Super absorbent polymer(Cable powder) (150521)

$177.00
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Super absorbent polymer(Cable powder) (150521)
Chemical Properties
 Copolymer with moderate cross-linking and partial neutralization.
Appearance
 White and tasteless granules.
Description
 Super absorbent polymer, made of sodium polyacrylate and mainly applied to water blocking tapes and rubber products, has a unique body structure and excellent hydrophilic groups, leading to high water absorbing capacity, strong water retention, high expansion rate as well as good biodegradation performance. It keeps water under heated and pressurized conditions. It has good stability against light, heat, acid and base.
Product Index
Particle size range Deionized water absorbing capacity(ml/g) Water content(wt%) pH value
Residual monomer amount(ppm) Gel strength Expansion height at 20 ℃ tested by deionized water(mm/min)150-180mesh ≥450 ≤7 6-7 300 strong ≥15mm/1min ≥22mm/3min
Product Codes- NCZ-2781K

Super absorbent polymer(Diaper) (036521)

$177.00
Select options This product has multiple variants. The options may be chosen on the product page
Super absorbent polymer(Diaper) (036521)
     
Chemical Properties
 Acrylic acid copolymer with moderate cross-linking and partial neutralization.
Appearance
 White and tasteless granules.
Description
 Super absorbent polymer, made of sodium polyacrylate and mainly applied to diaper products, has an unique body structure and excellent hydrophilic groups. This ensures that it not only is insoluble in water but also absorbs several hundred times of water or several dozen times of physiological saline (body fluid) its own weight, and has excellent water retention. It also has high liquid absorption speed, high pressurized absorption, good gel strength, good moisture resistance and so on. Made with advanced technology, it is of low monomer residue, nontoxic, odorless and non-stimulant to skin. It can also be completely degraded into small molecules such as water, carbon dioxide and so on.
Product Index
Particle size range Deionzied water absorbing capacity(ml/g) Deionized water retention rate(ml/g) Saline water absorbing capacity(0.9%NaCl) (g/g) Saline water absorbing capacity under pressure(0.9%NaCl, 0.7psi)(g/g) Saline water absorbing speed(second) (2g SAP absorbing 50g 0.9%NaCl) Water retention capacity after centrifugation (0.9%NaCl)(g/g) Water content(Wt%) pH value Residual monomer amount(ppm) Gel strength 30-80mesh ≥450 ≥450 ≥48 ≥26 ≤40 ≥40 ≤7 6-7 100 strong
Product Codes- NCZ-2777K

Super absorbent polymer(Sanitary napkin) (510521)

$177.00
Select options This product has multiple variants. The options may be chosen on the product page
Super absorbent polymer(Sanitary napkin) (510521)
   
Chemical Properties
 Acrylic acid copolymer with moderate crosslinking and partial neutralization.
Appearance
 White and tasteless granules.
Description
 Super absorbent polymer(SAP), made of sodium polyacrylate and mainly applied to sanitary napkins, has a unique body structure and excellent hydrophilic groups. This ensures that it not only is insoluble in water but also absorbs several hundred times of water or several dozen times of physiological saline (body fluid) its own weight, and has excellent water retention. It also has quick liquid absorption speed, high pressurized absorption, good gel strength, good moisture resistance and so on. It is made with advanced technology to be low in monomer residue, nontoxic, odorless and non-stimulant to skin. It can also be completely degraded into small molecules such as water, carbon dioxide and so on.
Product Index
Particle size range Deionized water absorbing capacity(ml/g) Deionized water retention rate(ml/g) Saline water absorbing capacity(0.9%NaCl) (g/g) Saline water absorbing capacity under pressure(0.9%NaCl) (g/g) Saline water absorbing speed (second)(2g SAP absorbing 50g 0.9%NaCl) Water retention capacity after centrifugation(0.9%NaCl) (g/g) Water content (Wt%) pH value Residual monomer amount(ppm) Gel strength 40-100mesh ≥450 ≥450 ≥48 ≥26 ≤40 ≥40 ≤7 6-7 100 strong
Product Codes- NCZ-2778K

Super Activated Carbon Nanoparticles/ Nanopowder (C, <100nm)

Price range: $64.00 through $485.00
Select options This product has multiple variants. The options may be chosen on the product page
$64/25g $128/100g $288/500g $485/1000g

Product 

Super Activated Carbon Nanoparticles/ Nanopowder (C, <100nm)

CAS No.

