$455.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Product	Copper (Cu) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.125''
CAS No.	7440-50-8
Appearance	Powder
Purity	≥99%, ≥99.9%, ≥95% (Other purities are also available)
APS	N/A (Size Can be customized), Ask for other available size ranges.
Ingredient	N/A
Molecular Weight	63.55 g/mol
Melting Point	1,084 °C
Boiling Point	2,562 °C
Density	8.96 g/cm³
Product Codes	NCZ-2273K

Product	Copper (II) chloride, 99.999%
CAS No.	10125-13-0
Appearance	Blue-green crystalline
Purity	≥99%, ≥99.9%, ≥95%(Other purities are also available)
APS	N/A
Ingredient	Cl₂Cu·2H₂O
Molecular Weight	170.48 g/mol
Melting Point	N/A
Boiling Point	N/A
Density	N/A
Product Codes	NCZ-151R

Product	Copper (II) ethoxide, 98%
CAS No.	2850-65-9
Appearance	Blue to green
Purity	≥99%, ≥99.9%, ≥95%(Other purities are also available)
APS	N/A
Ingredient	C₄H₁₀CuO₂
Molecular Weight	153.67 g/mol
Melting Point	120 °C
Boiling Point	N/A
Density	0.89–0.90 g/cm³
Product Codes	NCZ-167R

Product	Copper (II) meso-tetraphenylporphine
CAS No.	14172-91-9
Appearance	Purple solid
Purity	≥99%, ≥99.9%, ≥95%(Other purities are also available)
APS	N/A
Ingredient	C₄₄H₂₈CuN₄
Molecular Weight	676.27–676.28 g/mol
Melting Point	300 °C
Boiling Point	N/A
Density	N/A
Product Codes	NCZ-219R

Product	Copper (II) methoxide, 98%
CAS No.	1184-54-9
Appearance	Blue to green
Purity	≥99%, ≥99.9%, ≥95%(Other purities are also available)
APS	N/A
Ingredient	Cu(OCH₃)₂
Molecular Weight	N/A
Melting Point	206 °C
Boiling Point	N/A
Density	N/A
Product Codes	NCZ-168R

Product	Copper (II) nitrate hexahydrate, 99.999%
CAS No.	N/A
Appearance	Blue crystalline
Purity	≥99%, ≥99.9%, ≥95%(Other purities are also available)
APS	N/A
Ingredient	CuN₂O₆
Molecular Weight	187.55 g/mol
Melting Point	N/A
Boiling Point	N/A
Density	N/A
Product Codes	NCZ-152R

Product	Copper (II) oxide, 99.999%
CAS No.	1317-38-0
Appearance	Black
Purity	≥99%, ≥99.9%, ≥95%(Other purities are also available)
APS	N/A
Ingredient	CuO
Molecular Weight	N/A
Melting Point	N/A
Boiling Point	N/A
Density	N/A
Product Codes	NCZ-153R

Product	Copper (II) sulfate, 99.999%
CAS No.	23254-43-5
Appearance	Blue crystalline
Purity	≥99%, ≥99.9%, ≥95%(Other purities are also available)
APS	N/A
Ingredient	CuSO₄
Molecular Weight	N/A
Melting Point	N/A
Boiling Point	N/A
Density	2.286 g/cm³
Product Codes	NCZ-154R

Product	Copper ACAC
CAS No.	13395-16-9
Appearance	Bright blue crystalline
Purity	≥99%, ≥99.9%, ≥95%(Other purities are also available)
APS	N/A
Ingredient	C₁₅H₂₁CoO₆
Molecular Weight	261.76 g/mol
Melting Point	279–288 °C
Boiling Point	N/A
Density	0.721 g/cm
Product Codes	NCZ-266R

Product	Copper Alloy Series
CAS No.	7440-50-8
Appearance	Metallic gray powder
Purity	≥99%, ≥99.9%, ≥95%(Other purities are also available)
APS	15-45 µm (Size Can be customized), Ask for other available size range.
Ingredient	N/A
Molecular Weight	N/A
Melting Point	N/A
Boiling Point	N/A
Density	N/A
Product Codes	NCZ-140M

