Weight 83.73 g/mol
Melting Point N/A
Boiling Point N/A
Density 6.15 g/cm³
Product Codes NCZ-247I

High Purity Lead (II) Iodide (PbI2) Trace Metals Basis, Perovskite Grade, 99.99%, 4N, 100g

$242.00
Product High Purity Lead (II) Iodide (PbI2) Trace Metals Basis, Perovskite Grade, 99.99%, 4N, 100g
CAS No. 10101-63-0
Appearance Bright yellow 
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 100–500µm (Size Can be customized), Ask for other available size range.
Ingredient PbI₂
Molecular Weight 461.01 g/mol
Melting Point 402 °C
Boiling Point 954 °C 
Density 6.16 g/cm³
Product Codes NCZ-105I

3N5 (99.95%) Titanium (Ti) Pellets Evaporation Materials

$242.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 3N5 (99.95%) Titanium (Ti) Pellets Evaporation Materials
CAS No. 7440-32-6
Appearance Silvery, Lustrous Gray, Semi-metallic 
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 3–6mm (Size Can be customized),  Ask for other available size range.
Ingredient Ti
Molecular Weight 47.88 g/mol
Melting Point N/A
Boiling Point N/A
Density 4.5 g/cm³
Product Codes NCZ-136E
 

Iron (Fe) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125”

$242.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250”

$241.00

Product 

Carbon (C) (Graphite) Sputtering Targets, Purity: 99.999%, Size: 3'', Thickness: 0.250''

CAS No.

 7782‑42‑5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

12.01 g/mol

Melting Point

~3,652 °C (no liquid phase)

Boiling Point

 ~4,200 °C

Density

 ~2.25 g/cm³

Product Codes

NCZ-2351K

Multi Walled Nanotubes (MWNTs, 95%, 10-20 nm)

Price range: $55.00 through $241.00
Select options This product has multiple variants. The options may be chosen on the product page
$55/5g
$87/25g
$241/100g
 

Product 

Multi Walled Nanotubes (MWNTs, 95%, 10-20 nm)

CAS No.

7727-54-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

10-20 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 228.20 g/mol

Melting Point

 120 °C

Boiling Point

N/A

Density

 1.98 g/cm³

Product Codes

NCZ-1232K

Titanium Dioxide (TiO2) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”, Grey to Black

$241.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250”

$241.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250”

$241.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Boron nitride(>99.3%, 6-55μm) (355673)

$240.00
Boron nitride(>99.3%, 6-55μm) (355673)
Grade BN (%) B2O3 (%) C (%) Total oxygen (%) Si, Al, Ca, Cu, K, Fe, Na, Ni, Cr (ppm) D50(μm) BET(m2/g) Tap Density(g/cm3)
TW06 >99.3 <0.3 <0.04 <0.6 <10 each 6-8 4-8 0.40-0.60
TW10 >99.5 <0.2 <0.04 <0.5 <10 each 9-12 4-8 0.35-0.50
TW15 >99.5 <0.2 <0.04 <0.5 <10 each 13-17 3-6 0.35-0.50
TW20 >99.5 <0.2 <0.04 <0.5 <10 each 17-21 3-6 0.35-0.50
TW50 >99.5 <0.2 <0.04 <0.5 <10 each 45-55 3-6 0.35-0.50
Product Codes- NCZ-2766K

Chitosan(from Aspergillus Niger) (237555)

$240.00
Select options This product has multiple variants. The options may be chosen on the product page
Chitosan(from Aspergillus Niger) (237555)
ANALYSIS SPECIFICATION RUSULT
Deacetylation ≥90% 90.18%
Appearance White or yellow powder Complies
Viscosity in 1% Acetic acid ≥15cps 18cps
Mesh size 100% pass 80 mesh Complies
Loss on drying ≤8% 7.2%
Total ash ≤ 2% 0.43%
Heavy Metals ≤20.0ppm 10ppm
As ≤ 2.0ppm 1ppm
Pb ≤ 1.0ppm 0.87ppm
Cd ≤ 0.5ppm Negative
Hg ≤ 0.5ppm Negative
Microbiological quality Total Plate Count Yeast & Mold E.Coli. Salmonella . <1000cfu/g <100cfu/g Negative Negative . 85cfu/g 18cfu/g Negative Negative
  Product Codes- NCZ-2662K

Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250”

$240.00

Product 

Zinc (Zn) Sputtering Targets, Purity: 99.95%, Size: 4'', Thickness: 0.250''

CAS No.

