Coin Style Single Wafer Shipper, 4’’ / 100 mm , Natural PP

Price range: $10.00 through $63.00
Select options This product has multiple variants. The options may be chosen on the product page
Introduction The wafer shippers are specifically designed to ship, transport or store semiconductor wafers. Primarily designed to hold thin silicon

Coin Style Single Wafer Shipper, 5’’ / 125 mm , Natural PP

Price range: $9.52 through $59.00
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1 piece: 8.5 € 5 pieces: 35 € 10 pieces: 53 € Coin Style Single Wafer Shipper, 5’’ / 125 mm , Natural PP  Introduction
  • The wafer shippers are specifically designed to ship, transport or store semiconductor wafers. Primarily designed to hold thin silicon wafers, but are equally suitable for glass, quartz, sapphire, GaAs and other thin round wafers in sizes from Ø2” to 6” or Ø51 to 150mm.
  • These wafer shippers/carriers are also known as coin shippers
  • They comprise of three parts: base, spider spring and locking cap.
  • The inside of the base is concave to ensure that the wafers are held at the edges only.
  • The spider spring holds the wafer in place once the cap is locked to the base.
  • Available in sizes of 2” to 6” or equivalent 51 to 150mm diameter which a translucent, natural polypropylene
  WAFER SHIPPER FEATURES •  For shipping and storage of 5'' wafers •  Positive closure •  Holds one wafer facedown •  Wafer face contact is on the edge only •  Eight spring cushion holds the wafer •  Stackable WAFER SHIPPER SPECIFICATIONS Polypropylene (PP) Properties: •  Translucent/milky white •  Low dielectric constant (insulating) •  Not hygroscopic (water absorption <0.01%) •  Continuous use temperature limit: 55 C •  Melting temperature: 164 C •  Specific gravity: 0.9g/cm^3 •  Chemical resistance: IPA OK, Acetone OK The “Coin Style” single wafer shippers or wafer holders are available in different sizes and materials (Natural PP). For easy loading/unloading in automated or manual applications. They are impact resistant with a screw-on lid for secure packing. Single wafer shipping container for safe transporting of your 5" (150 mm) wafers. The  coinstyle shippers are cylindrical shaped and usually include a sping (they can also be ordered without a spring). The coin style shippers are designed to absorb impact and have a screw-on lid for secure packing of your wafers.

Coin Style Single Wafer Shipper, 5’’ / 125 mm , Natural PP

Price range: $10.00 through $63.00
Select options This product has multiple variants. The options may be chosen on the product page
Introduction The wafer shippers are specifically designed to ship, transport or store semiconductor wafers. Primarily designed to hold thin silicon

Coin Style Single Wafer Shipper, 6’’ / 150 mm , Natural PP

Price range: $10.50 through $70.35
Select options This product has multiple variants. The options may be chosen on the product page
Introduction The wafer shippers are specifically designed to ship, transport or store semiconductor wafers. Primarily designed to hold thin silicon

Coin Style Single Wafer Shipper, 6’’ / 150 mm , Natural PP

Price range: $9.60 through $62.00
Select options This product has multiple variants. The options may be chosen on the product page
1 piece: 8.6 € 5 pieces: 37 € 10 pieces: 56 € Coin Style Single Wafer Shipper, 6’’ / 150 mm , Natural PP  Introduction
  • The wafer shippers are specifically designed to ship, transport or store semiconductor wafers. Primarily designed to hold thin silicon wafers, but are equally suitable for glass, quartz, sapphire, GaAs and other thin round wafers in sizes from Ø2” to 6” or Ø51 to 150mm.
  • These wafer shippers/carriers are also known as coin shippers
  • They comprise of three parts: base, spider spring and locking cap.
  • The inside of the base is concave to ensure that the wafers are held at the edges only.
  • The spider spring holds the wafer in place once the cap is locked to the base.
  • Available in sizes of 2” to 6” or equivalent 51 to 150mm diameter which a translucent, natural polypropylene

