Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.5%, Size:4”, Thickness: 0.125”

$390.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125”

$157.00

Product 

Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 1'', Thickness: 0.125''

CAS No.

N/A

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~57.6 g/mol

Melting Point

 ~1,400 – 1,450 °C

Boiling Point

~2,730 – 2,750 °C

Density

 ~8.6 – 8.7 g/cm³

Product Codes

NCZ-1849K

Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125”

$138.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250”

$165.00

Product 

Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 1'', Thickness: 0.250''

CAS No.

N/A

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~57.6 g/mol

Melting Point

 ~1,400 – 1,450 °C

Boiling Point

~2,730 – 2,750 °C

Density

 ~8.6 – 8.7 g/cm³

Product Codes

NCZ-1848K

Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250”

$145.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125”

$229.00

Product 

Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 2'', Thickness: 0.125''

CAS No.

N/A

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 57.5 g/mol

Melting Point

 ~1,400 – 1,450 °C

Boiling Point

 ~2,730 – 2,750 °C

Density

 ~8.7 g/cm³

Product Codes

NCZ-1846K

Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125”

$200.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250”

$253.00

Product 

Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 2'', Thickness: 0.250''

CAS No.

N/A

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 ~57.6 g/mol

Melting Point

~1,430 – 1,480 °C

Boiling Point

 ~2,730 – 2,750 °C

Density

 ~8.5 – 8.7 g/cm³

Product Codes

NCZ-1845K

Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250”

$220.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size:3”, Thickness: 0.250”

$366.00

Product 

Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size:3'', Thickness: 0.250''

CAS No.

N/A

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

N/A

Melting Point

 ~1,430–1,480 °C

Boiling Point

N/A

Density

~8.1–8.7 g/cm³ (≈8.7 g/cm³ typical for 81/19)

Product Codes

NCZ-1843K

Nickel Iron (Ni-Fe) Sputtering Targets, Purity: 99.95%, Size:3”, Thickness: 0.250”

$316.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Iron Oxide (NiFe2O4) Nanopowder/Nanoparticles, Purity: 98.99%, Size: 25 nm

Price range: $19.00 through $105.00
Select options This product has multiple variants. The options may be chosen on the product page
1 gram/17 € 5 grams/26 € 25 grams/46 € 100 grams/93 €                      
Please contact us for quotes on larger quantities !!!

Nickel Iron Oxide (NiFe2O4) Nanopowder/Nanoparticles

Purity: 98.99%, Size: 25 nm

Applications:

Nickel Iron oxide nanoparticles show good megnatic properties. It can be used in high density magnetic recording media. It can be used in magnetic liquids. It is a micrwave absorber and can be used in shielding. It has also applications in the field of catalysis.

Nickel Iron Sputtering Targets Ni/Fe

Price range: $165.00 through $469.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Nickel Iron Sputtering Targets Ni/Fe
CAS No. N/A
Appearance Solid, metallic gray sputtering target
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient NiFe
Molecular Weight N/A
Melting Point 1,500 °C
Boiling Point N/A
Density 8.7 g/cm³
Product Codes NCZ-131H
 

Nickel Nanoparticles

$0.00

Nickel nanoparticles

Nano Nickel powder

Nickel nanopowder

MF: Ni
Chemical Name: Nickel
Purity: > 99.99%
APS: 50 nm (Size Customization possible)
Form: Nanopowder/Dispersion
Product Number: #NCZ4601
CAS Number 7440-02-0
Note: We supply different products of microparticles and nanoparticles powder in all size range according to client’s requirements.

Nickel Nanoparticles / nanopowder (Ni, 99.5%, 180nm)

Price range: $114.00 through $559.00
Select options This product has multiple variants. The options may be chosen on the product page
$114/100g
$352/500g
$559/1000g

Product 

Nickel Nanoparticles / nanopowder (Ni, 99.5%, 180nm)

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

180nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

58.69 g/mol

Melting Point

1455 °C

Boiling Point

2913 °C

Density

8.90 g/cm³

Product Codes

NCZ-1055K

Nickel Nanoparticles/ Nanopowder (Ni, 99.9% 60-80 nm)

Price range: $72.00 through $210.00
Select options This product has multiple variants. The options may be chosen on the product page
$72/25g
$210/100g

Product 

Nickel Nanoparticles/ Nanopowder (Ni, 99.9% 60-80 nm)

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

60-80 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

58.69 g/mol

Melting Point

1455 °C

Boiling Point

2913 °C

Density

8.90 g/cm³

Product Codes

NCZ-1053K

Nickel Nanoparticles/Nanopowder (Ni, 99.7% 40-60 nm)