7440‑66‑6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

Zn (black granules) (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

65.38 g/mol

Melting Point

419.5 °C

Boiling Point

 907 °C

Density

7.14 g/cm³

Product Codes

NCZ-1465K

Graphene NanoPowder (C, 11-15 nm)

Price range: $103.00 through $240.00
Select options This product has multiple variants. The options may be chosen on the product page
$103/25g $240/100g
Product Graphene NanoPowder (C, 11-15 nm)
CAS No. 7782-42-5
Appearance Black powder
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 11-15nm (Size Can be customized),  Ask for other available size range.
Ingredient C
Molecular Weight 12.01 g/mol
Melting Point 3697 °C
Boiling Point 4830 °C
Density 0.2 g/cm³
Product Codes NCZ-109G
 

Magnesium Oxide Nanoparticles/Nanopowder (MgO) 99%, 20nm

Price range: $38.00 through $240.00
Select options This product has multiple variants. The options may be chosen on the product page
$38/25g
$67/100g
$170/500g
$240/1kg

Product 

Magnesium Oxide Nanoparticles/Nanopowder (MgO) 99%, 20nm

CAS No.

1309-48-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

20nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 40.30 g/mol

Melting Point

~2,852 °C

Boiling Point

~3,600 °C

Density

~3.58 g/cm³

Product Codes

NCZ-1150K

Nickel Nanoparticles/Nanopowder (Ni, 99.7% 40-60 nm)

Price range: $82.00 through $240.00
Select options This product has multiple variants. The options may be chosen on the product page
$82/25g
$240/100g

Product 

Nickel Nanoparticles/Nanopowder (Ni, 99.7% 40-60 nm)

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

40-60 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

58.69 g/mol

Melting Point

1455 °C

Boiling Point

2913 °C

Density

8.90 g/cm³

Product Codes

NCZ-1052K

Copper Nanoparticles/Nanopowder (Cu, 99.7% 60-80 nm)

Price range: $82.00 through $240.00
Select options This product has multiple variants. The options may be chosen on the product page
$82/25g
$240/100g

Product 

Copper Nanoparticles/Nanopowder (Cu, 99.7% 60-80 nm)

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

60-80 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

63.55 g/mol

Melting Point

1084.62 °C

Boiling Point

2562 °C

Density

8.96 g/cm³

Product Codes

NCZ-1033K

Copper Nanoparticles/Nanopowder (Cu, 99.9% 40-60 nm)

Price range: $82.00 through $240.00
Select options This product has multiple variants. The options may be chosen on the product page
$82/25g
$240/100g

Product 

Copper Nanoparticles/Nanopowder (Cu, 99.9% 40-60 nm)

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

40–60 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

63.55 g/mol

Melting Point

1084.62 °C

Boiling Point

2562 °C

Density

8.96 g/cm³

Product Codes

NCZ-1032K

Graphene NanoPowder (C, 11-15 nm)

Price range: $103.00 through $240.00
Select options This product has multiple variants. The options may be chosen on the product page
$103/25g $240/100g

Product 

Graphene NanoPowder (C, 11-15 nm)

CAS No.

1034343-98-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

11-15 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

12.01 g/mol

Melting Point

~ 3,900 °C

Boiling Point

~600–800 °C

Density

0.03–0.2 g/cm³

Product Codes

NCZ-1027K

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125”

$240.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250”

$240.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance, the It is possible to identify the target material and even detect incredibly tiny impurity amounts. There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering. The metal bismuth is silvery with a hint of pink and is fragile. Both in air and water, it is stable. Despite having poor thermal and electrical qualities, bismuth is used to create fusible alloys, a class of materials with low melting points that can be used in a variety of applications, such as thermal fuses and solders. Because pure bismuth exhibits a strong absorption of gamma rays, it can be used as a window or filter for these at the same time allowing neutrons to flow through.

Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125”

$240.00

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon. Aluminum which has the chemical symbol of Al, is a silvery white, soft, ductile metal that is the third most abundant element. Aluminum is notable due to for its light weight, strength, durability and for its ability to resist corrosion. Aluminum forms an extremely thin but very strong layer of oxide film. Aluminum has also high thermal and electrical conductivity. Aluminum sputtering targets have a particularly fine-grained microstructure. This property of Aluminum sputtering targets ensures that you benefit from uniform erosion and a low susceptibility to particle formation throughout the sputtering process.

Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125”

$239.00

Product 

Erbium Oxide (Er2O3) Sputtering Targets, Purity: 99.99%, Size: 4'', Thickness: 0.125''

CAS No.

12061-16-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

382.52 g/mol

Melting Point

~2,343 °C

Boiling Point

N/A

Density

~8.64 g/cm³

Product Codes

NCZ-2244K

Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”

$239.00

Product 

Molybdenum Oxide (MoO3) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.125''

CAS No.

1313-27-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 143.94 g/mol

Melting Point

 ~795°C

Boiling Point

 ~1155°C

Density

 ~4.7 g/cm³

Product Codes

NCZ-1904K

Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 4”, Thickness: 0.250”

$239.00

Product 

Silicon Dioxide (SiO2) Sputtering Targets, Fused Quartz, Purity: 99.995%, Size: 4'', Thickness: 0.250''

CAS No.

