Zinc (Zn) Sputtering Targets
Purity: 99.95%, Size: 3”, Thickness: 0.125”
Sputtering is a well-established technique that can deposit thin films made of a wide range of materials on a variety of shaped and sized substrates.
Sputter targets allow for reproducible processes that can be expanded from small-scale R&D initiatives. Sputter target processes can be modified to suit medium- to large-sized substrate surfaces in manufacturing batches. On the target, a chemical reaction may take place.
surface, during flight, or on the substrate, contingent upon the characteristics of the process. Sputter deposition is a complicated process due to its numerous characteristics, yet professionals have a great deal of control over the region’s growth and microstructure.