Nickel (Ni) Coated Multi-Walled Carbon Nanotubes, 30g

Price range: $462.00 through $484.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Nickel (Ni) Coated Multi-Walled Carbon Nanotubes, 30g
CAS No. N/A
Appearance Black fibrous
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 10–50nm ( (Size Can be customized),  Ask for other available size range.
Ingredient Ni
Molecular Weight 12.01 g/mol
Melting Point N/A
Boiling Point N/A
Density 0.27–0.83 g/cm³
Product Codes NCZ-476I
 

Nickel (Ni) Micron Powder Type 255, Purity: >99.7 %, APS: 2.2–2.8 μm

Price range: $94.00 through $502.00
Select options This product has multiple variants. The options may be chosen on the product page
100 grams/84 € 500 grams/295 € 1000 grams/446 €
Please contact us for quotes on larger quantities !!! 

Nickel (Ni) Micron Powder Type 255

Purity: >99.7 %, Size: 2.2–2.8 μm

Nickel (Ni) Micron Powder Type 255 is an industry standard for the manufacture of sintered electrodes used in nickel battery production, due to its controlled porosity. It is also used as a conducting additive in pasted electrodes for batteries, electronics, paints, auto-related powder metallurgy and as a hard metal binder.

Technical Properties:

PURITY

>99.7 %

PARTICLE SIZE

2.2–2.8 μm

CAS

7440-02-0

MELTING POINT

1453 °C

BOILING POINT

2730 °C

DENSITY

8.908 g/cm³

BRINNELL HARDNESS

75 Annealed

COEFF. OF EXPANSION @ 20ºC

 13.3 x 10⁻⁶

ELECTRIC RESISTIVITY

6.844 microhm-cm

FORM  

Powder

APPLICATIONS

Batteries, Pigments, Powdered metallurgical applications

               

Elemental Analysis:

Ni >99.7%
Co <0.00005%
C <0.200%
Fe <0.0030%
S <0.0002%
O <0.0750%
N <0.0100%

Nickel (Ni) Micron Powder, Purity: 99.99 %, Size: 10 µm

Price range: $9.00 through $383.00
Select options This product has multiple variants. The options may be chosen on the product page
5 grams/8 € 25 grams/27 €                        
100 grams/65 €                     
500 grams/245 €                    
1000 grams/340 € Please contact us for quotes on larger quantities !!!

Nickel (Ni) Micron Powder

Purity: 99.99 %, Size: 10 µm

Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 18 nm, Partially Passivated

Price range: $35.00 through $244.00
Select options This product has multiple variants. The options may be chosen on the product page

Nickel (Ni) Nanopowder/Nanoparticles

Purity: 99.95%, Size: 18 nm, Partially Passivated

Technical Properties:

Ni Purity (%) ≥99.95 (partially passivated by coating nanoparticles with 0,9 wt% Oxygen for only safe shipping)
True Density (g/cm3) 8,9
Shape spherical
Color black
Average Particle Size (nm) 18
Specific Surface Area (m2/g) 45,0-70,0
Elemental Analysis Ni Na Mg Fe Others
99.9 0.002 0.001 0.001 0.001

Properties, Storage and Cautions:

Nickel nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 31 nm, Metal Basis

Price range: $118.00 through $282.00
Select options This product has multiple variants. The options may be chosen on the product page

Nickel (Ni) Nanopowder/Nanoparticles

Purity: 99.95%, Size: 31 nm, Metal Basis

Technical Properties:

True Density (g/cm3) 8,9
Shape spherical
Color black
Average Particle Size (nm) 31
Specific Surface Area (m2/g) 11,0-15,0
Elemental Analysis Ni Si Mg Fe Others
99.9 0.1 0.1 0.1 0.05

Properties, Storage and Cautions:

Nickel nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 65 nm, Metal Basis

Price range: $59.00 through $182.00
Select options This product has multiple variants. The options may be chosen on the product page

Nickel (Ni) Nanopowder/Nanoparticles

Purity: 99.95%, Size: 65 nm, Metal Basis

Technical Properties:

True Density (g/cm3) 8,9
Shape spherical
Color black
Average Particle Size (nm) 65
Specific Surface Area (m2/g) 10,0-16,0
Elemental Analysis Ni Si Mg Fe Others
99.95 0.1 0.1 0.1 0.05

Properties, Storage and Cautions:

Nickel nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 790 nm, Metal Basis

Price range: $52.00 through $768.00
Select options This product has multiple variants. The options may be chosen on the product page

Nickel (Ni) Nanopowder/Nanoparticles

Purity: 99.95%, Size: 790 nm, Metal Basis

Technical Properties:

True Density (g/cm3) 8,9
Color dark gray
Crystal Structure cubic
Tmelting (oC) 1455
Tboiling (oC) 2730
Average Particle Size (nm) 790
Elemental Analysis Ni Co Mg Pb Others
99.9 0.002 0.001 0.001 0.001

Properties, Storage and Cautions:

