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HomeBISMUTH SPUTTERING TARGETS1 Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125”
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Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 1'', Thickness: 0.250'' $240.00
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Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 2'', Thickness: 0.250'' $260.00

Bismuth (Bi) Sputtering Targets, Purity: 99.999%, Size: 1”, Thickness: 0.125”

$225.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called “deposition made by sputter targets,” which entails eroding material from a “target” source onto a “substrate” like a silicon wafer.
Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice.
By removing the target material through etching, sputter targets are also utilized for investigation.
In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered. With the sputtering target’s assistance, the

Even incredibly low amounts of contaminants are recognized, and the target material can be identified.

Applications for sputtering targets are also found in space. One type of space weathering is sputtering, which modifies the chemical and physical characteristics of airless worlds like the Moon and asteroids.

The silvery metal bismuth has a hint of pink and is fragile. It is stable in both water and air. Even though bismuth has bad thermal and electrical properties, it is used to make fusible alloys, a class of materials with low melting points that are useful for a variety of products, such as thermal fuses and solders. Because pure bismuth absorbs gamma rays highly, it can be used as a window or filter for these at the same time allowing neutrons to flow through.

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Categories: 1, BISMUTH SPUTTERING TARGETS, Sputtering Targets, Sputtering Targets Names A - C
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Description

Bismuth (Bi) Sputtering Targets

Purity: 99.999%, Size: 1”, Thickness: 0.125”

Sputtering is a well-established technique that can deposit thin films made of a wide range of materials on a variety of shaped and sized substrates.
Sputter targets allow for reproducible processes that can be expanded from small-scale R&D initiatives. Sputter target processes can be modified to suit medium- to large-sized substrate surfaces in manufacturing batches. Depending on the process settings, the chemical reaction may take place on the substrate, in flight, or on the target surface. Sputter deposition is a complicated process due to its numerous characteristics, yet professionals have a great deal of control over the region’s growth and microstructure.

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