Price range: $82.00 through $240.00
Select options This product has multiple variants. The options may be chosen on the product page
$82/25g
$240/100g

Product 

Nickel Nanoparticles/Nanopowder (Ni, 99.7% 40-60 nm)

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

40-60 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

58.69 g/mol

Melting Point

1455 °C

Boiling Point

2913 °C

Density

8.90 g/cm³

Product Codes

NCZ-1052K

Nickel Nanopowder/ Nanoparticles ( Ni, 99.5%, 300nm)

Price range: $114.00 through $559.00
Select options This product has multiple variants. The options may be chosen on the product page
$114/100g $352/500g $559/1kg

Product 

Nickel Nanopowder/ Nanoparticles ( Ni, 99.5%, 300nm)

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

300nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

58.69 g/mol

Melting Point

1455 °C

Boiling Point

2913 °C

Density

8.90 g/cm³

Product Codes

NCZ-1057K

Nickel Nanopowder/ Nanoparticles ( Ni, 99.5%, 500nm)

Price range: $114.00 through $559.00
Select options This product has multiple variants. The options may be chosen on the product page
$114/100g $352/500g $559/1000g

Product 

Nickel Nanopowder/ Nanoparticles ( Ni, 99.5%, 500nm)

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

500nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

58.69 g/mol

Melting Point

1455 °C

Boiling Point

2913 °C

Density

8.90 g/cm³

Product Codes

NCZ-1054K

Nickel Nanopowder/ Nanoparticles (Ni, 99.8%, 80~150nm)

Price range: $145.00 through $350.00
Select options This product has multiple variants. The options may be chosen on the product page
$145/25g
$350/100g

Product 

Nickel Nanopowder/ Nanoparticles (Ni, 99.8%, 80~150nm)

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

80~150nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

58.69 g/mol

Melting Point

1455 °C

Boiling Point

2913 °C

Density

8.90 g/cm³

Product Codes

NCZ-1056K

Nickel Oxide (NiO) Nanopowder/Nanoparticles, High Purity: 99.55+%, Size: 10-40 nm

Price range: $29.00 through $449.00
Select options This product has multiple variants. The options may be chosen on the product page
5 grams/26 € 25 grams/46 € 100 grams/88 € 500 grams/223 € 1000 grams/398 €                
Please contact us for quotes on larger quantities !!!

Nickel Oxide (NiO) Nanopowder/Nanoparticles

High Purity: 99.55+%, Size: 10-40 nm

Technical Properties:

Purity (%) 99.55+
Color gray-black
Morphology nearly spherical
Average Particle Size (nm) 10-40
Specific Surface Area (m2/g)    >95
Bulk Density (g/cm3) 0,8
True Density (g/cm3) 6,8
Elemental Analysis (%) Al Ba Ca Mg Fe Zn
0.0017 0.0023 0.0092 0.0065 0.002 0.005
Applications: Nickel oxide nanoparticle is widely used in different materials. It is used in preparation of nickel cermet for the anode layer of solid oxide fuel cells. It is used in nanowires, nanofibers, and specific alloys. It is used in ceramic structures, electrochromic coatings, plastics, and textiles. Nickel oxide nanoparticles  is used in active optical filters, and automotive rear view mirrors with adjustable reflectance. It is also used to make energy efficient smart windows with adjustable absorption and reflectance.

Nickel Oxide (NiO) Nanopowder/Nanoparticles, High Purity: 99.99%, Size: 18 nm, Cubic

Price range: $73.00 through $280.00
Select options This product has multiple variants. The options may be chosen on the product page
5 grams/65 € 
25 grams/126 € 100 grams/248 €                       
Please contact us for quotes on larger quantities !!! 

Nickel Oxide (NiO) Nanopowder/Nanoparticles

High Purity: 99.99%, Size: 18 nm, Cubic

Technical Properties:

Purity (%) 99.99
Color dark gray
Morphology nearly spherical
Average Particle Size (nm) 18
Specific Surface Area (m2/g)    >95
Bulk Density (g/cm3) 0,8
True Density (g/cm3) 6,8
Crystal Structure cubic
Elemental Analysis (%) Cd Pb Co Mg Si Bi
0.001 0.001 0.002 0.001 0.001 0.001

Applications:

Nickel oxide nanoparticle is widely used in different materials. It is used in preparation of nickel cermet for the anode layer of solid oxide fuel cells. It is used in nanowires, nanofibers, and specific alloys. It is used in ceramic structures, electrochromic coatings, plastics, and textiles. Nickel oxide nanoparticle is used in active optical filters, and automotive rear view mirrors with adjustable reflectance. It is also used to make energy efficient smart windows with adjustable absorption and reflectance.

