Applications of Sputtering Targets;

• Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering
  that involves eroding material from a “target” source onto a “substrate” such as  a silicon wafer.
• Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy
  is needed and selectivity is not a concern.
• Sputter targets is also used for analysis by etching away the target material.

One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered,
the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the
target material can be determined and even extremely low concentrations of impurities are detected.

Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and
chemical properties of airless bodies, such as asteroids and the Moon.

Aluminum which has the chemical symbol of Al, is a silvery white, soft, ductile metal that is the third most abundant element. Aluminum is notable due
to for its light weight, strength, durability and for its ability to resist corrosion. Aluminum forms an extremely thin but very strong layer of oxide film.
Aluminum has also high thermal and electrical conductivity.

Aluminum sputtering targets have a particularly fine-grained microstructure. This property of Aluminum sputtering targets ensures that you benefit from
uniform erosion and a low susceptibility to particle formation throughout the sputtering process.