Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250”

$622.00

Product 

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 2'', Thickness: 0.250''

CAS No.

 1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

101.96 g/mol

Melting Point

~2,072 °C

Boiling Point

~2,977 °C

Density

~3.97–3.98 g/cm³

Product Codes

NCZ-2542K

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125”

$630.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

With the chemical formula Al2O3, aluminum oxide is a compound made of aluminum and oxygen.

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125”

$732.00

Product 

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 3'', Thickness: 0.125''

CAS No.

 1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

101.96 g/mol

Melting Point

~2,072 °C

Boiling Point

~2,977 °C

Density

~3.97–3.98 g/cm³

Product Codes

NCZ-2540K

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250”

$693.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

With the chemical formula Al2O3, aluminum oxide is a compound made of aluminum and oxygen.

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250”

$806.00

Product 

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 3'', Thickness: 0.250''

CAS No.

 1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

101.96 g/mol

Melting Point

~2,072 °C

Boiling Point

~2,977 °C

Density

~3.97–3.98 g/cm³

Product Codes

NCZ-2538K

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125”

$936.00

 Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

With the chemical formula Al2O3, aluminum oxide is a compound made of aluminum and oxygen. Because of its high melting point, Al2O3 is useful as a refractory material and as an abrasive due to its hardness, as well as for the production of aluminum metal. Thin coatings of aluminum oxide that can

be acquired using aluminum oxide Because of their exceptional qualities, including great resistance to abrasion and corrosion, transparency, mechanical strength and hardness, as well as insulating and optical qualities, sputtering targets are widely employed in a variety of mechanical, optical, and microelectronic applications. All of these characteristics of aluminum oxide film are dependent on several sputtering system parameters, including sputtering rate, target-to-substrate distance, reactive gas pressures, etc.

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125”

$1,091.00

Product 

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 4'', Thickness: 0.125''

CAS No.

 1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

101.96 g/mol

Melting Point

~2,072 °C

Boiling Point

~2,977 °C

Density

~3.97–3.98 g/cm³

Product Codes

NCZ-2536K

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250”

$949.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

With the chemical formula Al2O3, aluminum oxide is a compound made of aluminum and oxygen.

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250”

$1,106.00

Product 

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 4'', Thickness: 0.250''

CAS No.

 1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

101.96 g/mol

Melting Point

~2,072 °C

Boiling Point

~2,977 °C

Density

~3.97–3.98 g/cm³

Product Codes

NCZ-2534K

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.125”

$960.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance, the

It is possible to identify the target material and even detect incredibly tiny impurity amounts.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

With the chemical formula Al2O3, aluminum oxide is a compound made of aluminum and oxygen. Because of its high melting point, Al2O3 is useful as a refractory material and as an abrasive due to its hardness, as well as for the production of aluminum metal. Because of their superior properties, aluminum oxide thin films, which can be produced via aluminum oxide sputtering targets, are extensively employed in several mechanical, optical, and microelectronic applications.

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.125”

$1,119.00

Product 

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 6'', Thickness: 0.125''

CAS No.

 1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

101.96 g/mol

Melting Point

~2,072 °C

Boiling Point

~2,977 °C

Density

~3.97–3.98 g/cm³

Product Codes

NCZ-2532K

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.250”

$960.00
Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters, Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target. There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering. With the chemical formula Al2O3, aluminum oxide is a compound made of aluminum and oxygen. Because of its high melting point, Al2O3 is useful as a refractory material and as an abrasive due to its hardness, as well as for the production of aluminum metal.

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 6”, Thickness: 0.250”

$1,119.00

Product 

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 6'', Thickness: 0.250''

CAS No.

 1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

101.96 g/mol

Melting Point

~2,072 °C

Boiling Point

~2,977 °C

Density

~3.97–3.98 g/cm³

Product Codes

NCZ-2530K

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 8”, Thickness: 0.250”

$1,162.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance, the

It is possible to identify the target material and even detect incredibly tiny impurity amounts.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

With the chemical formula Al2O3, aluminum oxide is a compound made of aluminum and oxygen. Because of its high melting point, Al2O3 is useful as a refractory material and as an abrasive due to its hardness, as well as for the production of aluminum metal. Thin coatings of aluminum oxide that canbe acquired using aluminum oxide Because of their exceptional qualities, including great resistance to abrasion and corrosion, transparency, mechanical strength and hardness, as well as insulating and optical qualities, sputtering targets are widely employed in a variety of mechanical, optical, and microelectronic applications. All of these characteristics of aluminum oxide film are dependent on several sputtering system parameters, including sputtering rate, target-to-substrate distance, reactive gas pressures, etc.