Nickel Oxide (NiO) Nanopowder/Nanoparticles, Purity: 99.5%, Size: 8-18 nm

Price range: $29.00 through $374.00
Select options This product has multiple variants. The options may be chosen on the product page
5 grams/26 € 25 grams/42 € 100 grams/73 € 500 grams/170 € 1000 grams/332 €
Please contact us for quotes on larger quantities !!!

Nickel Oxide (NiO) Nanopowder/Nanoparticles

Purity: 99.5%, Size: 8-18 nm

Technical Properties:

Purity (%) 99.5
Color gray-black
Morphology nearly spherical
Average Particle Size (nm) 8.0-18.0
Specific Surface Area (m2/g)    >95
Bulk Density (g/cm3) 0,8
True Density (g/cm3) 6,8
Elemental Analysis (%) Al Ba Ca Mg Fe Zn
0.002 0.0025 0.0092 0.01 0.002 0.006

Applications:

Nickel oxide nanoparticle is widely used in different materials. It is used in preparation of nickel cermet for the anode layer of solid oxide fuel cells. It is used in nanowires, nanofibers, and specific alloys. It is used in ceramic structures, electrochromic coatings, plastics, and textiles. Nickel oxide nanoparticle is used in active optical filters, and automotive rear view mirrors with adjustable reflectance. It is also used to make energy efficient smart windows with adjustable absorption and reflectance.

Nickel Oxide (NiO) Sputtering Target

Price range: $357.00 through $990.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Nickel Oxide (NiO) Sputtering Target

CAS No.

1313-99-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

74.69 g/mol

Melting Point

~1,950 °C

Boiling Point

~2,730 °C

Density

~6.67 g/cm³

Product Codes

NCZ-1321K

Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125”

$1,168.00

Product 

Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.9%, Size: 2'', Thickness: 0.125''

CAS No.

1313-99-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 ~3–5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

74.69 g/mol

Melting Point

1,950 °C

Boiling Point

 2,730 °C

Density

 6.67 g/cm³

Product Codes

NCZ-1834K

Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.9%, Size: 2”, Thickness: 0.125”

$999.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.125”

$1,266.00

Product 

Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.95%, Size: 2'', Thickness: 0.125''

CAS No.

1313-99-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 ~3–5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

74.69 g/mol

Melting Point

1,950 °C

Boiling Point

 2,730 °C

Density

 6.67 g/cm³

Product Codes

NCZ-1832K

Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.95%, Size: 2”, Thickness: 0.125”

$1,082.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$1,355.00

Product 

Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.95%, Size: 3'', Thickness: 0.125''

CAS No.

1313-99-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 ~3–5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

74.69 g/mol

Melting Point

1,950 °C

Boiling Point

 2,730 °C

Density

 6.67 g/cm³

Product Codes

NCZ-1831K

Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.98%, Size: 2”, Thickness: 0.125”

$1,249.00

Product 

Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.98%, Size: 2'', Thickness: 0.125''

CAS No.

1313-99-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 ~3–5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

74.69 g/mol

Melting Point

1,950 °C

Boiling Point

 2,730 °C

Density

 6.67 g/cm³

Product Codes

NCZ-1833K

Nickel Oxide (NiO) Sputtering Targets, indium, Purity: 99.98%, Size: 2”, Thickness: 0.125”

$1,068.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.9%, Size:1”, Thickness: 0.125”

$595.00

Product 

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.9%, Size:1'', Thickness: 0.125''

CAS No.

1313-99-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 ~3–5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

74.69 g/mol

Melting Point

1,950 °C

Boiling Point

 2,730 °C

Density

 6.67 g/cm³

Product Codes

NCZ-1841K

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.9%, Size:1”, Thickness: 0.125”

$511.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.9%, Size:1”, Thickness: 0.250”

$664.00

Product 

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:1'', Thickness: 0.250''

CAS No.

1313-99-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 ~3–5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

74.69 g/mol

Melting Point

1,950 °C

Boiling Point

 2,730 °C

Density

 6.67 g/cm³

Product Codes

NCZ-1839K

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.9%, Size:1”, Thickness: 0.250”

$570.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.9%, Size:2”, Thickness: 0.250”

$971.00

Product 

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.9%, Size:2'', Thickness: 0.250''

CAS No.

