Strontium Titanate (SrTiO3) Sputtering Targets
Purity: 99.9%, Size: 8”, Thickness: 0.250”
Deposition of thin films from a broad range of materials onto a variety of substrate shapes and sizes is possible with a well-established method called sputtering.
Larger research and development initiatives can benefit from the reproducible nature of the sputter target method. For production batches with medium-to-large substrate areas, the sputter target process can be modified. Depending on the process parameters, the chemical reaction may take place on the substrate, on the target surface, or during flight. Sputter deposition is a complicated process because of its various characteristics, yet professionals have a great deal of control over the region’s composition and growth.