Product #

Wafer Size

Dimensions

Material

NG01WS0401 6” / 150 mm Ø160 x 20 mm Natural translucent PP
  WAFER SHIPPER FEATURES •  For shipping and storage of 6'' wafers •  Positive closure •  Holds one wafer facedown •  Wafer face contact is on the edge only •  Eight spring cushion holds the wafer •  Stackable WAFER SHIPPER SPECIFICATIONS Polypropylene (PP) Properties: •  Translucent/milky white •  Low dielectric constant (insulating) •  Not hygroscopic (water absorption <0.01%) •  Continuous use temperature limit: 55 C •  Melting temperature: 164 C •  Specific gravity: 0.9g/cm^3 •  Chemical resistance: IPA OK, Acetone OK The “Coin Style” single wafer shippers or wafer holders are available in different sizes and materials (Natural PP). For easy loading/unloading in automated or manual applications. They are impact resistant with a screw-on lid for secure packing. Single wafer shipping container for safe transporting of your 6" (150 mm) wafers. The  coinstyle shippers are cylindrical shaped and usually include a sping (they can also be ordered without a spring). The coin style shippers are designed to absorb impact and have a screw-on lid for secure packing of your wafers.

Conductive Acetylene Black for Li-ion Battery Anode/Cathode

Price range: $75.00 through $138.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

Conductive Acetylene Black for Li-ion Battery Anode/Cathode is used for preparing Li-ion battery electrode material and conducting material, for example: Cathode: Cathode Active+Acetylene Black (Conductive)+PVDF+NMP Anode: Anode Active+Acetylene Black (Conductive)+PVDF+NMP (or SBR+CMC)

Conductive Acetylene Black for Li-ion Battery Anode/Cathode

Price range: $75.00 through $138.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

Conductive Acetylene Black for Li-ion Battery Anode/Cathode is used for preparing Li-ion battery electrode material and conducting material, for example: Cathode: Cathode Active+Acetylene Black (Conductive)+PVDF+NMP Anode: Anode Active+Acetylene Black (Conductive)+PVDF+NMP (or SBR+CMC)

Conductive Acetylene Black for Li-ion Battery Anode/Cathode

Price range: $75.00 through $138.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

Conductive Acetylene Black for Li-ion Battery Anode/Cathode is used for preparing Li-ion battery electrode material and conducting material, for example: Cathode: Cathode Active+Acetylene Black (Conductive)+PVDF+NMP Anode: Anode Active+Acetylene Black (Conductive)+PVDF+NMP (or SBR+CMC)  

Conductive Carbon Black Nanopowder/Nanoparticles, Purity: 95%, Size: 148 nm (Plant)

Price range: $10.00 through $209.00
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Conductive Carbon Black

Purity: 95%, Size: 148 nm (Plant)

Technical Properties:

True Density (g/cm3) 0,41
Color black
pH 9,5-10,0
Ash/H2O Content (%) <3,5/<5,0
Shape spherical
Average Particle Size (nm) 148
Specific Surface Area (m2/g) 690
Resistivity  (Ω.cm) 0,3

Applications:

Carbon Black nanopowder has considerably high surface area which makes it reactive, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided. This nanopowder is all natural, produced from plants and that makes it non-polluting. It can be easily dispersed in various solvents. With its attracting properties, it can be used in polymeric materials such as plastics and rubber, electronic applications and materials used for their anti-static properties.

Conductive Carbon Black Nanopowder/Nanoparticles, Size: 20 nm

Price range: $66.00 through $508.00
Select options This product has multiple variants. The options may be chosen on the product page
Application Areas The recommended application areas of carbon black are as industrial paints, architectural paints, relief ink, screen ink, synthetic fiber and lastly as synthetic leather. Additionally, this product is also can be used in powder coating, gravure ink, and as flexographic ink.