Product	Cu doped Ti3AlC2 MAXene powder
Colour	Black Powder
Purity	≥98 wt%
Ingredient	Cu@Ti3AlC2
CAS NO	196506-01-1

Alloy Ratio (Cu-In)	depends on customer needs
Average Particle Size (nm)	<500

Alloy Ratio (Cu-In)	depends on customer needs
Average Particle Size (nm)	<500

Alloy Ratio (Cu-In)	depends on customer needs
Average Particle Size (nm)	<500

Product	Copper BZACAC
CAS No.	14128-84-8
Appearance	Blue-green solid
Purity	≥99%, ≥99.9%, ≥95%(Other purities are also available)
APS	N/A
Ingredient	C₂₀H₁₈CuO₄
Molecular Weight	N/A
Melting Point	192–196 °C
Boiling Point	N/A
Density	N/A
Product Codes	NCZ-267R

Product	Copper DIBZACAC
CAS No.	N/A
Appearance	Deep green or bluish solid
Purity	≥99%, ≥99.9%, ≥95%(Other purities are also available)
APS	N/A
Ingredient	C₂₀H₁₄CuO₄
Molecular Weight	N/A
Melting Point	N/A
Boiling Point	N/A
Density	N/A
Product Codes	NCZ-268R

Product	Copper FOD
CAS No.	N/A
Appearance	Blue to green crystalline
Purity	≥99%, ≥99.9%, ≥95%(Other purities are also available)
APS	N/A
Ingredient	C₁₆H₁₆CuF₁₄O₄
Molecular Weight	595 g/mol
Melting Point	N/A
Boiling Point	N/A
Density	N/A
Product Codes	NCZ-386R

Product	Copper HFAC
CAS No.	14781-45-4
Appearance	Green to dark green
Purity	≥99%, ≥99.9%, ≥95%(Other purities are also available)
APS	N/A
Ingredient	Cu(C₅HF₆O₂)₂·xH₂O
Molecular Weight	479.66 g/mol
Melting Point	130–135 °C
Boiling Point	N/A
Density	N/A
Product Codes	NCZ-311R

MF:	Cu
Chemical Name:	Copper Nanoparticles
Purity:	> 99.99%
APS:	25 nm (Size Customization possible)
Form:	Nanopowder/Dispersion
Product Number:	#NCZ2101
CAS Number	7440-50-8

Product	Copper Nanoparticles/ Nanopowder (Cu, ~1um, 99.8%)
CAS No.	7440-50-8
Appearance	Powder
Purity	≥99%, ≥99.9%, ≥95% (Other purities are also available)
APS	~1um (Size Can be customized), Ask for other available size ranges.
Ingredient	AlN
Molecular Weight	63.55 g/mol
Melting Point	1084.62 °C
Boiling Point	2562 °C
Density	8.96 g/cm³
Product Codes	NCZ-1037K

Product	Copper Nanoparticles/ Nanopowder (Cu, 500nm, 99.8%)
CAS No.	7440-50-8
Appearance	Powder
Purity	≥99%, ≥99.9%, ≥95% (Other purities are also available)
APS	500nm (Size Can be customized), Ask for other available size ranges.
Ingredient	AlN
Molecular Weight	63.55 g/mol
Melting Point	1084.62 °C
Boiling Point	2562 °C
Density	8.96 g/cm³
Product Codes	NCZ-1036K

Product	Copper Nanoparticles/Nanopowder (Cu, 99.5%, 300nm)
CAS No.	7440-50-8
Appearance	Powder
Purity	≥99%, ≥99.9%, ≥95% (Other purities are also available)
APS	300nm (Size Can be customized), Ask for other available size ranges.
Ingredient	AlN
Molecular Weight	63.55 g/mol
Melting Point	1084.62 °C
Boiling Point	2562 °C
Density	8.96 g/cm³
Product Codes	NCZ-1035K

