Iron (Fe) Sputtering Targets
Purity: 99.95%, Size: 3”, Thickness: 0.125”
An established method for depositing thin films of a wide range of materials on a variety of sized and shaped substrates is sputtering.
Larger-scale R&D projects can benefit from reproducible methods made possible by sputter targets. In production batches, sputter target methods can be adjusted to accommodate medium- to large-sized substrate surfaces. The chemical reaction may occur on the substrate, in flight, or on the target surface, depending on the process parameters. Because of its many properties, sputter deposition is a complex process, but experts have a significant lot of control over the growth and microstructure of the region.