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Boron Doped Graphene Nanopowder (B/G)

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Price range: $269.00 through $1,765.00
Select options This product has multiple variants. The options may be chosen on the product page
100 gram: 269€ 5 grams: 1080€                          10 grams:
Boron Nanoparticles
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Boron Nanoparticles

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Boron Nanoparticles

Boron Nanopowder

Nano Boron Powder

Product Boron Nanoparticles
Formula B
Stock No. NCZNP106-19
CAS 7440-42-8
Purity 99.9%
APS 80 nm (customization available)
Colour Brown black
Melting Point 2400 ˚C
Hardness 9.5
Boiling Point 2700 ˚C
Note: We supply different size products of microparticles and Nanoparticles Size range powder according to the client’s requirements.
Boron Nanoparticles/ Nanopowders ( B, 97.5%,
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Boron Nanoparticles/ Nanopowders ( B, 97.5%, <400nm)

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Price range: $225.00 through $635.00
Select options This product has multiple variants. The options may be chosen on the product page
$225/25g
$635/100g

Product 

Boron Nanoparticles/ Nanopowders ( B, 97.5%, <400nm)

CAS No.
7440-42-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

<400nm (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

10.81 g/mol

Melting Point

2076°C

Boiling Point

4,000°C

Density

~2.34 g/cm³

Product Codes

NCZ-1020K
Boron Nitride (BN) Nanopowder
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Boron Nitride (BN) Nanopowder/Nanoparticles, Purity: 99.7%, Size: 790 nm, Hexagonal

Price range: $29.00 through $351.00
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5 grams/26 € 
25 grams/51 € 100 grams/113 €
500 grams/201 €  1000 grams/310 € 
                      
Please contact us for quotes on larger quantities !!!

Boron Nitride (BN) Nanopowder/Nanoparticles

Purity: 99.7%, Size: 790 nm, Hexagonal

Storage Condition:

Boron nitride nanoparticles should be sealed in vacuum and stored in cool and dry room. It should not be exposure to air and avoid stress.

Applications:

Boron nitride nanoparticles is a super hard material. It has applications in subsurface investigation, oil drilling, and high-speed cutting tools. It is used as a metal forming and metal drawing lubricant release agent. It can be pressed into different shapes and used as high voltage, high temperature, insulation,and cooling components. It is used in transistors, plasma arc's insulators, high-voltage high frequency electricity, semi-conducting solid phase admixtures, high-frequency induction furnace materials,  atom reactor's structure materials, preventing neutron radiation's packing materials, automatic welding high-temperature coating, radar antenna's mediums, radar's pass box, and rocket engine's components. Boron nitride nanoparticles is also used as a catalyst for high temperature and high pressure treatments. It is used as a composite for ceramics, as thermally conductive filler for polymers, and as high temperature lubricant. It has also applications in the aerospace industry. It is used in heat shielding materials.
Boron Nitride (BN) Nanopowder
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Boron Nitride (BN) Nanopowder/Nanoparticles, Purity: 99.85+%, Size: 65-75 nm, Hexagonal

Price range: $36.00 through $1,295.00
Select options This product has multiple variants. The options may be chosen on the product page
5 grams/32 € 25 grams/80 € 100 grams/202 € 500 grams/666 € 1000 grams/1142 €
Please contact us for quotes on larger quantities !!!

Boron Nitride (BN) Nanopowder/Nanoparticles

Purity: 99.85+%, Size: 65-75 nm, Hexagona

 

Storage Condition:

Boron nitride nanoparticles should be sealed in vacuum and stored in cool and dry room. It should not be exposure to air and avoid stress.

Applications:

Boron nitride nanoparticles is a super hard material. It has applications in subsurface investigation, oil drilling, and high-speed cutting tools. It is used as a metal forming and metal drawing lubricant release agent. It can be pressed into different shapes and used as high voltage, high temperature, insulation,and cooling components. It is used in transistors, plasma arc's insulators, high-voltage high frequency electricity, semi-conducting solid phase admixtures, high-frequency induction furnace materials,  atom reactor's structure materials, preventing neutron radiation's packing materials, automatic welding high-temperature coating, radar antenna's mediums, radar's pass box, and rocket engine's components. Boron nitride nanoparticles is also used as a catalyst for high temperature and high pressure treatments. It is used as a composite for ceramics, as thermally conductive filler for polymers, and as high temperature lubricant. It has also applications in the aerospace industry. It is used in heat shielding materials.
Boron Nitride (BN) Sputtering Target
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Boron Nitride (BN) Sputtering Target

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Price range: $288.00 through $852.00
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Product 

 Boron Nitride (BN) Sputtering Target

CAS No.