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 8”, Thickness: 0.250”

$1,423.00

Product 

Aluminum Oxide (Al2O3) Sputtering Targets, Purity: 99.999%, Size: 8'', Thickness: 0.250''

CAS No.

 1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

101.96 g/mol

Melting Point

~2,072 °C

Boiling Point

~2,977 °C

Density

~3.97–3.98 g/cm³

Product Codes

NCZ-2527K

Aluminum Oxide Nanoparticles

Price range: $75.00 through $625.00
Select options This product has multiple variants. The options may be chosen on the product page

Aluminum Oxide Nanoparticles

MF: Al2O3, alpha
Chemical Name: Aluminum Oxide
Purity: > 99.99%
APS: 200 nm
Form: Nanopowder
Product Number: #NCZ2201
CAS Number 1344-28-1

Aluminum Oxide Nanoparticles

Note: We can supply different size products of microparticles and Nanoparticles Size range powder according to the client’s requirements.

Aluminum Oxide Nanoparticles/Nanopowder (alpha Al2O3, 99%, 150nm)

Price range: $62.00 through $165.00
Select options This product has multiple variants. The options may be chosen on the product page
$67/100g
$120/500g $170/1kg

Product 

Aluminum Oxide Nanoparticles/Nanopowder (alpha Al2O3, 99%, 150nm)

CAS No.

1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

150 nm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

101.96 g/mol

Melting Point

2,040 °C

Boiling Point

2,977 °C

Density

3.95 g/cm³

Product Codes

NCZ-1087K

Aluminum Oxide Powder (Alumina, alpha-Al2O3, 99.999%, 0.5-10 um)

Price range: $130.00 through $391.00
Select options This product has multiple variants. The options may be chosen on the product page
$135/100g
$282/500g $396/1kg

Product

Aluminum Oxide Powder (Alumina, alpha-Al2O3, 99.999%, 0.5-10 um)
CAS No. 1344-28-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

0.5–10 µm (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

101.96 g/mol

Melting Point

2,072°C

Boiling Point

2980 °C (5400 °F)

Density

3.60g/cm

Product Codes

NCZ-1087K

Aluminum oxide, 99.999%

Price range: $16.00 through $45.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Aluminum oxide, 99.999%
CAS No. 1344-28-1
Appearance White crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient Al₂O₃
Molecular Weight 101.96 g/mol
Melting Point N/A
Boiling Point N/A
Density 4.1 g/cm³
Product Codes NCZ-103R

Aluminum Powder (Al) 97+%, 1-2 microns

Price range: $75.00 through $255.00
Select options This product has multiple variants. The options may be chosen on the product page
$75/100g
$170/500g
$255/1kg

Product 

Aluminum Powder (Al) 97+%, 1-2 microns

CAS No.

24304-00-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

1-2 micron (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

40.982 g/mol

Melting Point

2200 °C

Boiling Point

2517 °C

Density

3.3 g/cm³

Product Codes

NCZ-1013K

Aluminum Silicon (Al/Si) Sputtering Target

Price range: $92.00 through $397.00
Select options This product has multiple variants. The options may be chosen on the product page

Product 

Aluminum Silicon (Al/Si) Sputtering Target

CAS No.

12004-15-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

 NA (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

~65–70 g/mol

Melting Point

~548 °C

Boiling Point

~2,400–2,550 °C

Density

~2.78 g/cm³

Product Codes

NCZ-1313K

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$125.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance, the

It is possible to identify the target material and even detect incredibly tiny impurity amounts.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$141.00

Product 

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.125''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 Al: 26.98 g/mol Si: 28.09 g/mol

Melting Point

 ~577–660 °C (depends on Si content)

Boiling Point

~2519 °C (approx.)

Density

~2.6–2.7 g/cm³

Product Codes

NCZ-2519K

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250”

$150.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250”

$170.00

Product 

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.250''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 Al: 26.98 g/mol Si: 28.09 g/mol

Melting Point

 ~577–660 °C (depends on Si content)

Boiling Point

~2519 °C (approx.)

Density

~2.6–2.7 g/cm³

Product Codes

NCZ-2518K

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125”

$130.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125”

$147.00

Product 

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 2'', Thickness: 0.125''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 Al: 26.98 g/mol Si: 28.09 g/mol

Melting Point

 ~577–660 °C (depends on Si content)

Boiling Point

~2519 °C (approx.)