1313-99-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 ~3–5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

74.69 g/mol

Melting Point

1,950 °C

Boiling Point

 2,730 °C

Density

 6.67 g/cm³

Product Codes

NCZ-1835K

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.9%, Size:2”, Thickness: 0.250”

$831.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.98%, Size:2”, Thickness: 0.125”

$597.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.98%, Size:2”, Thickness: 0.125”

$696.00

Product 

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.98%, Size:2'', Thickness: 0.125''

CAS No.

1313-99-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 ~3–5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

74.69 g/mol

Melting Point

1,950 °C

Boiling Point

 2,730 °C

Density

 6.67 g/cm³

Product Codes

NCZ-1836K

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:1”, Thickness: 0.125”

$604.00

Product 

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:1'', Thickness: 0.125''

CAS No.

1313-99-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 ~3–5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

74.69 g/mol

Melting Point

1,950 °C

Boiling Point

 2,730 °C

Density

 6.67 g/cm³

Product Codes

NCZ-1840K

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:1”, Thickness: 0.125”

$519.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:1”, Thickness: 0.250”

$715.00

Product 

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:1'', Thickness: 0.250''

CAS No.

1313-99-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 ~3–5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

74.69 g/mol

Melting Point

1,950 °C

Boiling Point

 2,730 °C

Density

 6.67 g/cm³

Product Codes

NCZ-1838K

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:1”, Thickness: 0.250”

$613.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:2”, Thickness: 0.125”

$666.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:2”, Thickness: 0.125”

$666.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:2”, Thickness: 0.125”

$777.00

Product 

Nickel Oxide (NiO) Sputtering Targets, Purity: 99.995%, Size:2'', Thickness: 0.125''

CAS No.

1313-99-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 ~3–5 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

74.69 g/mol

Melting Point

1,950 °C

Boiling Point

 2,730 °C

Density

 6.67 g/cm³

Product Codes

NCZ-1837K

Nickel oxide nanoparticles

$0.00

Nickel oxide Nanoparticles

Nickel oxide Nanopowder

Nano Nickel oxide powder

MF: NiO
Chemical Name: Nickel oxide
Purity: > 99.99%
APS: 50 nm (Size Customization possible)
Form: Nanopowder
Product Number: #NCZ4701
CAS Number 1313-99-1
Note: We supply different products of microparticles and Nanoparticles powder in all size range according to client’s requirements.

Nickel Oxide Nanoparticles/ Nanopowder (NiO, 99.9%, 50nm)

Price range: $60.00 through $315.00
Select options This product has multiple variants. The options may be chosen on the product page
$65/25g
$120/100g
$315/500g

Product 

Nickel Oxide Nanoparticles/ Nanopowder (NiO, 99.9%, 50nm)

CAS No.

1313-99-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

50nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 74.69 g/mol

Melting Point

~1,980 °C

Boiling Point

 ~2,730 °C

Density

~6.72 g/cm³

Product Codes

NCZ-1160K

Nickel Powder ( Ni, 99.9%, -325 mesh )

Price range: $55.00 through $245.00
Select options This product has multiple variants. The options may be chosen on the product page
$55/100g
$175/500g
$245/1kg

Product 

Nickel Powder ( Ni, 99.9%, -325 mesh )

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

-325 mesh (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

58.69 g/mol

Melting Point

1455 °C

Boiling Point

2913 °C

Density

8.90 g/cm³

Product Codes

NCZ-1058K

Nickel Powder (99.5%, 1.0-1.5 um)

Price range: $83.00 through $157.00
Select options This product has multiple variants. The options may be chosen on the product page
$83/100g $157/500g

Product 

Nickel Powder (99.5%, 1.0-1.5 um)

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

1.0-1.5 um (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

58.69 g/mol

Melting Point

1455 °C

Boiling Point

2913 °C

Density

8.90 g/cm³

Product Codes

NCZ-1051K

Nickel Sputtering Target Ni

Price range: $149.00 through $706.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Nickel Sputtering Target Ni
CAS No. 7440-02-0
Appearance Silvery-white lustrous metals
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient Ni
Molecular Weight 58.69 g/mol
Melting Point 1453.0 °C
Boiling Point 2732.0 °C 
Density N/A
Product Codes NCZ-132H

Nickel Tab with Adhesive Polymer Tape as Negative Terminal for Pouch Cell, Width: 4 mm

Price range: $55.00 through $212.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

4 mm Wide Nickel Tabs for use as the Negative Terminal of Polymer Li-ion Batteries

Nickel Tab with Adhesive Polymer Tape as Negative Terminal for Pouch Cell, Width: 4 mm

Price range: $48.00 through $185.00
Select options This product has multiple variants. The options may be chosen on the product page
100 pcs/44 € 250 pcs/89 € 500 pcs/168 € Please contact us for quotes on larger quantities !!!