7440-44-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

<100 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

12.01 g/mol

Melting Point

~ 3,900 °C

Boiling Point

~600–800 °C

Density

0.03–0.2 g/cm³

Product Codes

NCZ-1028K

Superparamagnetic Iron Oxide Nanoparticle (SPION) High Concentration Suspension

Price range: $255.00 through $1,122.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Superparamagnetic Iron Oxide Nanoparticle (SPION) High Concentration Suspension
CAS No. 1317-61-9
Appearance Dark brown to black opaque liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 5–20nm (Size Can be customized),  Ask for other available size range.
Ingredient Fe₃O₄
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 5.17 g/cm³
Product Codes NCZ-545I
 

Surface Functionalized Superparamagnetic Iron Oxide Nanoparticle (SPION) High Concentration Suspension

Price range: $491.00 through $1,525.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Surface Functionalized Superparamagnetic Iron Oxide Nanoparticle (SPION) High Concentration Suspension
CAS No. 1317-61-9
Appearance Dark brown to black
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 12nm (Size Can be customized),  Ask for other available size range.
Ingredient Fe3O4-X
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density N/A
Product Codes NCZ-546I

Surface Modified Vanadium Carbide (V4C3Tx) MXene Multilayer Nanosheet

Price range: $407.00 through $1,089.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Surface Modified Vanadium Carbide (V4C3Tx) MXene Multilayer Nanosheet
CAS No. 1317-61-9
Appearance Dark gray to black
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 10–10nm (Size Can be customized),  Ask for other available size range.
Ingredient V₄C₃Tₓ
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 2.0–3.5 g/cm³
Product Codes NCZ-547I
 

SWNTs -COOH Functionalized 60%

Price range: $57.00 through $165.00
Select options This product has multiple variants. The options may be chosen on the product page
$57/1g
$165/5g

Product 

SWNTs -COOH Functionalized 60%

CAS No.

7727-54-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

1-2 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

228.20 g/mol

Melting Point

 ~120 °C

Boiling Point

NA

Density

 1.98 g/cm³

Product Codes

NCZ-1269K

SWNTs -COOH Functionalized 90%

Price range: $193.00 through $885.00
Select options This product has multiple variants. The options may be chosen on the product page
$193/1g
$885/5g

Product 

SWNTs -COOH Functionalized 90%

CAS No.

1034343-98-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

1-2 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

NA

Melting Point

 >600 °C

Boiling Point

NA

Density

~1.3–1.4 g/cm³

Product Codes

NCZ-1268K

SWNTs -COOH Functionalized 95+%

Price range: $225.00 through $795.00
Select options This product has multiple variants. The options may be chosen on the product page
$225/1g
$795/5g

Product 

SWNTs -COOH Functionalized 95+%

CAS No.

7727-54-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

30- 50 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

228.20 g/mol

Melting Point

 ~120 °C

Boiling Point

N/A

Density

1.98 g/cm³

Product Codes

NCZ-1257K

SWNTs -NH2 Functionalized 95+%

Price range: $225.00 through $795.00
Select options This product has multiple variants. The options may be chosen on the product page
$225/1g
$795/5g

Product 

SWNTs -NH2 Functionalized 95+%

CAS No.

308068-56-6 or 1007206-89-2)

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

30- 50 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

N/A

Melting Point

N/A

Boiling Point

N/A

Density

~1.3–1.4 g/cm³

Product Codes

NCZ-1258K

Synthetic Urine for Corrosion Testing of Urological Implants, Stabilized

Price range: $95.00 through $525.00
Select options This product has multiple variants. The options may be chosen on the product page

Synthetic Urine

Synthetic Urine

Product Number: NCZ-APS-0014-20

Packaging: 100 mL to 1000 mL

NOTE: Custom pH formulations can be made in the pH range from 2.0 to 9.0. For custom component formulations please contact sales@nanochemazone.com for a quote. Artificial Urine This ready-to-use solution has the same composition as Real Urine Medium and closely resembles human urine. This formulation contains a non-toxic preservatives to avoid bacteria growth and can be stored at room temperature. The pH of the Artificial Urine Stabilized is 6.5.

