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View cart “Aluminum Nitride (AlN) Sputtering Targets, elastomer, Purity: 99.8%, Size: 1”, Thickness: 0.125”” has been added to your cart.
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HomeBISMUTH OXIDE SPUTTERING TARGETS2 Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125”
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Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 2'', Thickness: 0.250'' $585.00
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Bismuth Oxide (Bi2O3) Sputtering Targets, indium, Purity: 99.9%, Size: 3'', Thickness: 0.125'' $660.00

Bismuth Oxide (Bi2O3) Sputtering Targets, Purity: 99.9%, Size: 2”, Thickness: 0.125”

$585.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called “deposition made by sputter targets,” which entails eroding material from a “target” source onto a “substrate” like a silicon wafer.
Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice.
By removing the target material through etching, sputter targets are also utilized for investigation.
In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

The target material’s composition may be ascertained and even very low concentrations of contaminants can be found with the aid of the sputtering target.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Categories: 2, BISMUTH OXIDE SPUTTERING TARGETS, Sputtering Targets Names A - C
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Bismuth Oxide (Bi2O3) Sputtering Targets

Purity: 99.9%, Size: 2”, Thickness: 0.125”

Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes. The process with sputter targets is repeatable and can be scaled up from small research and development projects. The proses with sputter targets can be adapted to the production batches involving medium to large substrate areas. The chemical reaction can occur on the target surface, in-flight or on the substrate depending on the process parameters. The many parameters make sputter deposition a complex process but allow experts a large degree of control over the growth and microstructure of the area.

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