10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

~2,973 °C

Boiling Point

N/A

Density

  ~2.1–3.5 g/cm³

Product Codes

NCZ-1333K
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125”

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$319.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 1'', Thickness: 0.125''
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.125”

$367.00
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Product 

 Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 1'', Thickness: 0.125''

CAS No.
 10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

 ~2973 °C

Boiling Point

N/A

Density

 ~2.1 g/cm³

Product Codes

NCZ-2375K
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250”

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$354.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 1'', Thickness: 0.250''
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 1”, Thickness: 0.250”

$408.00
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Product 

 Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 1'', Thickness: 0.250''

CAS No.
 10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

 ~2973 °C

Boiling Point

N/A

Density

 ~2.1 g/cm³

Product Codes

NCZ-2374K
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125”

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$396.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation.

In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 2'', Thickness: 0.125''
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.125”

$457.00
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Product 

 Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 2'', Thickness: 0.125''

CAS No.
 10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

 ~2973 °C

Boiling Point

N/A

Density

 ~2.1 g/cm³

Product Codes

NCZ-2373K
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250”

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$496.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 2'', Thickness: 0.250''
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 2”, Thickness: 0.250”

$574.00
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Product 

 Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 2'', Thickness: 0.250''

CAS No.
 10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

 ~2973 °C

Boiling Point

N/A

Density

 ~2.1 g/cm³

Product Codes

NCZ-2372K
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125”

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$481.00
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Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 3'', Thickness: 0.125''
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.125”

$556.00
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Product 

 Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 3'', Thickness: 0.125''

CAS No.
 10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

 ~2973 °C

Boiling Point

N/A

Density

 ~2.1 g/cm³

Product Codes

NCZ-2371K
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250”

, , ,
$592.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 3'', Thickness: 0.250''
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 3”, Thickness: 0.250”

$686.00
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Product 

 Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 3'', Thickness: 0.250''

CAS No.
 10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

 ~2973 °C

Boiling Point

N/A

Density

 ~2.1 g/cm³

Product Codes

NCZ-2370K
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125”

, , ,
$510.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 4'', Thickness: 0.125''
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.125”

$590.00
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Product 

 Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 4'', Thickness: 0.125''

CAS No.
 10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

 ~2973 °C

Boiling Point

N/A

Density

 ~2.1 g/cm³

Product Codes

NCZ-2369K
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250”

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$560.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 4'', Thickness: 0.250''
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 4”, Thickness: 0.250”

$645.00
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Product 

 Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 4'', Thickness: 0.250''

CAS No.
 10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

 ~2973 °C

Boiling Point

N/A

Density

 ~2.1 g/cm³

Product Codes

NCZ-2368K
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.125”

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$650.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 6'', Thickness: 0.125''
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.125”

$749.00
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Product 

 Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 6'', Thickness: 0.125''

CAS No.
 10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

 ~2973 °C

Boiling Point

N/A

Density

 ~2.1 g/cm³

Product Codes

NCZ-2367K
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.250”

, , ,
$750.00
Add to cart

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 6'', Thickness: 0.250''
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 6”, Thickness: 0.250”

$866.00
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Product 

 Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 6'', Thickness: 0.250''

CAS No.
 10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

 ~2973 °C

Boiling Point

N/A

Density

 ~2.1 g/cm³

Product Codes

NCZ-2366K
Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 8'', Thickness: 0.125''
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 8”, Thickness: 0.125”

$1,562.00
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Product 

 Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 8'', Thickness: 0.125''

CAS No.
 10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

 ~2973 °C

Boiling Point

N/A

Density

 ~2.1 g/cm³

Product Codes

NCZ-2365K
Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 8'', Thickness: 0.250''
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Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 8”, Thickness: 0.250”

$1,709.00
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Product 

 Boron Nitride (BN) Sputtering Targets, Purity: 99.5%, Size: 8'', Thickness: 0.250''

CAS No.
12058-85-6

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 157.93 g/mol

Melting Point

 ~1400 °C (decomposes)

Boiling Point

N/A

Density

 ~4.3 - 4.7 g/cm³ (varies with form)

Product Codes

NCZ-2364K
Boron nitride flake(D=10μm, T=50nm) (843516)
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Boron nitride flake(D=10μm, T=50nm) (843516)

$341.00
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Boron nitride flake(D=10μm, T=50nm) (843516)