Artificial Urine's Application:

Artificial Urine for Corrosion Testing of Urological Implants, Stabilized

T15 Powder

Product T15 Powder
CAS No. N/A
Appearance Gray to dark-gray, spherical powder
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 0.5–15 µm (Size Can be customized),  Ask for other available size range.
Ingredient Fe₇₀W₁₅Mo₄Cr₄V₃C₄
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 13.0–14.5 g/cm³
Product Codes NCZ-174M
 

Ta2AlC MAXene Powder Low Price

$0.00

Product Name: Ta2AlC MAXene Powder

Product Ta2AlC MAXene powder
Colour Black Powder
Purity ≥98 wt%
Ingredient Ta2AlC
Product Code NCZ-MX-225

Ta2AlC MAXene powder APPLICATION FIELDS

High-temperature coating, MXene precursor, conductive self-lubricating ceramic, lithium-ion battery, supercapacitor, electrochemical catalysis.

RELATED INFORMATION

Storage Conditions: Airtight sealed, avoid light and keep dry at room temperature. Please email us for the customization. Email: contact@nanochemazone.com

Ta2C MXenes

$0.00

Product Name: Ta2C MXenes

Product Code: NCZ-MX-202
Product Ta2C MXenes
Colour Black Powder
Purity ≥98 wt%
Ingredient Ta2C
CAS NO 12316-56-2

APPLICATION FIELDS

High-temperature coating, Mxene precursor, conductive self-lubricating ceramic, lithium-ion battery, supercapacitor, electrochemical catalysis.

RELATED INFORMATION

Storage Conditions: Airtight sealed, avoid light and keep dry at room temperature. Please email us for the customization. Email: contact@nanochemazone.com

Ta4AlC3 MAXene Powder

$0.00

Product Name: Ta4AlC3 MAXene Powder

Product Ta4AlC3 MAXene powder
Colour Black Powder
Purity ≥98 wt%
Ingredient Ta4AlC3
Product Code NCZ-MX-119

APPLICATION FIELDS

High-temperature coating, MXene precursor, conductive self-lubricating ceramic, lithium-ion battery, supercapacitor, electrochemical catalysis. RELATED INFORMATION Storage Conditions: Airtight sealed, avoid light and keep dry at room temperature. Please email us for the customization. Email: contact@nanochemazone.com

Ta4C3 MXene Powder in Nano & Micro Size

$0.00

Product Name: Ta4C3 MXene Powder

Product Code: NCZ-MX-219
Product Ta4C3 MXene
Colour Black Powder
Purity ≥98 wt%
Ingredient Ta4C3
CAS NO 12316-56-2

APPLICATION FIELDS

High-temperature coating, Mxene precursor, conductive self-lubricating ceramic, lithium-ion battery, supercapacitor, electrochemical catalysis.

RELATED INFORMATION

Storage Conditions: Airtight sealed, avoid light and keep dry at room temperature. Please email us for the customization. Email: contact@nanochemazone.com

Tantalum (Ta) Nanopowder/Nanoparticles, High Purity: 99.995%, Size: 45-75 nm

Price range: $164.58 through $483.52
Select options This product has multiple variants. The options may be chosen on the product page
Tantalum (Ta) Nanopowder/Nanoparticles High Purity: 99.995%, Size: 45-75 nm Technical Properties: True Density (g/cm3) 16,7 Color black Shape spherical Tmelting (oC)

Tantalum (Ta) Sputtering Target

Price range: $137.00 through $904.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Tantalum (Ta) Sputtering Target

CAS No.