Product	Copper Nanoparticles/Nanopowder in organic media (Cu, 5-7nm, oil-soluble, dispersible, lubricants additive)
CAS No.	7440-50-8
Appearance	Powder
Purity	≥99%, ≥99.9%, ≥95% (Other purities are also available)
APS	5-7nm (Size Can be customized), Ask for other available size ranges.
Ingredient	AlN
Molecular Weight	63.55 g/mol
Melting Point	1084.62 °C
Boiling Point	2562 °C
Density	8.96 g/cm³
Product Codes	NCZ-1031K

Product	Copper Nanowires immersed in ethanol
CAS No.	7440-50-8
Appearance	Powder
Purity	≥99%, ≥99.9%, ≥95% (Other purities are also available)
APS	150 nm (Size Can be customized), Ask for other available size ranges.
Ingredient	AlN
Molecular Weight	63.55 g/mol
Melting Point	1084.62 °C
Boiling Point	2562 °C
Density	8.96 g/cm³
Product Codes	NCZ-1038K

Filter by price

Product categories

Applications of Sputtering Targets;

Applications of Sputtering Targets;

Applications of Sputtering Targets;

Applications of Sputtering Targets;

Applications of Sputtering Targets;

Applications of Sputtering Targets;

Applications of Sputtering Targets;

Applications of Sputtering Targets;

Applications of Sputtering Targets;

Applications of Sputtering Targets;

Applications of Sputtering Targets;

Applications of Sputtering Targets;

Applications of Sputtering Targets;

Applications of Sputtering Targets;

Product Name: Copper Doped Ti3AlC2 MAXene Powder

Product Code: NCZ-MX-105-20A

Copper doped Ti3AlC2 MAXene powder application field:

Copper Indium (Cu-In) Alloy Nanopowder/Nanoparticles

Purity: 99.9% , Size: < 500 nm

Technical Properties:

Properties, Storage and Cautions:

Copper Indium (Cu-In) Alloy Nanopowder/Nanoparticles

Purity: 99.9% , Size: < 500 nm

Technical Properties:

Properties, Storage and Cautions:

Copper Indium (Cu-In) Alloy Nanopowder/Nanoparticles

Purity: 99.9% , Size: < 500 nm

Technical Properties:

Properties, Storage and Cautions:

Copper Indium (Cu-In) Alloy Nanopowder/Nanoparticles

Purity: 99.9% , Size: < 500 nm

Technical Properties:

Properties, Storage and Cautions:

Copper Nanoparticles Powder

Application:

Copper Nickel (Cu-Ni) Alloy Nanopowder/Nanoparticles

Size: < 80 nm

Technical Properties:

Properties, Storage and Cautions:

Applications:

Copper Nickel (Cu-Ni) Alloy Nanopowder/Nanoparticles

Size: < 80 nm

Technical Properties:

Properties, Storage and Cautions:

Applications:

Copper Nickel (Cu-Ni) Alloy Nanopowder/Nanoparticles

Size: < 80 nm

Technical Properties:

Properties, Storage and Cautions:

Copper Nickel (Cu-Ni) Alloy Nanopowder/Nanoparticles

Size: < 80 nm

Technical Properties:

Properties, Storage and Cautions:

Applications:

Shipping world wide

24/7 Support.

Online Payment.

Fast Delivery.

Canada (North America) Office Address:

Product	Copper Nanowires/ Cu Nanowires
CAS No.	7440-50-8
Appearance	Powder
Purity	≥99%, ≥99.9%, ≥95% (Other purities are also available)
APS	150 nm (Size Can be customized), Ask for other available size ranges.
Ingredient	AlN
Molecular Weight	63.55 g/mol
Melting Point	1084.62 °C
Boiling Point	2562 °C
Density	8.96 g/cm³
Product Codes	NCZ-1039K

Product	Copper Nanowires/ Cu Nanowires Immersed in Ethanol
CAS No.	7440-50-8
Appearance	Powder
Purity	≥99%, ≥99.9%, ≥95% (Other purities are also available)
APS	300 nm (Size Can be customized), Ask for other available size ranges.
Ingredient	AlN
Molecular Weight	63.55 g/mol
Melting Point	1084.62 °C
Boiling Point	2562 °C
Density	8.96 g/cm³
Product Codes	NCZ-1040K