Bismuth Ferrite (BiFeO3) Sputtering Targets
Purity: 99.9%, Size: 5”, Thickness: 0.125”
Sputtering is a well-established technique that can deposit thin films made of a wide range of materials on a variety of shaped and sized substrates.
Sputter targets allow for reproducible processes that can be expanded from small-scale R&D initiatives. The sputtering process
Targets can be modified to fit medium- to large-sized substrate regions in production batches. Depending on the process settings, the chemical reaction may take place on the substrate, in flight, or on the target surface. Sputter deposition is a complicated process due to its numerous characteristics, yet professionals have a great deal of control over the region’s growth and microstructure.