Lutetium Oxide (Lu2O3) Micron Powder, Purity: 99.99%, Size: 325 mesh

Price range: $119.00 through $1,850.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

Lutetium oxide is used as raw material for laser crystals. It is used in glass, ceramics, and phosphorus as an additive. It is also used as a catalyst in hydrogenation, polymerization, cracking, and alkylation.

Lutetium Oxide (Lu2O3) Sputtering Target, CAS 12032-20-1

Price range: $684.00 through $1,623.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Lutetium Oxide (Lu2O3) Sputtering Target, CAS 12032-20-1

CAS No.

12032‑20‑1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

397.93–397.94 g/mol

Melting Point

~2,490 °C

Boiling Point

~3,980 °C

Density

~9.42 g/cm³

Product Codes

NCZ-1374K

Lutetium oxide, 99.99%

Product Lutetium oxide, 99.99%
CAS No. 12032-20-1
Appearance White powder
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient Lu₂O₃
Molecular Weight 397.93397.94 g/mol
Melting Point N/A
Boiling Point N/A
Density 9.42 g/cm³
Product Codes NCZ-619R
 

Lutetium oxide, 99.999%

Product Lutetium oxide, 99.999%
CAS No. 12032-20-1
Appearance White powder
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient Lu₂O₃
Molecular Weight 397.93-397.94 g/mol
Melting Point N/A
Boiling Point N/A
Density 9.42 g/cm³
Product Codes NCZ-620R

Lutetium phosphate, 99.9%

Product Lutetium phosphate, 99.9%
CAS No. 14298-36-3
Appearance White to off-white powder
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)    
APS N/A
Ingredient LuPO₄
Molecular Weight  269.938 g/mol
Melting Point N/A
Boiling Point N/A
Density N/A
Product Codes NCZ-621R
 

Lutetium sulfate octahydrate, 99.9%

Product Lutetium sulfate octahydrate, 99.9%
CAS No. 13473-77-3
Appearance White crystalline solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient Lu2(SO4)38H2O
Molecular Weight 782.24-782.3 g/mol
Melting Point N/A
Boiling Point N/A
Density N/A
Product Codes NCZ-622R

Lutetium sulfate octahydrate, 99.99%

Product Lutetium sulfate octahydrate, 99.99%
CAS No. 13473-77-3
Appearance White crystalline solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient Lu2(SO4)38H2O
Molecular Weight 782.24-782.3 g/mol
Melting Point N/A
Boiling Point N/A
Density N/A
Product Codes NCZ-623R
 

Lutetium sulfide, 99.9%

Product Lutetium sulfide, 99.9%
CAS No. 12163-20-1
Appearance Gray crystalline solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient Lu₂S₃
Molecular Weight 446.13 g/mol
Melting Point 1750 °C
Boiling Point N/A
Density 6.26 g/cm³
Product Codes NCZ-624R

Lutetium TMHD

Price range: $22.00 through $140.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Lutetium TMHD
CAS No. 15492-45-2
Appearance Off-white crystalline solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient C₃₃H₅₇LuO₆
Molecular Weight 724.77 g/mol
Melting Point 171 °C
Boiling Point N/A
Density N/A
Product Codes NCZ-354R
 

Lutetium trifluoroacetate, 99.9% 

Product Lutetium trifluoroacetate, 99.9%
CAS No. 126857-69-0
Appearance White to off-white powder
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient C₃F₉LuO₉S₃
Molecular Weight 622.17 g/mol
Melting Point N/A
Boiling Point N/A
Density N/A
Product Codes NCZ-625R
 

Lutetium trifluoromethanesulfonate, 99.9%

Product Lutetium trifluoromethanesulfonate, 99.9%
CAS No. 126857-69-0
Appearance White to off-white powder
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient C₃F₉LuO₉S₃
Molecular Weight 622.17 g/mol
Melting Point N/A
Boiling Point N/A
Density N/A
Product Codes NCZ-626R

M2 Powder

Product M2 Powder
CAS No. N/A
Appearance Gray metallic powder
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 10–45 µm (Size Can be customized),  Ask for other available size range.
Ingredient FeWMoCrVC
Molecular Weight N/A
Melting Point 1250–1350°C
Boiling Point N/A
Density 8.1 g/cm³
Product Codes NCZ-163M