7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 180.95 g/mol

Melting Point

3,017 °C

Boiling Point

5,458 °C

Density

16.69 g/cm³

Product Codes

NCZ-1305K

Tantalum (Ta) Sputtering Targets, elastomer, Purity: 99.95%, Size: 2”, Thickness: 0.125”

$450.00

Product 

Tantalum (Ta) Sputtering Targets, elastomer, Purity: 99.95%, Size: 2'', Thickness: 0.125''

CAS No.

 7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 180.95 g/mol

Melting Point

3017 °C

Boiling Point

 5458 °C

Density

16.65 g/cm³

Product Codes

NCZ-1656K

Tantalum (Ta) Sputtering Targets, elastomer, Purity: 99.95%, Size: 2”, Thickness: 0.125”

$392.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tantalum (Ta) Sputtering Targets, elastomer, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$776.00

Product 

Tantalum (Ta) Sputtering Targets, elastomer, Purity: 99.95%, Size: 3'', Thickness: 0.125''

CAS No.

 7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

180.95 g/mol

Melting Point

 3017 °C

Boiling Point

 5458 °C

Density

 16.65 g/cm³

Product Codes

NCZ-1655K

Tantalum (Ta) Sputtering Targets, elastomer, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$672.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125”

$178.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125”

$202.00

Product 

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 1'', Thickness: 0.125''

CAS No.

 7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 180.95 g/mol

Melting Point

3017 °C

Boiling Point

 5458 °C

Density

16.65 g/cm³

Product Codes

NCZ-1667K

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250”

$205.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250”

$233.00

Product 

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 1'', Thickness: 0.250''

CAS No.

 7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 180.95 g/mol

Melting Point

3017 °C

Boiling Point

 5458 °C

Density

16.65 g/cm³

Product Codes

NCZ-1666K

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125”

$240.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125”

$274.00

Product 

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 2'', Thickness: 0.125''

CAS No.

 7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 180.95 g/mol

Melting Point

3017 °C

Boiling Point

 5458 °C

Density

16.65 g/cm³

Product Codes

NCZ-1665K

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250”

$255.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250”

$291.00

Product 

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 2'', Thickness: 0.250''

CAS No.

 7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 180.95 g/mol

Melting Point

3017 °C

Boiling Point

 5458 °C

Density

16.65 g/cm³

Product Codes

NCZ-1664K

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$453.00

Product 

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 3'', Thickness: 0.125''

CAS No.

 7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 180.95 g/mol

Melting Point

3017 °C

Boiling Point

 5458 °C

Density

16.65 g/cm³

Product Codes

NCZ-1663K

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250”

$690.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250”

$797.00

Product 

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 3'', Thickness: 0.250''

CAS No.

 7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 180.95 g/mol

Melting Point

3017 °C

Boiling Point

 5458 °C

Density

16.65 g/cm³

Product Codes

NCZ-1662K

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125”

$720.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125”

$832.00

Product 

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 4'', Thickness: 0.125''

CAS No.

 7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 180.95 g/mol

Melting Point

3017 °C

Boiling Point

 5458 °C

Density

16.65 g/cm³

Product Codes

NCZ-1661K

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250”

$732.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250”

$846.00

Product 

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 4'', Thickness: 0.250''

CAS No.

 7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 180.95 g/mol

Melting Point

3017 °C

Boiling Point

 5458 °C

Density

16.65 g/cm³

Product Codes

NCZ-1660K

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250”

$902.00

Product 

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 6'', Thickness: 0.250''

CAS No.

 7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 180.95 g/mol

Melting Point

3017 °C

Boiling Point

 5458 °C

Density

16.65 g/cm³

Product Codes

NCZ-1659K

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250”

$780.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125”

$936.00

Product 

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 8'', Thickness: 0.125''

CAS No.

 7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 180.95 g/mol

Melting Point

3017 °C

Boiling Point

 5458 °C

Density

16.65 g/cm³

Product Codes

NCZ-1658K

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.125”

$810.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250”

$971.00

Product 

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 8'', Thickness: 0.250''

CAS No.