7631-86-9

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

SiO₂ (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

60.08 g/mol

Melting Point

~1713 °C

Boiling Point

~2230 °C

Density

~2.2 g/cm³

Product Codes

NCZ-1392K

Aluminum (Al) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125”

$239.00

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon. Aluminum which has the chemical symbol of Al, is a silvery white, soft, ductile metal that is the third most abundant element. Aluminum is notable due to for its light weight, strength, durability and for its ability to resist corrosion. Aluminum forms an extremely thin but very strong layer of oxide film. Aluminum has also high thermal and electrical conductivity. Aluminum sputtering targets have a particularly fine-grained microstructure. This property of Aluminum sputtering targets ensures that you benefit from uniform erosion and a low susceptibility to particle formation throughout the sputtering process.

Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250”

$239.00

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon. Aluminum which has the chemical symbol of Al, is a silvery white, soft, ductile metal that is the third most abundant element. Aluminum is notable due to for its light weight, strength, durability and for its ability to resist corrosion. Aluminum forms an extremely thin but very strong layer of oxide film. Aluminum has also high thermal and electrical conductivity. Aluminum sputtering targets have a particularly fine-grained microstructure. This property of Aluminum sputtering targets ensures that you benefit from uniform erosion and a low susceptibility to particle formation throughout the sputtering process.

Antimony (Sb) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250”

$238.00

Product 

Antimony (Sb) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.250''

CAS No.

 7440-36-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 121.76 g/mol

Melting Point

 630.6 °C

Boiling Point

 1587 °C

Density

 6.69 g/cm³

Product Codes

NCZ-2510K

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 3”, Thickness: 0.125”

$238.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 3'', Thickness: 0.125''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-1998K

1 kg, 1-2 um Alpha Aluminum Oxide (Alumina) Al2O3 Powder 99.999% 5N

$238.00
Product 1 kg, 1-2 um Alpha Aluminum Oxide (Alumina) Al2O3 Powder 99.999% 5N
CAS No. 1344-28-1
Appearance White
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1-2um (Size Can be customized), Ask for other available size range.
Ingredient Al2O3
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 3.987 g/cm3
Product Codes NCZ-109I
 

3N5 (99.95%) Tungsten (W) Wire Evaporation Materials

Price range: $165.00 through $238.00
Select options This product has multiple variants. The options may be chosen on the product page
Product 3N5 (99.95%) Tungsten (W) Wire Evaporation Materials
CAS No. 7440-33-7
Appearance Grayish White, Lustrous, Metallic
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 0.5mm-1mm (Size Can be customized),  Ask for other available size range.
Ingredient W
Molecular Weight 183.84 g/mol
Melting Point 3,410 °C
Boiling Point N/A
Density 19.25 g/cm3
Product Codes NCZ-145E
 

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125”

$238.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Graphite Sheet Thermal Interface Material, EYG Series, 1700 W/m.K, Thickness: 25 µm, Lenght: 180 mm, Width: 115 mm (No reviews yet)

Price range: $58.00 through $238.00
Select options This product has multiple variants. The options may be chosen on the product page
1 piece / 58 € 5 pieces / 238 € Please contact us for quotes on larger quantities !   Graphite

Silicon Nitride (Si3N4) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”, White to Gray

$237.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Permalloy (Ni-Fe-Mo) Sputtering Targets, Size: 2”, Thickness: 0.250”

$237.00

Applications of Sputtering Targets;

Film deposition is done using sputtering targets. One technique for sputtering thin films is called "sputter target deposition," which entails eroding material from a "target" source onto a "substrate," such a silicon wafer. The target is etched using semiconductor sputtering targets. When selectivity is unimportant and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material by etching, sputter targets are also employed in analysis. One instance is in secondary ion spectroscopy (SIMS), in which the target sample is bombarded continuously. Mass spectrometry is used to quantify the concentration and identity of sputtered atoms while the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Iron (Fe) Nanopowder/Nanoparticles, Purity: 99.55%, Size: 22 nm, Partially Passivated

Price range: $37.00 through $237.00
Select options This product has multiple variants. The options may be chosen on the product page

Iron (Fe) Nanopowder/Nanoparticles

Purity: 99.55%, Size: 22 nm, Partially Passivated

Technical Properties:

Fe Purity (%) 99,5 (partially passivated by coating nanoparticles with 0,9 wt% Oxygen for only safe shipping)
Bulk Density (g/cm3) 0,15-0,30
True Density (g/cm3) 7,9
Color black
Crystal Structure cubic
Average Particle Size (nm) 22
Specific Surface Area (m2/g) 45,0-65,0
Elemental Analysis Fe Al Mn Ni Cr Others
99.5 0.16 0,08 0.007 0.006 0.004

Properties, Storage and Cautions:

Iron nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Aluminum (Al) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.250”

$236.00

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected. Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon. Aluminum which has the chemical symbol of Al, is a silvery white, soft, ductile metal that is the third most abundant element. Aluminum is notable due to for its light weight, strength, durability and for its ability to resist corrosion. Aluminum forms an extremely thin but very strong layer of oxide film. Aluminum has also high thermal and electrical conductivity. Aluminum sputtering targets have a particularly fine-grained microstructure. This property of Aluminum sputtering targets ensures that you benefit from uniform erosion and a low susceptibility to particle formation throughout the sputtering process.