Technical Properties:
| PURITY |
99.99 % |
| PARTICLE SIZE |
100 mesh |
| CAS |
7440-56-4 |
| DENSITY |
5.32 g/cm³ |
| BOILING POINT |
2830 °C |
| MELTING POINT |
937.4 °C |
| COEFF. OF EXPANSION @ 20ºC |
6.1 x 10⁻⁸ |
| ELECTRIC RESISTIVITY |
47 x 10⁻⁶ microhm-cm |
| CRYSTAL STRUCTURE |
Diamond |
| FORM |
Powder |
| APPLICATIONS |
Electronics Optoelectronics Semiconductors |