 7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 180.95 g/mol

Melting Point

3017 °C

Boiling Point

 5458 °C

Density

16.65 g/cm³

Product Codes

NCZ-1657K

Tantalum (Ta) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250”

$840.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tantalum (V) ethoxide, 99.999%

Price range: $22.00 through $139.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Tantalum (V) ethoxide, 99.999%
CAS No. 6074-84-6
Appearance Colorless liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient SrO
Molecular Weight 406.25 g/mol
Melting Point 155 °C
Boiling Point N/A
Density 4.7 g/cm³
Product Codes NCZ-181R
 

Tantalum (V) methoxide, 99.999%

Price range: $16.00 through $109.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Tantalum (V) methoxide, 99.999%
CAS No. 865-35-0
Appearance White crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient Ta(OCH₃)₅
Molecular Weight N/A
Melting Point 49–51 °C
Boiling Point N/A
Density N/A
Product Codes NCZ-182R

Tantalum (V) Oxide (Ta2O5) 99.9% 3N Powder

Price range: $249.00 through $1,476.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Tantalum (V) Oxide (Ta2O5) 99.9% 3N Powder
CAS No. 1314-61-0
Appearance White to off-white
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1–10µm (Size Can be customized),  Ask for other available size range.
Ingredient Ta2O5
Molecular Weight 441.89 g/mol
Melting Point N/A
Boiling Point N/A
Density 8.2 g/cm³
Product Codes NCZ-548I

Tantalum Aluminum Carbide (Ta4AlC3) MAX Phase Micron-Powder

Price range: $171.00 through $645.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Tantalum Aluminum Carbide (Ta4AlC3) MAX Phase Micron-Powder
CAS No. N/A
Appearance Dark gray to black
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1–5µm (Size Can be customized),  Ask for other available size range.
Ingredient Ta4AlC3
Molecular Weight 654.48 g/mol
Melting Point N/A
Boiling Point N/A
Density 10.3 g/cm³
Product Codes NCZ-549I
 

Tantalum Carbide (Ta4C3Tx) MXene Multilayer Nanoflakes, 1g

$784.00
Product Tantalum Carbide (Ta4C3Tx) MXene Multilayer Nanoflakes, 1g
CAS No. N/A
Appearance Dark gray to black
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1–2μm (Size Can be customized),  Ask for other available size range.
Ingredient Ta₄C₃Tₓ
Molecular Weight 651.6 g/mol
Melting Point N/A
Boiling Point N/A
Density 3.5–5.0 g/cm³
Product Codes NCZ-550I

Tantalum Carbide (TaC) Nanopowder/Nanoparticles, Purity: 99.5+%, Size: 950 nm, Cubic

Price range: $35.00 through $601.00
Select options This product has multiple variants. The options may be chosen on the product page
5 grams/31 € 
25 grams/51 € 100 grams/92 €
500 grams/306 € 1000 grams/530 €
                     
Please contact us for quotes on larger quantities !!! 

Tantalum Carbide (TaC) Nanopowder/Nanoparticles

Purity: 99.5+%, Size: 950 nm, Cubic

Applications:

Tantalum carbide nanoparticles has application in hard materials such as refractory ceramic materials. It is used in cutting tools and tool bits. It is also used as additive to tungsten carbide alloys.  

Tantalum Carbide (TaC) Powder (99%)

Price range: $1,304.00 through $37,198.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Tantalum Carbide (TaC) Powder (99%)
CAS No. 12070-06-3
Appearance Gray to black crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1–10µm (Size Can be customized),  Ask for other available size range.
Ingredient TaC
Molecular Weight 192.96 g/mol
Melting Point 3880 °C
Boiling Point N/A
Density 3.5–5.0 g/cm³
Product Codes NCZ-551I
 

Tantalum Carbide Nanopowder/ Nanoparticles ( TaC, 99.5%, <2um)

Price range: $155.00 through $845.00
Select options This product has multiple variants. The options may be chosen on the product page
$155/100g
$475/500g
$845/1kg

Product 

Tantalum Carbide Nanopowder/ Nanoparticles ( TaC, 99.5%, <2um)

CAS No.