Density

~2.6–2.7 g/cm³

Product Codes

NCZ-2517K

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250”

$184.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250”

$210.00

Product 

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 2'', Thickness: 0.250''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 Al: 26.98 g/mol Si: 28.09 g/mol

Melting Point

 ~577–660 °C (depends on Si content)

Boiling Point

~2519 °C (approx.)

Density

~2.6–2.7 g/cm³

Product Codes

NCZ-2516K

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125”

$156.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125”

$177.00

Product 

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 3'', Thickness: 0.125''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 Al: 26.98 g/mol Si: 28.09 g/mol

Melting Point

 ~577–660 °C (depends on Si content)

Boiling Point

~2519 °C (approx.)

Density

~2.6–2.7 g/cm³

Product Codes

NCZ-2515K

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250”

$176.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.250”

$201.00

Product 

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 3'', Thickness: 0.250''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 Al: 26.98 g/mol Si: 28.09 g/mol

Melting Point

 ~577–660 °C (depends on Si content)

Boiling Point

~2519 °C (approx.)

Density

~2.6–2.7 g/cm³

Product Codes

NCZ-2514K

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125”

$238.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125”

$273.00

Product 

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 4'', Thickness: 0.125''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 Al: 26.98 g/mol Si: 28.09 g/mol

Melting Point

 ~577–660 °C (depends on Si content)

Boiling Point

~2519 °C (approx.)

Density

~2.6–2.7 g/cm³

Product Codes

NCZ-2513K

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250”

$251.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target's assistance, the

It is possible to identify the target material and even detect incredibly tiny impurity amounts.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250”

$288.00

Product 

Aluminum Silicon (AlSi) Sputtering Targets, Purity: 99.999%, Size: 4'', Thickness: 0.250''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

 Depends on alloy ratio (Al = 26.98, Si = 28.09)

Melting Point

 ~577–660 °C (depends on Si content)

Boiling Point

~2519 °C (approx.)

Density

~2.6–2.7 g/cm³

Product Codes

NCZ-2512K

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$22.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum has a good strength to weight ratio. Aluminum plating is the best material to use on cars, trucks, and airplanes. Typically, aluminum

alloyed with silicon and copper, among other elements, to improve structural qualities and performance.

When compared to aluminum silicon alloys, aluminum silicon copper alloys are well known for their exceptionally high strength. Aluminum silicon copper sputtering targets are ideal for usage in the transportation and aerospace industries due to their exceptional strength.

Sputtering targets made of aluminum silicon copper have superior casting and machining properties. This alloy has excellent corrosion resistance and weldability, which make it ideal for use in gas and oil pans, engine parts, and other commercial applications.

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$25.00

Product 

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.125''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3 Copper: 7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

Weighted average depending on composition (example below)

Melting Point

 Approx. 570–660 °C

Boiling Point

 Approx. 2500–2650 °C

Density

~2.7 to 2.9 g/cm³

Product Codes

NCZ-2526K

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250”

$38.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum has a good strength to weight ratio. Aluminum plating is the best material to use on cars, trucks, and airplanes. Typically, aluminum

alloyed with silicon and copper, among other elements, to improve structural qualities and performance.

When compared to aluminum silicon alloys, aluminum silicon copper alloys are well known for their exceptionally high strength. Aluminum silicon copper sputtering targets are ideal for usage in the transportation and aerospace industries due to their exceptional strength.

Sputtering targets made of aluminum silicon copper have superior casting and machining properties. This alloy has excellent corrosion resistance and weldability, which make it ideal for use in gas and oil pans, engine parts, and other commercial applications.

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.250”

$39.00

Product 

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.250''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3 Copper: 7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

Weighted average depending on composition (example below)

Melting Point

 Approx. 570–660 °C

Boiling Point

 Approx. 2500–2650 °C

Density

~2.7 to 2.9 g/cm³

Product Codes

NCZ-2525K

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125”

$25.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation. In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. When the target shatters,

Mass spectrometry measures the concentration and identity of sputtered atoms. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum has a good strength to weight ratio. Aluminum plating is the best material to use on cars, trucks, and airplanes. To improve its structural qualities and overall performance, aluminum is typically alloyed with silicon and copper, among other elements.

When compared to aluminum silicon alloys, aluminum silicon copper alloys are well known for their exceptionally high strength. Aluminum silicon copper sputtering targets are ideal for usage in the transportation and aerospace industries due to their exceptional strength.

Sputtering targets made of aluminum silicon copper have superior casting and machining properties. This alloy has excellent corrosion resistance and weldability, which make it ideal for use in gas and oil pans, engine parts, and other commercial applications.