Magnesium (II) meso-tetraphenylporphine

Price range: $32.00 through $186.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Magnesium (II) meso-tetraphenylporphine
CAS No. 14640-21-2
Appearance Red or deep purple
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient C₄₄H₂₈MgN₄
Molecular Weight 637.02 g/mol
Melting Point N/A
Boiling Point N/A
Density N/A
Product Codes NCZ-236R
 

Magnesium (Mg) Micron Powder, Purity: 99.9%, Size: 0-100 µm

Price range: $332.00 through $5,569.00
Select options This product has multiple variants. The options may be chosen on the product page
  1 kg/295 € 5 kg/1280 € 25 kg/4940 €                          Please contact us for quotes on larger quantities !!!

Magnesium (Mg) Micron Powder

Purity: 99.9%, Size: 0-100 µm

Technical Properties:

CAS Number 7439-95-4
Molecular Weight (g) 24.31
Average Particle Size (µm) 0-100
Apparent Density (g/cm3) 0.55 – 0.70
Appearance gray
Tmelting (oC) 650
Tboiling (oC) 1090
Electrical Resistivity (@ 20 °C) 4.45 microhm-cm
Thermal Conductivity (@ 298.2 K) 1.56 W/cm/K

Applications:

Magnesium is one of the lightest metals. This property gives Mg a wide range of applications from aircraft and automobile parts to material handling equipments, pyrotechnic, metallurgy, welding.  

Magnesium (Mg) Micron Powder, Purity: 99.9%, Size: 0-200 µm

Price range: $315.00 through $5,146.00
Select options This product has multiple variants. The options may be chosen on the product page
1 kg/280 € 5 kg/1175 € 25 kg/4565 €                          Please contact us for quotes on larger quantities !!!

Magnesium (Mg) Micron Powder

Purity: 99.9%, Size: 0-100 µm

Technical Properties:

CAS Number 7439-95-4
Molecular Weight (g) 24.31
Average Particle Size (µm) 0-200
Apparent Density (g/cm3) 0.60 – 0.75
Appearance gray
Tmelting (oC) 650
Tboiling (oC) 1090
Electrical Resistivity (@ 20 °C) 4.45 microhm-cm
Thermal Conductivity (@ 298.2 K) 1.56 W/cm/K

Applications:

Magnesium is one of the lightest metals. This property gives Mg a wide range of applications from aircraft and automobile parts to material handling equipments, pyrotechnic, metallurgy, welding.

Magnesium (Mg) Micron Powder, Purity: 99.9%, Size: 0-300 µm

Price range: $298.00 through $4,825.00
Select options This product has multiple variants. The options may be chosen on the product page
1 kg/265 € 5 kg/1095 € 25 kg/4280 €                          Please contact us for quotes on larger quantities !!!

Magnesium (Mg) Micron Powder

Purity: 99.9%, Size: 0-300 µm

Technical Properties:

CAS Number 7439-95-4
Molecular Weight (g) 24.31
Average Particle Size (µm) 0-300
Apparent Density (g/cm3) 0.65 – 0.80
Appearance gray
Tmelting (oC) 650
Tboiling (oC) 1090
Electrical Resistivity (@ 20 °C) 4.45 microhm-cm
Thermal Conductivity (@ 298.2 K) 1.56 W/cm/K

Applications:

Magnesium is one of the lightest metals. This property gives Mg a wide range of applications from aircraft and automobile parts to material handling equipments, pyrotechnic, metallurgy, welding.  

Magnesium (Mg) Micron Powder, Purity: 99.95%, Size: 35 µm, Metal Basis

Price range: $42.00 through $897.00
Select options This product has multiple variants. The options may be chosen on the product page
1 gram/38 € 5 grams/65 € 25 grams/135 € 100 grams/338 € 500 grams/526 € 1000 grams/796 € Please contact us for quotes on larger quantities !!!

