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Product
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Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.125'' |
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CAS No.
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Aluminum: 7429-90-5
Silicon: 7440-21-3
Copper: 7440-50-8
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Appearance
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Powder
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Purity
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≥99%, ≥99.9%, ≥95%
(Other purities are also available)
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APS
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N/A (Size Can be customized), Ask for other available size ranges.
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Ingredient
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N/A
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Molecular Weight
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Weighted average depending on composition (example below) |
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Melting Point
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Approx. 570–660 °C |
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Boiling Point
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Approx. 2500–2650 °C
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Density
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~2.7 to 2.9 g/cm³ |
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Product Codes
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NCZ-2526K
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