Conductive Carbon Black Nanopowder/Nanoparticles, Size: 20 nm

Price range: $66.00 through $508.00
Select options This product has multiple variants. The options may be chosen on the product page
Conductive Carbon Black Nanopowder/Nanoparticles, Size: 20 nm 25 grams/59 € 100 grams/164 € 500 grams/295 € 1 kg/448 €   Please contact us for quotes on larger quantities ! Conductive Carbon Black Nanopowder/Nanoparticles, Size: 20 nm   Application Areas The recommended application areas of carbon black are as industrial paints, architectural paints, relief ink, screen ink, synthetic fiber and lastly as synthetic leather. Additionally, this product is also can be used in powder coating, gravure ink, and as flexographic ink.   Technical Properties:  
PARTICLE SIZE

20 nm

CAS

1333-86-4

Surface Area

195 m2/g

DBP Oil Absorption

99 ± 4 cc/100g

pH Value

2.4 ± 1

Tint Strength VS SRB3#

≥137 %

Conductive Carbon Black Nanopowder/Nanoparticles, Size: 30 nm

Price range: $61.00 through $449.00
Select options This product has multiple variants. The options may be chosen on the product page
Application Areas The recommended application areas of carbon black are as architectural Paints, primers, screen ink, synthetic fiber wires & cable and lastly as synthetic leather. Additionally, this product is also can be used in industrial paints, powder coating, gravure ink, flexographic ink, relief ink and as master batch.  

Conductive Carbon Black Nanopowder/Nanoparticles, Size: 30 nm

Price range: $61.00 through $449.00
Select options This product has multiple variants. The options may be chosen on the product page
Please contact us for quotes on larger quantities ! Carbon Black Powder Size: 30 nm Application Areas The recommended application areas of carbon black are as architectural Paints, primers, screen ink, synthetic fiber wires & cable and lastly as synthetic leather. Additionally, this product is also can be used in industrial paints, powder coating, gravure ink, flexographic ink, relief ink and as master batch.   Technical Properties:  
PARTICLE SIZE

30 nm

CAS

1333-86-4

Iodin Absorption

124 ± 20 m2/g

DBP Oil Absorption

86 ± 5 cc/100g

pH Value

5

Tint Strength VS SRB3#

≥120 %

Conductive Graphene Slurry in NMP, 1kg

$469.00
Product Conductive Graphene Slurry in NMP, 1kg
CAS No. 7782-42-5
Appearance Black viscous liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1µm (Size Can be customized),  Ask for other available size range.
Ingredient C
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density 1.03 g/cm³
Product Codes NCZ-322I

Conductive Graphite Powder for Lithium Battery, Purity: 99.9+%, Size: 1-5 µm

Price range: $39.00 through $277.00
Select options This product has multiple variants. The options may be chosen on the product page
25 grams/35 € 100 grams/68 € 500 grams/165 € 1000 grams/245 €
Please contact us for quotes on larger quantities !!!

Conductive Graphite Powder for Lithium Battery

Purity: 99.9+%, Size: 1-5 µm

Technical Properties:

Fixed Carbon (%) ≥99.98
Granularity (µm) 1~5
Moisture Content (%) ≤0.08
Ash Content ≤0.01
PH 7
Fe ≤5
S ≤0.01
Si ≤1
Cl ≤0.1
F ≤1
Al ≤1
Cu ≤1
Cr ≤1

Applications:

Conductive Graphite Powder for Lithium Battery is used as conductive material when preparing Li-ion battery Cathode and Anode.  

Conductive Graphite Powder for Lithium Battery, Purity: 99.9+%, Size: 1-5 µm

Price range: $52.00 through $384.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

Conductive Graphite Powder for Lithium Battery is used as conductive material when preparing Li-ion battery Cathode and Anode.

Conductive Graphite Powder for Lithium Battery, Purity: 99.9+%, Size: 1-5 µm (Copy)

Price range: $52.00 through $384.00
Select options This product has multiple variants. The options may be chosen on the product page

Applications:

Conductive Graphite Powder for Lithium Battery is used as conductive material when preparing Li-ion battery Cathode and Anode.