Diameter 10μm Thickness 50nm
Product Codes- NCZ-2768K
Boron nitride nanoparticles
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Boron nitride nanoparticles

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Boron nitride nanoparticles

Boron nitride nanopowder

Nano Boron nitride powder

MF: BN
Chemical Name: Boron nitride nanoparticles
Purity: > 99.99%
APS: 50 nm (Size Customization possible)
Form: Nanopowder
Product Number: #NCZ1001
CAS Number 10043-11-5
Note: We can supply different size products of microparticles and Nanoparticles Size range powder according to the client’s requirements.
Boron Nitride Nanoparticles/ Nanopowder (BN, Hexagonal, 99.5%,
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Boron Nitride Nanoparticles/ Nanopowder (BN, Hexagonal, 99.5%, <100nm)

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Price range: $151.00 through $387.00
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$151/25g
$387/100g

Product 

 Boron Nitride Nanoparticles/ Nanopowder (BN, Hexagonal, 99.5%, <100nm)

CAS No.
10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

<100nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

>2,973 °C (sublimes without melting)

Boiling Point

Sublimes at ~2,973 °C

Density

 ~2.1–2.3 g/cm³

Product Codes

NCZ-1103K
Boron Nitride Nanoparticles/ Nanopowder (BN, Hexagonal, 99.5%, 500nm)
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Boron Nitride Nanoparticles/ Nanopowder (BN, Hexagonal, 99.5%, <100nm) (Copy)

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Price range: $87.00 through $340.00
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$87/100g
$184/500g
$340/kg

Product 

 Boron Nitride Nanoparticles/ Nanopowder (BN, Hexagonal, 99.5%, 500nm)

CAS No.
10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

500nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

>2,973 °C (sublimes without melting)

Boiling Point

Sublimes at ~2,973 °C

Density

 ~2.1–2.3 g/cm³

Product Codes

NCZ-1104K
Boron Nitride Powder (BN, hexagonal, 99+%, 3~4um)
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Boron Nitride Powder (BN, hexagonal, 99+%, 3~4um)

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Price range: $76.00 through $213.00
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$76/100g
$213/500g

Product 

 Boron Nitride Powder (BN, hexagonal, 99+%, 3~4um)

CAS No.
10043-11-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 3~4um (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 24.82 g/mol

Melting Point

>2,973 °C (sublimes without melting)

Boiling Point

Sublimes at ~2,973 °C

Density

 ~2.1–2.3 g/cm³

Product Codes

NCZ-1104K
Boron nitride(>99.3%, 6-55μm) (355673)
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Boron nitride(>99.3%, 6-55μm) (355673)

$240.00
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Boron nitride(>99.3%, 6-55μm) (355673)
Grade BN (%) B2O3 (%) C (%) Total oxygen (%) Si, Al, Ca, Cu, K, Fe, Na, Ni, Cr (ppm) D50(μm) BET(m2/g) Tap Density(g/cm3)
TW06 >99.3 <0.3 <0.04 <0.6 <10 each 6-8 4-8 0.40-0.60
TW10 >99.5 <0.2 <0.04 <0.5 <10 each 9-12 4-8 0.35-0.50
TW15 >99.5 <0.2 <0.04 <0.5 <10 each 13-17 3-6 0.35-0.50
TW20 >99.5 <0.2 <0.04 <0.5 <10 each 17-21 3-6 0.35-0.50
TW50 >99.5 <0.2 <0.04 <0.5 <10 each 45-55 3-6 0.35-0.50
Product Codes- NCZ-2766K
Boron nitride(High density) (456673)
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Boron nitride(High density) (456673)

$345.00
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Boron nitride(High density) (456673)
ITEM TESTING
Purity(%) 99.4
B2O3(%) 0.1604
Total O(%) 0.47798
BET(m2/g) 2.71
Tap density(g/cm3) 0.904
Particle Size(mesh) 30-200
Oil absorption(%) 86.27
C(%) 0.0092
Product Codes- NCZ-2767K
Boron Oxide (B2O3) Nanopowder
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Boron Oxide (B2O3) Nanopowder/Nanoparticles, Purity: 99.95 %, Size: 50 nm

Price range: $278.00 through $3,957.00
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25 grams/245 €                       
100 grams/490 €                     
500 grams/1960 €                    
1000 grams/3480 €
Please contact us for quotes on larger quantities !!!              

