Quartz Wafer
(ST-Cut), Size: 4”, 1-Side Polished, Thickness: 625 ± 25 μm
Technical Properties:
| Quality |
Prime |
| Materials |
Quartz |
| Size (inch) |
4” |
| Orientation |
(ST -Cut) |
| Coating |
|
| Thickness (μm) |
625 ± 25 |
| Doping |
|
| Resistivity (ohm.cm) |
|
| Polished |
One Side |
High working temperature, high corrosion resistivity, thermal conductivity and low dielectric loss are the specifications that make quartz wafers a good candidate for semiconductor, photomask, microwave filter and optical lense applications.
Since quartz is a monocrystalline material with numerous different crystal orientations, it can be supplied in different cut versions.
During this process high quality particles of quartz are positioned at the bottom of a vessel which is loaded with NaOH. Quartz starts to crystallize at around 400°C and between 1000 and 1500 bar pressure. This crystallization eventually creates monocrystals and may take even days. The generated quartz monocrystals are polished after being sliced into wafers and finally reveal Quartz 4”,(AT-Cut) Wafers.
Quartz 4”,(X-Cut) has high thermal conductivity, high anti-corrosion, feature of high working temperature and good optical transmittance. For all these reasons Quartz Wafer is appropriate for the production of optical lenses, photomasks, microwave filters, semiconductors and for optical fiber applications.