Nickel Tab with Adhesive Polymer Tape as Negative Terminal for Pouch Cell

Width: 4 mm

Technical Properties:

Material Nickel 99.99%, Adhesive Polymer Tape on the tab allows for immediate hot sealing
Length 57 mm
Width 4 mm
Thickness 0.09 mm
Max. Loading Current 3A
Net Weight 160 mg/pcs
Application 1. Connect to cathode current collector as polymer battery positive terminal 2. Suggested Sealing Method: (parameter below may vary from case to case) - Soft type heat-sealing blade (Blade with rubber) - 180-200 °C for upper blade - 160-180 °C for lower blade - 40 PSI (0.3 Mpa) - 3 seconds heating time 

Applications:

4 mm Wide Nickel Tabs for use as the Negative Terminal of Polymer Li-ion Batteries

Nickel Tab with Adhesive Polymer Tape as Negative Terminal for Pouch Cell, Width: 4 mm

Price range: $55.00 through $212.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

4 mm Wide Nickel Tabs for use as the Negative Terminal of Polymer Li-ion Batteries

Nickel Tabs, Width: 3 mm

Price range: $47.00 through $144.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

Nickel Tabs for use as the Negative Terminal of Polymer Li-ion Batteries

Nickel Tabs, Width: 3 mm

Price range: $40.00 through $153.00
Select options This product has multiple variants. The options may be chosen on the product page
100 sets/37 € 250 sets/78 € 500 sets/139 € Please contact us for quotes on larger quantities !!!

Nickel Tabs

Width: 3 mm

Technical Properties:

Material Nickel 99.99%, Adhesive Polymer Tape on the tab allows for immediate hot sealing
Length 50 mm
Width 3 mm
Thickness 0.09 mm
Max. Loading Current 3A
Net Weight 128 mg/pcs
Application 1. Connect to cathode current collector as polymer battery positive terminal 2. Suggested Sealing Method: (parameter below may vary from case to case) - Soft type heat-sealing blade (Blade with rubber) - 180-200 °C for upper blade - 160-180 °C for lower blade - 40 PSI (0.3 Mpa) - 3 seconds heating time 

Applications:

Nickel Tabs for use as the Negative Terminal of Polymer Li-ion Batteries

Nickel Tabs, Width: 3 mm

Price range: $47.00 through $144.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

Nickel Tabs for use as the Negative Terminal of Polymer Li-ion Batteries

Nickel Titanium (Ni-Ti) Alloy Nanopowder/Nanoparticles, Size: 55 nm, Ni:Ti/50:50

$228.00
Select options This product has multiple variants. The options may be chosen on the product page

Nickel Titanium (Ni-Ti) Alloy Nanopowder/Nanoparticles

Size: 55 nm, Ni:Ti/50:50

Technical Properties:

Alloy Ratio (Ni-Ti) 50-50
Average Particle Size (nm) 55
Elemental Analysis Ni-Ti Fe Cu Cr Others
≥99.9 0.025 0.02 0.018 0.01

Properties, Storage and Cautions:

Ni-Ti alloy nanoparticles are highly reactive, therefore it should be handled with care and rapid moves, vibrations should be avoided. The powder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, the powder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Applications:

Ni-Ti alloy materials show high elasticity and shape memory property. They can be used in heat engines, sensors, biomedical applications, actuators etc.

Nickel Titanium (Ni-Ti) Alloy Nanopowder/Nanoparticles, Size: 55 nm, Ni:Ti/50:50

$228.00
Select options This product has multiple variants. The options may be chosen on the product page

Nickel Titanium (Ni-Ti) Alloy Nanopowder/Nanoparticles

Size: 55 nm, Ni:Ti/50:50

Technical Properties:

Alloy Ratio (Ni-Ti) 50-50
Average Particle Size (nm) 55
Elemental Analysis Ni-Ti Fe Cu Cr Others
≥99.9 0.025 0.02 0.018 0.01

Properties, Storage and Cautions:

Ni-Ti alloy nanoparticles are highly reactive, therefore it should be handled with care and rapid moves, vibrations should be avoided. The powder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, the powder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Nickel Titanium (Ni-Ti) Alloy Nanopowder/Nanoparticles, Size: 55 nm, Ni:Ti/50:50

$228.00
Select options This product has multiple variants. The options may be chosen on the product page
Nickel Titanium (Ni-Ti) Alloy Nanopowder/Nanoparticles Size: 55 nm, Ni:Ti/50:50 Technical Properties: Alloy Ratio (Ni-Ti) 50-50 Average Particle Size (nm) 55