Conductive Metal-Organic Framework (MOF) Ni3(HITP)2

$305.00
Product Conductive Metal-Organic Framework (MOF) Ni3(HITP)2
CAS No. N/A
Appearance Dark colored crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 200–500nm (Size Can be customized),  Ask for other available size range.
Ingredient Ni₃(HITP)₂
Molecular Weight 666.9 g/mol
Melting Point N/A
Boiling Point N/A
Density N/A
Product Codes NCZ-323I

Conductivity Standard Solution, 111.3ms/cm, 250mL

$65.00
Product Conductivity Standard Solution, 111.3ms/cm, 250mL
CAS No. 7447-40-7
Appearance Clear, colorless liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient KClH₂O
Molecular Weight 74.55 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.0 – 1.05 g/cm³
Product Codes NCZ-324I
 

Conductivity Standard Solution, 12.85ms/cm, 250mL

$65.00
Product Conductivity Standard Solution, 12.85ms/cm, 250mL
CAS No. 7447-40-7
Appearance Clear, colorless liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient KClH₂O
Molecular Weight 74.55 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.0 g/cm
Product Codes NCZ-325I

Conductivity Standard Solution, 1413μs/cm, 250mL

$65.00
Product Conductivity Standard Solution, 1413μs/cm, 250mL
CAS No. 7447-40-7
Appearance Clear, colorless liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient KClH₂O
Molecular Weight 74.55 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.00 g/cm
Product Codes NCZ-326I
 

Conductivity Standard Solution, 146.5μs/cm, 250mL

$65.00
Product Conductivity Standard Solution, 146.5μs/cm, 250mL
CAS No. 7447-40-7
Appearance Clear, colorless liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient KCl
Molecular Weight 74.55 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.00 g/cm³
Product Codes NCZ-327I

Conductivity Standard Solution, 84μs/cm, 250mL

$65.00
Product Conductivity Standard Solution, 84μs/cm, 250mL
CAS No. 7447-40-7
Appearance Clear, colorless liquid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient KCl
Molecular Weight 74.55 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.04 g/cm³
Product Codes NCZ-328I
 

COOH Modified Upconverting Nanoparticles Water Solution, 10mg/bottle

$1,540.00
Select options This product has multiple variants. The options may be chosen on the product page
Product COOH Modified Upconverting Nanoparticles Water Solution, 10mg/bottle
CAS No. N/A
Appearance Colorless to pale white or milky
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 10–45nm (Size Can be customized),  Ask for other available size range.
Ingredient KCl
Molecular Weight 74.55 g/mol
Melting Point N/A
Boiling Point N/A
Density 1.00 g/cm³
Product Codes NCZ-339I
 

Copper (Cu) Micron Powder, Purity: 99.9 %, Size: 325 mesh, Spherical

Price range: $9.00 through $431.00
Select options This product has multiple variants. The options may be chosen on the product page
5 grams/9 €  25 grams/35 €  100 grams/117 €  500 grams/218 €  1000 grams/431 €  Please contact us for quotes on larger quantities !!! Copper (Cu)

Copper (Cu) Micron Powder, Purity: 99.99 %, Size: 100 mesh, Spherical

Price range: $38.00 through $439.00
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25 grams/34 €  100 grams/95 €  500 grams/265 €  1000 grams/390 €  Please contact us for quotes on larger quantities !!!

Copper (Cu) Micron Powder

Purity: 99.99 %, Size: 100 mesh, Spherica

Copper (Cu) Micron Powder, Purity: 99.99 %, Size: 3 µm, Spherical

Price range: $73.00 through $561.00
Select options This product has multiple variants. The options may be chosen on the product page
25 grams/65 € 100 grams/145 € 500 grams/347 € 1000 grams/498 € Please contact us for quotes on larger quantities !!!