For semiconductor applications, aluminum silicon copper sputtering targets can also be employed. This alloy forms a homogeneous film due to its high purity.

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.125”

$24.00

Product 

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 2'', Thickness: 0.125''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3 Copper: 7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

Weighted average depending on composition (example below)

Melting Point

 Approx. 570–660 °C

Boiling Point

 Approx. 2500–2650 °C

Density

~2.7 to 2.9 g/cm³

Product Codes

NCZ-2524K

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250”

$31.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called "deposition made by sputter targets," which entails eroding material from a "target" source onto a "substrate" like a silicon wafer. Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice. By removing the target material through etching, sputter targets are also utilized for investigation.

In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. The target material's composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 2”, Thickness: 0.250”

$31.00

Product 

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 2'', Thickness: 0.250''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3 Copper: 7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

Weighted average depending on composition (example below)

Melting Point

 Approx. 570–660 °C

Boiling Point

 Approx. 2500–2650 °C

Density

~2.7 to 2.9 g/cm³

Product Codes

NCZ-2523K

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 3” , Thickness: 0.250”

$101.00

Product 

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 3'' , Thickness: 0.250''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3 Copper: 7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

Weighted average depending on composition (example below)

Melting Point

 Approx. 570–660 °C

Boiling Point

 Approx. 2500–2650 °C

Density

~2.7 to 2.9 g/cm³

Product Codes

NCZ-2522K

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 3”, Thickness: 0.125”

$87.00

Product 

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 3'', Thickness: 0.125''

CAS No.

— (alloy)

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

AlSiCu (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

~55 g/mol

Melting Point

~600–760 °C

Boiling Point

N/A

Density

 ~2.7 g/cm³

Product Codes

NCZ-1411K

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.125”

$106.00

Product 

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 4'', Thickness: 0.125''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3 Copper: 7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

Weighted average depending on composition (example below)

Melting Point

 Approx. 570–660 °C

Boiling Point

 Approx. 2500–2650 °C

Density

~2.7 to 2.9 g/cm³

Product Codes

NCZ-2521K

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 4”, Thickness: 0.250”

$100.00

Product 

Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 4'', Thickness: 0.250''

CAS No.

Aluminum: 7429-90-5 Silicon: 7440-21-3 Copper: 7440-50-8

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

N/A (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

Weighted average depending on composition (example below)

Melting Point

 Approx. 570–660 °C

Boiling Point

 Approx. 2500–2650 °C

Density

~2.7 to 2.9 g/cm³

Product Codes

NCZ-2520K

Aluminum Silicon Copper Sputtering Target AlSiCu

Price range: $125.00 through $289.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Aluminum Silicon Copper Sputtering Target AlSiCu
CAS No. 7429-90-5
Appearance Metallic, silvery-gray material
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient AlSiCu
Molecular Weight 28.28 g/mol
Melting Point N/A
Boiling Point N/A
Density 3.1 g/cm³
Product Codes NCZ-100H
 

Aluminum Silicon Sputtering Target AlSi

Price range: $207.00 through $385.00
Select options This product has multiple variants. The options may be chosen on the product page
Product

Aluminum Silicon Sputtering Target AlSi

CAS No. 11145-27-0
Appearance Silvery-white, metallic materials
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient AlSi
Molecular Weight 54.958 g/mol
Melting Point N/A
Boiling Point N/A
Density 2.6-2.7 g/cm³
Product Codes NCZ-101H

Aluminum Sputtering Target

Price range: $147.00 through $741.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Aluminum Sputtering Target
CAS No. 7429-90-5
Appearance Solid, metallic, silvery-white to gray
Purity ≥99%,  ≥99.9%,  ≥95% (Other purities are also available)
APS <100 µm (Size Can be customized),  Ask for other available size range.
Ingredient Al
Molecular Weight 26.98 g/mol
Melting Point 660.3 °C
Boiling Point 2,470 °C
Density 2.70 g/cm³
Product Codes NCZ-102H

Aluminum sulfate, 99.999%

Price range: $40.00 through $177.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Aluminum sulfate, 99.999%
CAS No. 10043-01-3
Appearance White crystalline
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient Al₂(SO₄)₃
Molecular Weight 342.15 g/mol
Melting Point N/A
Boiling Point N/A
Density 2.71 g/cm³
Product Codes NCZ-104R
 

Aluminum Tab for Pouch Li-ion Cell, Width: 4 mm, Length: 57 mm

Price range: $160.00 through $594.00
Select options This product has multiple variants. The options may be chosen on the product page
100 pcs/128 € 250 pcs/265 € 500 pcs/475 €  Please contact us for quotes on larger quantities !!! 