Boron Oxide (B2O3) Nanopowder/Nanoparticles

Purity: 99.95 %, Size: 50 nm

Boron Oxide Nanoparticles
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Boron Oxide Nanoparticles

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Boron Oxide Nanopowder

Boron Oxide Nanoparticles

Nano Boron Oxide Powder

MF: B2O3
Chemical Name:
Purity > 99.9%
APS: 50 nm (Size Customization possible)
Form Nanopowder
Product Number: #NCZ1101
CAS Number 1303-86-2
Note: We can supply different size products of microparticles and Nanoparticles Size range powder according to client’s requirements.
Boron Oxide Nanoparticles/ Nanopowder ( B2O3, 99.5%, 80nm)
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Boron Oxide Nanoparticles/ Nanopowder ( B2O3, 99.5%, 80nm)

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Price range: $293.00 through $687.00
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$293/25g
$687/100g

Product 

 Boron Oxide Nanoparticles/ Nanopowder ( B2O3, 99.5%, 80nm)

CAS No.
1303-86-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

80nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 69.62 g/mol

Melting Point

~450 °C (softens and flows)

Boiling Point

~1,860 °C

Density

 ~2.46 g/cm³

Product Codes

NCZ-1101K
Boron Oxide Powder ( B2O3, 98%, -200mesh)
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Boron Oxide Powder ( B2O3, 98%, -200mesh)

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Price range: $55.00 through $165.00
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$55/100g
$165/500g

Product 

 Boron Oxide Powder ( B2O3, 98%, -200mesh)

CAS No.
1303-86-2

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

-200mesh (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 69.62 g/mol

Melting Point

~450 °C

Boiling Point

~1,860 °C

Density

 ~2.46 g/cm³

Product Codes

NCZ-1102K
Boron oxide, 99.9995%
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Boron oxide, 99.9995%

Price range: $26.00 through $180.00
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Product Boron oxide, 99.9995%
CAS No. 1303-86-2
Appearance White or transparent glassy
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient B₂O₃
Molecular Weight 69.62 g/mol
Melting Point 450 °C
Boiling Point N/A
Density 2.46 g/cm³
Product Codes NCZ-134R
 
Boron powder ( B, 99.99%, -325 mesh)
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Boron powder ( B, 99.99%, -325 mesh)

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Price range: $104.00 through $432.00
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$104/5g
$432/25g

Product 

Boron powder ( B, 99.99%, -325 mesh)

CAS No.
7440-42-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

-325 mesh (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

10.81 g/mol

Melting Point

2076°C

Boiling Point

2808 °C

Density

19.32 g/cm³

Product Codes

NCZ-1018K
Boron powder (B, 99.9%, 1~10 um)
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Boron powder (B, 99.9%, 1~10 um)

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Price range: $80.00 through $257.00
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$80/5g
$257/25g

Product 

Boron powder (B, 99.9%, 1~10 um)

CAS No.
7440-42-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

-325 mesh (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

10.81 g/mol

Melting Point

2076°C

Boiling Point

2808 °C

Density

19.32 g/cm³

Product Codes

NCZ-1019K
Boron Sputtering Target B
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Boron Sputtering Target B

Price range: $937.00 through $1,758.00
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Product Boron Sputtering Target B
CAS No. 7440-42-8
Appearance Solid, dark gray to black, hard and brittle material
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient B
Molecular Weight 10.81 g/mol
Melting Point N/A
Boiling Point N/A
Density 2.34 g/cm³
Product Codes NCZ-108H
Boron, B, 99.9% Powder, 100g
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Boron, B, 99.9% Powder, 100g

$132.00
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Product Boron, B, 99.9% Powder, 100g
CAS No. 7440-42-8
Appearance Brownish black fine
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 1-10µm (Size Can be customized),  Ask for other available size range.
Ingredient B
Molecular Weight 10.81 g/mol
Melting Point N/A
Boiling Point N/A
Density 2.34 g/cm³
Product Codes NCZ-300I
 
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Borophene Ethanol Dispersion 1 mg/mL

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Price range: $595.00 through $6,870.00
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DESCRIPTION Borophene is known as atomically thin, two-dimensional sheets of boron. Borophene has remarkable properties like, high electrical conductivity, flexibility
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Borosilicate Wafer, Size: 3”, 1-Side polished, Thickness: 150 ± 25 μm

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Price range: $67.00 through $684.00
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Boroslicate Wafer Size: 3”, 1-Side polished, Thickness: 150 ± 25 μm Technical Properties: Materials Borosilicate Size(inch) 3” Orientation Coating Thickness (μm)
Borosilicate Wafer
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Borosilicate Wafer, Size: 3”, 2-Side polished, Thickness: 500 ± 25 μm