Magnesium (Mg) Micron Powder

Purity: 99.95%, Size: 35 µm, Metal Basis

Technical Properties:

True Density (g/cm3) 1,74
Shape spherical-rectangular
Crystal Structure cubic
Tmelting (oC) 650
Tboiling (oC) 1100
Average Particle Size (µm) 35,0
Elemental Analysis Mg Cu Mn Na K Others
99.9 0.02 0.01 0.01 0.01 0.001

Applications:

Magnesium is one of the lightest metals. This property gives Mg a wide range of applications from aircraft and automobile parts to material handling equipment.  

Magnesium (Mg) Sputtering Target

Price range: $184.00 through $507.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Magnesium (Mg) Sputtering Target

CAS No.

7439-92-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

24.305 g/mol

Melting Point

650 °C

Boiling Point

1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-1296K

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125”

$90.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125”

$99.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 1'', Thickness: 0.125''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-2007K

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250”

$112.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.250”

$124.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 1'', Thickness: 0.250''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-2005K

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125”

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

To achieve film deposition, sputtering targets are used. "Deposition made by sputter targets" is a method of sputtering thin films that involves eroding material from a "target" source onto a "substrate," such as a silicon wafer. Semiconductor sputtering targets are used for target etching. Sputter etching is the preferred technique when a high degree of etching anisotropy is needed and selectivity is not a concern. Sputter targets are also used for research, where the target material is removed via etching. One instance in secondary ion spectroscopy (SIMS) is a continual sputtering of the target material. When the target is sputtered, mass spectrometry is utilized to measure the concentration and identify the atoms that are spewed.

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.125”

$201.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 2'', Thickness: 0.125''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-2003K

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250”

$200.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 2”, Thickness: 0.250”

$226.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 2'', Thickness: 0.250''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-2001K

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$200.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.125”

$246.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 3'', Thickness: 0.125''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-1999K

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250”

$205.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 3”, Thickness: 0.250”

$232.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 3'', Thickness: 0.250''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-1997K

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125”

$220.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.125”

$250.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 4'', Thickness: 0.125''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-1995K

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250”

$241.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 4”, Thickness: 0.250”

$274.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 4'', Thickness: 0.250''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-1993K

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250”

$434.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 6”, Thickness: 0.250”

$498.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 6'', Thickness: 0.250''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-1990K

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250”

$492.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 8”, Thickness: 0.250”

$565.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 8'', Thickness: 0.250''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-1988K

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 1”, Thickness: 0.125”

$132.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 1”, Thickness: 0.125”

$149.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 1'', Thickness: 0.125''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-2006K

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 1”, Thickness: 0.250”

$139.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 1”, Thickness: 0.250”

$156.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 1'', Thickness: 0.250''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-2004K

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 2”, Thickness: 0.125”

$181.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 2”, Thickness: 0.125”

$204.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 2'', Thickness: 0.125''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-2002K

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 2”, Thickness: 0.250”

$206.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 2”, Thickness: 0.250”

$233.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 2'', Thickness: 0.250''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-2000K

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 3”, Thickness: 0.125”

$210.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 3”, Thickness: 0.125”

$238.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 3'', Thickness: 0.125''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-1998K

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 3”, Thickness: 0.250”

$223.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 3”, Thickness: 0.250”

$253.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 3'', Thickness: 0.250''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-1996K

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 4”, Thickness: 0.125”

$228.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 4”, Thickness: 0.125”

$259.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 4'', Thickness: 0.125''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-1994K

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 4”, Thickness: 0.250”

$246.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 4”, Thickness: 0.250”

$280.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 4'', Thickness: 0.250''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-1992K

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 5”, Thickness: 0.125”

$276.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 5”, Thickness: 0.125”

$314.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 5'', Thickness: 0.125''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-1991K

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 6”, Thickness: 0.250”

$456.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 6”, Thickness: 0.250”

$523.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 6'', Thickness: 0.250''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-1989K

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 8”, Thickness: 0.250”

$546.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When etching anisotropy is high, sputter etching is the preferred method.

is required, and selectivity is unimportant. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 8”, Thickness: 0.250”

$628.00

Product 

Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 8'', Thickness: 0.250''

CAS No.

7439-95-4

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.305 g/mol

Melting Point

 650 °C

Boiling Point

 1,090 °C

Density

1.738 g/cm³

Product Codes

NCZ-1987K