Aluminum Tab for Pouch Li-ion Cell

Width: 4 mm, Length: 57 mm

Technical Properties:

Purity Aluminum 99.99%
Length 57 mm
Width 4 mm
Thickness 0.10 mm
Max. Loading Current 3A
Net Weight 60 mg/pcs

Applications:

4 mm Width Aluminum Tab as Positive Terminal for Pouch Li-ion Cell    

Aluminum TMHD

Price range: $25.00 through $155.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Aluminum TMHD
CAS No. 14319-08-5
Appearance White crystalline solid
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS N/A
Ingredient C₃₃H₆₃AlO₆
Molecular Weight 576.78 g/mol
Melting Point 264–267 °C
Boiling Point N/A
Density N/A
Product Codes NCZ-336R

Aluminum Zinc Oxide Micropowder (AZO, D50: 0.5~1.5um)

Price range: $82.00 through $323.00
Select options This product has multiple variants. The options may be chosen on the product page
$82/100g
$201/500g
$323/kg

Product 

Aluminum Zinc Oxide Micropowder (AZO, D50: 0.5~1.5um)

CAS No.

952185-00-1

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

0.5~1.5um (Size Can be customized), Ask for other available size ranges.

Ingredient

N/A

Molecular Weight

~80.6 g/mol

Melting Point

1,900–2,000 °C

Boiling Point

 2,360 °C

Density

5.5 to 5.6  g/cm³

Product Codes

NCZ-1094K

Aluminum-Silicon (AlSi) Alloy Powder, Al85Si15, APS: 50nm, Purity: 99.9%

Price range: $145.00 through $2,214.00
Select options This product has multiple variants. The options may be chosen on the product page
Aluminum-Silicon (AlSi) Alloy Powder, Al85Si15, APS: 50nm, Purity: 99.9% Performance characteristics Nano Al-Si alloy powder is prepared by gas phase CVD method, the alloy ratio can be adjusted appropriately, the purity is high, the particle size is small, the distribution is uniform, the surface area is large, the loose density is small, not easy to crack, easy to disperse, large industrial output, easy to disperse the alloy Among the materials and ceramic materials, the specific gravity is small, the weight is light, the thermal conductivity is good, the coefficient of expansion is small, the wear resistance is good, the volume stability is good, and it has certain room temperature and high temperature mechanical properties. Product parameter
APS 50 nm
Purity 99.9 %
BET Surface Area 29.64 m2/g
Theoritical density 2.684 g/cm3
Bulk density 0.896 g/cm3
Melting Point 400 °C
Boiling Point 1100 °C
Shape Spherical
Color Black Powder
Manufacturing Method CVD

Aluminum-Silicon Alloy Powder (Al-Si, 1-2 micron)

Price range: $115.00 through $395.00
Select options This product has multiple variants. The options may be chosen on the product page
$115/100g
$260/500g
$395/1000g

Product 

Aluminum-Silicon Alloy Powder (Al-Si, 1-2 micron)

CAS No.

24304-00-5

Appearance

Powder

Purity

≥99%,  ≥99.9%,  ≥95%

(Other purities are also available)

APS

1-2 micron (Size Can be customized), Ask for other available size ranges.

Ingredient

AlN

Molecular Weight

40.982 g/mol

Melting Point

2200 °C

Boiling Point

2517 °C

Density

3.3 g/cm³

Product Codes

NCZ-1014K

Aminated Graphene Quantum Dots Solution, 1mg/mL

Price range: $289.00 through $489.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Aminated Graphene Quantum Dots Solution, 1mg/mL
CAS No. N/A
Appearance Clear to light yellow or pale brown
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 2-10nm (Size Can be customized),  Ask for other available size range.
Ingredient C₁₀₀H₄₀N₅O₁₀
Molecular Weight N/A
Melting Point N/A
Boiling Point N/A
Density N/A
Product Codes NCZ-284I
 

Aminated Solid Silica Nanoparticles Powder, 20-900 nm

$517.00
Select options This product has multiple variants. The options may be chosen on the product page
Product Aminated Solid Silica Nanoparticles Powder, 20-900 nm
CAS No. 7440-21-3
Appearance Fine white
Purity ≥99%,  ≥99.9%,  ≥95%(Other purities are also available)
APS 20-900nm (Size Can be customized),  Ask for other available size range.
Ingredient C₉H₂₃NO₃Si
Molecular Weight 221.37 g/mol
Melting Point N/A
Boiling Point N/A
Density 2 g/cm³
Product Codes NCZ-285I