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Price range: $58.00 through $648.00
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Boroslicate Wafer Size: 3”, 2-Side polished, Thickness: 500 ± 25 μm Technical Properties: Materials Borosilicate Size(inch) 3” Orientation Coating Thickness (μm)
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Borosilicate Wafer, Size: 4”, 1-Side polished, Thickness: 1000 ± 20 μm

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Price range: $64.00 through $738.00
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Boroslicate Wafer Size: 4”, 1-Side polished, Thickness: 1000 ± 20 μm Technical Properties: Materials Borosilicate Size (inch) 4” Orientation Coating
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Borosilicate Wafer, Size: 4”, 1-Side polished, Thickness: 700 ± 25 μm

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Price range: $62.00 through $708.00
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Boroslicate Wafer Size: 4”, 1-Side polished, Thickness: 700 ± 25 μm Technical Properties: Materials Borosilicate Size (inch) 4” Orientation Coating
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Borosilicate Wafer, Size: 4”, 2-Side polished, Thickness: 200 ± 20 μm

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Price range: $76.00 through $1,128.00
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Boroslicate Wafer Size: 4”, 2-Side polished, Thickness: 200 ± 20 μm Technical Properties: Materials Borosilicate Size (inch) 4” Orientation Coating
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Borosilicate Wafer, Size: 4”, 2-Side polished, Thickness: 500 ± 20 μm

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Price range: $74.00 through $1,098.00
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Boroslicate Wafer Size: 4”, 2-Side polished, Thickness: 500 ± 20 Technical Properties: Materials Borosilicate Size (inch) 4” Orientation Coating Thickness (μm)
Borosilicate Wafer
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Borosilicate Wafer, Size: 4”, 2-Side polished, Thickness: 500 ± 25 μm

Price range: $72.45 through $932.40
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Please contact us for quotes on larger quantities !!! Boroslicate Wafer Size: 4”, 2-Side polished, Thickness: 500 ± 25 μm Technical
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Borosilicate Wafer, Size: 4”, 2-Side polished, Thickness: 700 ± 20 μm

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Price range: $70.00 through $978.00
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Boroslicate Wafer Size: 4”, 2-Side polished, Thickness: 700 ± 20 μm Technical Properties: Materials Borosilicate Size (inch) 4” Orientation Coating
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Borosilicate Wafer, Size: 6”, 1-Side polished, Thickness: 700 ± 25 μm

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Price range: $79.00 through $1,188.00
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Boroslicate Wafer Size: 6”, 1-Side polished, Thickness: 700 ± 25 μm Technical Properties: Materials Borosilicate Size (inch) 6” Orientation Coating
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Borosilicate Wafer, Size: 6”, 2- Side polished, Thickness: 1100 ± 20 μm

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Price range: $82.00 through $1,278.00
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Boroslicate Wafer Size: 6”, 2- Side polished, Thickness: 1100 ± 20 μm Technical Properties: Materials Borosilicate Size (inch) 6” Orientation
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Borosilicate Wafer, Size: 6”, 2-Side polished, Thickness: 700 ± 20 μm

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Price range: $81.00 through $1,188.00
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Boroslicate Wafer Size: 6”, 2-Side polished, Thickness: 700 ± 20 μm Technical Properties: Materials Borosilicate Size (inch) 6” Orientation Coating
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Borosilicate Wafer, Size: 8”, 2-Side Polished, Thickness: 1250 ± 25 μm

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Price range: $121.00 through $2,238.00
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Borosilicate Wafer Size: 8”, 2- Side Polished, Thickness: 1250 ± 25 μm Technical Properties: Materials Borosilicate Size (inch) 8” Orientation
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C-NERGY SUPER C45 Conductive Carbon Black (set: 80 g)

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Price range: $30.00 through $557.00
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Applications:

C-NERGY SUPER C45 Conductive Carbon Black as Conductive Additive for Lithium-Ion Batteries 80g/bag - EQ-Lib-SuperC45
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C-NERGY SUPER C45 Conductive Carbon Black (set: 80 g)

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Price range: $30.00 through $557.00
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Applications:

C-NERGY SUPER C45 Conductive Carbon Black as Conductive Additive for Lithium-Ion Batteries 80g/bag - EQ-Lib-SuperC45
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C-NERGY SUPER C45 Conductive Carbon Black (set: 80 g)

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Price range: $30.00 through $557.00
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Applications:

C-NERGY SUPER C45 Conductive Carbon Black as Conductive Additive for Lithium-Ion Batteries 80g/bag - EQ-Lib-SuperC45