Nickel nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 90 nm, Metal Basis

Price range: $118.00 through $232.00
Select options This product has multiple variants. The options may be chosen on the product page

Nickel (Ni) Nanopowder/Nanoparticles

Purity: 99.95%, Size: 90 nm, Metal Basis

Technical Properties:

Bulk Density (g/cm3) 1,1
True Density (g/cm3) 8,9
Shape spherical
Color black
Average Particle Size (nm) 90
Specific Surface Area (m2/g) 28,1
Elemental Analysis Ni Co Mg Pb Others
99.95 0.002 0.001 0.001 0.001

Properties, Storage and Cautions:

Nickel nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Nickel (Ni) Nanopowder/Nanoparticles, Purity: 99.95%, Size:18 nm, Carbon Coated

Price range: $53.00 through $276.00
Select options This product has multiple variants. The options may be chosen on the product page

Nickel (Ni) Nanopowder/Nanoparticles

Purity: 99.95%, Size:18 nm, Carbon Coated

Technical Properties:

Ni Purity (%) ≥99.9 (partially passivated by coating nanoparticles with 3,6 wt% Carbon for only safe shipping)
True Density (g/cm3) 8,9
Shape spherical
Color black
Average Particle Size (nm) 18
Specific Surface Area (m2/g) 45,0-70,0
Elemental Analysis Ni Na Mg Fe Others
99.9 0.002 0.001 0.001 0.001

Properties, Storage and Cautions:

Nickel nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Nickel (Ni) Sputtering Target

Price range: $187.00 through $555.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Nickel (Ni) Sputtering Target

CAS No.

 7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,913 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1357K

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”

$93.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 1'', Thickness: 0.125''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

~58.69 g/mol

Melting Point

~1,455 °C

Boiling Point

~2,913 °C

Density

~8.91 g/cm³

Product Codes

NCZ-1895K

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 1”, Thickness: 0.125”

$85.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125”

$100.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 2'', Thickness: 0.125''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

~1,453 °C

Boiling Point

~2,913 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1892K

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125”

$91.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”

$161.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 2'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

~1,453 °C

Boiling Point

~2,732 – 2,914 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1889K

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.250”

$144.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125”

$142.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 3'', Thickness: 0.125''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

~1,453 °C

Boiling Point

~2,913 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1886K

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.125”

$128.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250”

$154.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 3'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

~1453–1455 °C

Boiling Point

~2913 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1883K

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 3”, Thickness: 0.250”

$138.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125”

$168.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 4'', Thickness: 0.125''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1880K

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.125”

$150.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250”

$273.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 4'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1877K

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 4”, Thickness: 0.250”

$241.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125”

$571.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 6'', Thickness: 0.125''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1873K

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.125”

$499.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250”

$389.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 6'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1870K

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 6”, Thickness: 0.250”

$342.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125”

$389.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 8'', Thickness: 0.125''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1867K

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.125”

$342.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250”

$450.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 8'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1864K

Nickel (Ni) Sputtering Targets, Purity: 99.9%, Size: 8”, Thickness: 0.250”

$420.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250”

$424.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.95%, Size: 6'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1868K

Nickel (Ni) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250”

$372.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125”

$152.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 1'', Thickness: 0.125''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

~58.69 g/mol

Melting Point

~1,455 °C

Boiling Point

~2,913 °C

Density

~8.91 g/cm³

Product Codes

NCZ-1894K

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125”

$136.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125”

$157.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.125''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

~1,453 °C

Boiling Point

~2,913 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1891K

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125”

$141.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250”

$184.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

~1,453 °C

Boiling Point

~2,913 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1888K

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250”

$164.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125”

$171.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 3'', Thickness: 0.125''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

~1453–1455 °C

Boiling Point

2913 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1885K

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125”

$153.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250”

$245.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 3'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

~1453–1455 °C

Boiling Point

~2913 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1882K

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250”

$217.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125”

$184.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 4'', Thickness: 0.125''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1879K

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125”

$164.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250”

$283.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 4'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1876K

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250”

$250.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.250”

$328.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 5'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1874K

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.250”

$289.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125”

$341.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 6'', Thickness: 0.125''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1872K

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125”

$300.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250”

$394.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 6'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1869K

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.250”

$346.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target. There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125”

$445.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 8'', Thickness: 0.125''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1866K

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125”

$390.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250”

$520.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 8'', Thickness: 0.250''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 58.69 g/mol

Melting Point

 1,455 °C

Boiling Point

 2,732 °C

Density

 8.90 g/cm³

Product Codes

NCZ-1863K

Nickel (Ni) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250”

$447.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer.

Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 1”, Thickness: 0.125”

$124.00

Product 

Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 1'', Thickness: 0.125''

CAS No.

7440-02-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

~58.69 g/mol

Melting Point

~1,455 °C

Boiling Point

~2,913 °C

Density

~8.91 g/cm³

Product Codes

NCZ-1893K

Nickel (Ni) Sputtering Targets, Purity: 99.995%, Size: 1”, Thickness: 0.125”

$112.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.