12070-06-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

<2 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

192.96 g/mol

Melting Point

~3,768–3,880 °C

Boiling Point

~4,780–5,470 °C

Density

~14.3–14.7 g/cm³

Product Codes

NCZ-1193K

Tantalum Disilicide Ta5Si3

$0.00

Tantalum Disilicide Nanoparticles

Tantalum Disilicide Powder Ta5Si3
MF Ta5Si3
Chemical Name Tantalum Silicide
Purity ≥ 99%
APS 50-100 nm, 1 to 5 um, 10 um, 325 Mesh  (Size Customization possible)
Form Gray Powder
Product Number NCZ3247-20
CAS Number 12067-56-0

Note: We supply different products of microparticles and Nanoparticles powder in all sizes range according to the client’s requirements.

Tantalum Disilicide is a kind of dark grey powder with cubic crystal. Ta5Si3 is mainly used in areas like heating element, integrated circuit, high-temperature oxidation resistant coating, high-temperature structural materials, and aviation and spaceflight, etc. The tantalum disilicide compound by our company based on new techniques is featured with high purity, even size distribution, large specific area, high surface activity, and low apparent density, etc.

Tantalum Nanoparticles/ Nanopowder ( Ta, 99.7% 60-80 nm)

Price range: $398.00 through $1,287.00
Select options This product has multiple variants. The options may be chosen on the product page
$398/25g
$1287/100g

Product 

Tantalum Nanoparticles/ Nanopowder ( Ta, 99.7% 60-80 nm)

CAS No.

7440-25-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

60-80 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

180.95 g/mol

Melting Point

3,017 °C

Boiling Point

5,458 °C

Density

16.69 g/cm³

Product Codes

NCZ-1076K

Tantalum Nitride (TaN) Sputtering Target

Price range: $622.00 through $1,375.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Tantalum Nitride (TaN) Sputtering Target

CAS No.

12033-62-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 194.96 g/mol

Melting Point

~3,090 °C

Boiling Point

 ~5,000 °C

Density

~14.3 g/cm³

Product Codes

NCZ-1334K

Tantalum Nitride Nanoparticles

$0.00

Nano Tantalum Nitride Powder

Tantalum Nitride Nanoparticles

Tantalum Nitride Nanopowder

FORM POWDER
Molecular Weight 194.95 g/mol
APS 80-100 nm
Density 14.30 g/ml
Melting Point 3000-3200˚C
Molecular Formula TaN
Crystal Structure Cubic
Free carbon 0.07%
Specific Gravity 16.3 g/cc
Appearance and Odor Black to grey powder, no odor
Solubility in H2O Insoluble
CAS 12033-62-4
Note: We supply different products of microparticles and Nanoparticles powder in all size range according to client’s requirements.

Tantalum Oxide (Ta2O5) Sputtering Target

Price range: $375.00 through $1,007.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Tantalum Oxide (Ta2O5) Sputtering Target

CAS No.

 1314-61-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

441.89 g/mol

Melting Point

~1,875 °C

Boiling Point

~3,000 °C

Density

~8.2 g/cm³

Product Codes

NCZ-1325K

Tantalum Oxide (Ta2O5) Sputtering Target

Price range: $162.00 through $588.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Tantalum Oxide (Ta2O5) Sputtering Target

CAS No.

13463-67-7

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

79.87 g/mol

Melting Point

~1,843 °C

Boiling Point

~2,972 °C

Density

 ~4.23 g/cm³

Product Codes

NCZ-1326K

Tantalum Oxide (Ta2O5) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125”

$668.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Tantalum Oxide (Ta2O5) Sputtering Targets, indium, Purity: 99.99%, Size: 2”, Thickness: 0.125”

$771.00

Product 

Tantalum Oxide (Ta2O5) Sputtering Targets, indium, Purity: 99.99%, Size: 2'', Thickness: 0.125''

CAS No.

1314-61-0

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A  (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 441.89 g/mol

Melting Point

 ~1872 °C

Boiling Point

N/A

Density

~8.2 g/cm³

Product Codes

NCZ-1648K