Copper (Cu) Micron Powder

Purity: 99.99 %, Size: 3 µm, Spherica

Copper (Cu) Micron Powder, Purity: 99.99 %, Size: 325 mesh, Spherical

Price range: $9.00 through $388.00
Select options This product has multiple variants. The options may be chosen on the product page
5 grams/8 €  25 grams/28 €  100 grams/94 €  500 grams/174 €  1000 grams/345 €  Please contact us for quotes on larger quantities !!!

Copper (Cu) Micron Powder

Purity: 99.99 %, Size: 325 mesh, Spherical

Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.85%, Size: 22 nm, Carbon Coated

Price range: $83.00 through $431.00
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Copper (Cu) Nanopowder/Nanoparticles

Purity: 99.85%, Size: 22 nm, Carbon Coated

Technical Properties:

Cu Purity (%) 99,85 (partially passivated by coating nanoparticles     with 4,0 wt% Carbon for only safe shipping)
Bulk Density (g/cm3) 0,2-0,4
True Density (g/cm3) 8,9
Color black
Shape spherical
Crystal Structure cubic
Average Particle Size (nm) 22
Specific Surface Area (m2/g) 35,0-55,0
Elemental Analysis Cu Si Others
99.8 0.1 0.01

Properties, Storage and Cautions:

Copper nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.85%, Size: 22 nm, Partially Passivated

Price range: $52.00 through $215.00
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Copper (Cu) Nanopowder/Nanoparticles

Purity: 99.85%, Size: 22 nm, Partially Passivated

Technical Properties:

Cu Purity (%) 99,8 (partially passivated by coating nanoparticles with 0,8 wt%   Oxygen for only safe shipping)
Bulk Density (g/cm3) 0,2-0,4
True Density (g/cm3) 8,9
Color dark brown
Shape spherical
Crystal Structure cubic
Average Particle Size (nm) 22
Specific Surface Area (m2/g) 35,0-55,0
Elemental Analysis Cu Si Others
99.8 0.1 0.01

Properties, Storage and Cautions:

Copper nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Applications:

Copper nanoparticles are known for their high electrical conductivity. It is mainly used in electronics industry. It can be used in conducting coatings, inks and pastes, raw material for electronic parts, catalysis for reactions such as methanol production, microelectronic devices, additive for lubricants, for wear resistant coatings, sintering additives etc.

Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 35 nm, Metal Basis

Price range: $167.00 through $334.00
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Copper (Cu) Nanopowder/Nanoparticles

Purity: 99.95%, Size: 35 nm, Metal Basis

Technical Properties:

Bulk Density (g/cm3) 0,19
True Density (g/cm3) 8,9
Color warm copper brown
Shape spherical
Crystal Structure cubic
Average Particle Size (nm) 35
Specific Surface Area (m2/g) 11,0-15,0
Elemental Analysis Cu Fe Ni Others
99.95 0.006 0.005 0.002

Properties, Storage and Cautions:

Copper nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 65 nm, Metal Basis

Price range: $132.00 through $1,457.00
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Copper (Cu) Nanopowder/Nanoparticles

Purity: 99.95%, Size: 65 nm, Metal Basis

Technical Properties:

Bulk Density (g/cm3) 0,22
True Density (g/cm3) 8,9
Color warm copper brown
Shape spherical
Crystal Structure cubic
Average Particle Size (nm) 65
Specific Surface Area (m2/g) 6,5-7,5
Elemental Analysis Cu Fe Ni Others
99.9 0.006 0.005 0.002

Properties, Storage and Cautions:

Copper nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 80 nm, Metal Basis

Price range: $156.00 through $278.00
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Copper (Cu) Nanopowder/Nanoparticles

Purity: 99.95%, Size: 80 nm, Metal Basis

Technical Properties:

Bulk Density (g/cm3) 0,22
True Density (g/cm3) 8,9
Color warm copper brown
Shape spherical
Crystal Structure cubic
Average Particle Size (nm) 80
Specific Surface Area (m2/g) 5,0-5,8
Elemental Analysis Cu Fe Ni Others
99.95 0.006 0.005 0.002

Copper (Cu) Nanopowder/Nanoparticles, Purity: 99.95%, Size: 80-240 nm, Metal Basis

Price range: $57.00 through $678.00
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Copper (Cu) Nanopowder/Nanoparticles

Purity: 99.95%, Size: 80-240 nm, Metal Basis

Technical Properties:

Bulk Density (g/cm3) 0,25
True Density (g/cm3) 8,9
Color reddish brown
Shape spherical
Crystal Structure cubic
Average Particle Size (nm) 80-240
Specific Surface Area (m2/g) 4,6
Elemental Analysis Cu Fe Ni Others
99.95 0.02 0.01 0.01

Properties, Storage and Cautions:

Copper nanoparticles are highly reactive and flammable, therefore it should be handled with care and rapid moves, vibrations should be avoided. Nanopowder should be kept away from sunlight, any kind of heating, moisture and impacts. Coagulation of the particles is a serious problem, so, nanopowder should be sealed under vacuum and should be kept in cool and dry conditions. Air contact should be avoided.

Copper (Cu) Nanowire Dispersion, 1g/bottle

$429.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Copper (Cu) Nanowire Dispersion, 1g/bottle
CAS No. 7440-50-8
Appearance Reddish-brown to red suspension
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 100–200nm (Size Can be customized),  Ask for other available size range.
Ingredient Cu
Molecular Weight 63.55 g/mol
Melting Point N/A
Boiling Point N/A
Density 8.96 g/cm³
Product Codes NCZ-330I

Copper (Cu) Nanowire, Purity: 99.55%, in Ethanol

Price range: $51.00 through $544.00
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Copper (Cu) Nanowire

Purity: 99.55%, in Ethanol

Technical Properties:

Purity (%) 99,55
Color reddish-brown
Average Diameter (nm) 150-200
Length (µm) 4,0-8,0
 

Copper (Cu) Sputtering Target

Price range: $155.00 through $486.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Copper (Cu) Sputtering Target

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

2,562 °C

Boiling Point

2,927 °C

Density

8.96 g/cm³

Product Codes

NCZ-1352K

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.125”

$73.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 1'', Thickness: 0.125''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2274K

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250′

$77.40

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 1”, Thickness: 0.250”

$85.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 1'', Thickness: 0.250''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2272K

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125”

$79.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.125''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2270K

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.125”

$73.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250”

$89.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 2'', Thickness: 0.250''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2268K

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 2”, Thickness: 0.250”

$81.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.125”

$89.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 3'', Thickness: 0.125''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2266K

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250”

$98.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 3”, Thickness: 0.250”

$109.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 3'', Thickness: 0.250''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2264K

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125”

$107.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.125”

$119.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 4'', Thickness: 0.125''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2262K

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250”

$111.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 4”, Thickness: 0.250”

$124.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 4'', Thickness: 0.250''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2260K

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.250”

$350.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected.

Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 5”, Thickness: 0.250”

$402.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 5'', Thickness: 0.250''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2258K

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125”

$110.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 6”, Thickness: 0.125”

$123.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 6'', Thickness: 0.125''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2257K

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 7”, Thickness: 0.125”

$290.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 7'', Thickness: 0.125''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2255K

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 7”, Thickness: 0.125”

$254.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125”

$307.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 8'', Thickness: 0.125''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2252K

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.125”

$268.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 8”, Thickness: 0.250”

$524.00

Product 

Copper (Cu) Sputtering Targets, Purity: 99.99%, Size: 8'', Thickness: 0.250''

CAS No.

7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

63.55 g/mol

Melting Point

1,084 °C

Boiling Point

 2,562 °C

Density

8.96 g/cm³

Product Codes

NCZ-2251K