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HomeSputtering TargetsSPUTTERING TARGETS NAMES D - MMAGNESIUM SPUTTERING TARGETS1 Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125”
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Magnesium (Mg) Sputtering Targets, Purity: 99.98%, Size: 2'', Thickness: 0.250'' $206.00

Magnesium (Mg) Sputtering Targets, Purity: 99.95%, Size: 1”, Thickness: 0.125”

$90.00

Applications of Sputtering Targets;

Film deposition is accomplished using sputtering targets. A technique for sputtering thin films is called “deposition made by sputter targets,” which entails eroding material from a “target” source onto a “substrate” like a silicon wafer.
Etching of the target is done using semiconductor sputtering targets. When selectivity is not an issue and a high degree of etching anisotropy is required, sputter etching is the method of choice.
By removing the target material through etching, sputter targets are also utilized for investigation.
In secondary ion spectroscopy (SIMS), one example is when the target material is sputtered at a steady pace. Mass spectrometry is used to quantify the concentration and identity of spewed atoms as the target is sputtered.

By helping of the sputtering target, the composition of the target material may be evaluated and even extremely tiny amounts of contaminants are recognized.

There is also an application area for sputtering targets in space. One type of space weathering that alters the chemical and physical characteristics of airless worlds like the Moon and asteroids is sputtering.

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Magnesium (Mg) Sputtering Targets

Purity: 99.95%, Size: 1”, Thickness: 0.125”

Sputtering is a well-established technique that can deposit thin films made of a wide range of materials on a variety of shaped and sized substrates.
Sputter targets allow for reproducible processes that can be expanded from small-scale R&D initiatives. Sputter target processes can be modified to suit medium- to large-sized substrate surfaces in manufacturing batches. Depending on the process settings, the chemical reaction may take place on the substrate, in flight, or on the target surface. Sputter deposition is a complicated process due to its numerous characteristics, yet professionals have a great deal of control over the region’s growth and microstructure.

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