Prime CZ-Si Wafer, Size: 4”, Orientation: (111), Phosphor Doped, Resistivity: 1-10 (ohm.cm), 1-Side Polished, Thickness: 525 ± 25 μm

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Description

Prime CZ-Si Wafer

Size: 4”, Orientation: (111), Phosphor Doped, 1-Side Polished

Technical Properties:

Quality Prime
Materials CZ-Si
Size (inch) 4”
Orientation (111)
Coating
Thickness (μm) 525 ± 25
Doping Phosphor
Resistivity (ohm.cm) 1-10
Polished One Side

One of the most prevalent elements in the crust of the earth is silicon. Silicon wafers are mostly used in technology and electronics. The surfaces of silicon wafers are extremely smooth and mirror-like. To get the maximum purity, the Czochralski process is used in its production. Silicon wafers can be doped with various compounds to adjust their purity based on the intended use. The electronic characteristics are greatly influenced by the type and quantity of dopants. Nitrogen, boron, indium, and gallium are a few of the dopants that can be employed during manufacture.

Semiconductors, microchips, integrated circuits, computers, cellphones, and other devices all use silicon wafers. The essential building block for semiconductor devices is silicon. A wafer is merely a very thin slice of semiconductor material that is positioned within and above microelectronic devices to serve as a substratum.

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Important Notes

  • Research Use Only: Nanochemazone materials are intended strictly for research and development purposes in laboratory and industrial settings.
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