Tin (Sn) Sputtering Targets
Purity: 99.99%, Size: 1”, Thickness: 0.250”
Sputtering is a tried-and-true method that can deposit thin films made of a broad range of materials onto a variety of substrate sizes and forms.
Sputter target processes are reproducible and can be expanded from small-scale R&D initiatives. The sputter target process can be modified to accommodate production batches with medium-to large substrate areas. The process parameters determine whether the chemical reaction takes place on the substrate, in flight, or on the target surface. Although there are numerous variables in sputter deposition, this complexity gives specialists great control over the region’s development and microstructure.