Bismuth Oxide (Bi2O3) Sputtering Targets
Purity: 99.9%, Size: 2”, Thickness: 0.125”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes. The process with sputter targets is repeatable and can be scaled up from small research and development projects. The proses with sputter targets can be adapted to the production batches involving medium to large substrate areas. The chemical reaction can occur on the target surface, in-flight or on the substrate depending on the process parameters. The many parameters make sputter deposition a complex process but allow experts a large degree of control over the growth and microstructure of the area.
